公开(公告)号：US20190276931A1

公开(公告)日：2019-09-12

申请号：US16296718

申请日：2019-03-08

Applicant: APPLIED MATERIALS, INC.

Inventor： Bencherki Mebarki ,  Anantha K. Subramani ,  Joung Joo Lee ,  Farzad Houshmand ,  Kelvin Chan ,  Kenneth Starks ,  Xianmin Tang

IPC: C23C14/54 ,  H01L21/02 ,  H01L21/285 ,  C23C14/50 ,  C23C14/34

Abstract: Methods and apparatus for physical vapor deposition are provided herein. In some embodiments, an apparatus for physical vapor deposition (PVD) includes: a linear PVD source to provide a stream of material flux comprising material to be deposited on a substrate; and a substrate support having a support surface to support the substrate at a non-perpendicular angle to the linear PVD source, wherein the substrate support and linear PVD source are movable with respect to each other along an axis that is perpendicular to a plane of the support surface of the substrate support sufficiently to cause the stream of material flux to move over a working surface of the substrate disposed on the substrate support during operation.