公开(公告)号：US20160033205A1

公开(公告)日：2016-02-04

申请号：US14504021

申请日：2014-10-01

Applicant: APPLIED MATERIALS, INC.

Inventor： KALLOL BERA ,  KIM VELLORE ,  ANDREW CONSTANT ,  JACOB NEWMAN ,  JEFFREY BLAHNIK ,  JASON SCHALLER ,  WILLIAM WEAVER ,  ROBERT VOPAT ,  BENJAMIN RIORDON

IPC: F28D9/00

CPC classification number: F28F3/12 ,  H01L21/67109 ,  H01L21/67303

Abstract: Embodiments of multi-substrate thermal management apparatus are provided herein. In some embodiments, a multi-substrate thermal management apparatus includes a plurality of plates vertically arranged above one another; a plurality of channels extending through each of the plurality of plates; a supply manifold including a supply channel coupled to the plurality of plates at first locations; and a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.

Abstract translation: 本发明提供了多基板热管理装置的实施例。 在一些实施例中，多基板热管理装置包括彼此垂直布置的多个板; 多个通道，其延伸穿过所述多个板中的每一个; 供应歧管，其包括在第一位置处联接到所述多个板的供应通道; 以及返回歧管，其包括在第二位置处经由多个腿联接到所述多个板的返回通道，其中所述供应和返回通道流体地联接到所述多个通道以使传热流体流过所述多个板。

公开(公告)号：US20190211442A1

公开(公告)日：2019-07-11

申请号：US16232496

申请日：2018-12-26

Applicant: APPLIED MATERIALS, INC.

Inventor： ALEXANDER LERNER ,  KIM VELLORE ,  AMI SADE ,  STEVEN SANSONI ,  ANDREW CONSTANT ,  KEVIN MORAES ,  ROEY SHAVIV ,  NIRANJAN KUMAR ,  JEFFREY BRODINE ,  MICHAEL KARAZIM

IPC: C23C14/50 ,  C23C14/24 ,  C23C14/04

CPC classification number: C23C14/50 ,  C23C14/042 ,  C23C14/24

Abstract: Substrate carrier apparatus having a hard mask are disclosed herein. In some embodiments, a substrate carrier apparatus includes a carrier body having a support surface to support a substrate; and a mask assembly disposed above the support surface. The mask assembly includes an annular frame disposed atop the support surface; and a hard mask coupled to and disposed within the annular frame above the support surface, wherein the hard mask includes one or more openings arranged in a predetermined pattern and disposed through the hard mask, and wherein the hard mask includes a plurality of spacer elements extending from a bottom surface of the hard mask.

公开(公告)号：US20240274414A1

公开(公告)日：2024-08-15

申请号：US18404391

申请日：2024-01-04

Applicant: Applied Materials, Inc.

Inventor： NEELA AYALASOMAYAJULA ,  KELVIN CHAN ,  VENUGOPAL VELLANKI ,  NIRANJANA BALESAN ,  ANDREW CONSTANT ,  NASREEN CHOPRA

IPC: H01J37/32 ,  G03F7/00

CPC classification number: H01J37/32862 ,  G03F7/70925 ,  H01J37/32449 ,  H01J2237/184

Abstract: Embodiments disclosed herein include a method of cleaning a chamber. In an embodiment, the method comprises flowing a first processing gas into the chamber, where the first processing gas reacts with a metal-organic compound in the chamber to form a first volatile compound. In an embodiment, the method further comprises flowing a second processing gas into the chamber, where the second processing gas reacts with a pure metal of the metal-organic compound to form a second volatile compound. In an embodiment, the method further comprises removing the first volatile compound and the second volatile compound from the chamber.