公开(公告)号：US20240274414A1

公开(公告)日：2024-08-15

申请号：US18404391

申请日：2024-01-04

Applicant: Applied Materials, Inc.

Inventor： NEELA AYALASOMAYAJULA ,  KELVIN CHAN ,  VENUGOPAL VELLANKI ,  NIRANJANA BALESAN ,  ANDREW CONSTANT ,  NASREEN CHOPRA

IPC: H01J37/32 ,  G03F7/00

CPC classification number: H01J37/32862 ,  G03F7/70925 ,  H01J37/32449 ,  H01J2237/184

Abstract: Embodiments disclosed herein include a method of cleaning a chamber. In an embodiment, the method comprises flowing a first processing gas into the chamber, where the first processing gas reacts with a metal-organic compound in the chamber to form a first volatile compound. In an embodiment, the method further comprises flowing a second processing gas into the chamber, where the second processing gas reacts with a pure metal of the metal-organic compound to form a second volatile compound. In an embodiment, the method further comprises removing the first volatile compound and the second volatile compound from the chamber.

公开(公告)号：US20240404861A1

公开(公告)日：2024-12-05

申请号：US18628136

申请日：2024-04-05

Applicant: Applied Materials, Inc.

Inventor： SUSHIM KOSHTI ,  VIJAY PARKHE ,  NITIN BHARADWAJ SATYAVOLU ,  VENUGOPAL VELLANKI ,  NIRANJANA BALESAN ,  ASHUTOSH SAWANT

IPC: H01L21/683 ,  C23C16/458 ,  H01J37/32 ,  H01L21/687

Abstract: Apparatuses for clamping a substrate on a mono-polar electrostatic chuck for deposition of photoresist films are disclosed. In an example, a lift-pin assembly includes a first metal spring, a first metal above and coupled to the first metal spring, a second metal spring above and coupled to the first metal, a second metal above and coupled to the second metal spring, and a ceramic above and coupled to the second metal.