公开(公告)号：US20240404861A1

公开(公告)日：2024-12-05

申请号：US18628136

申请日：2024-04-05

Applicant: Applied Materials, Inc.

Inventor： SUSHIM KOSHTI ,  VIJAY PARKHE ,  NITIN BHARADWAJ SATYAVOLU ,  VENUGOPAL VELLANKI ,  NIRANJANA BALESAN ,  ASHUTOSH SAWANT

IPC: H01L21/683 ,  C23C16/458 ,  H01J37/32 ,  H01L21/687

Abstract: Apparatuses for clamping a substrate on a mono-polar electrostatic chuck for deposition of photoresist films are disclosed. In an example, a lift-pin assembly includes a first metal spring, a first metal above and coupled to the first metal spring, a second metal spring above and coupled to the first metal, a second metal above and coupled to the second metal spring, and a ceramic above and coupled to the second metal.