ADAPTIVE PROCESSES FOR IMPROVING INTEGRITY OF SURFACES
    1.
    发明申请
    ADAPTIVE PROCESSES FOR IMPROVING INTEGRITY OF SURFACES 审中-公开
    改善表面完整性的自适应方法

    公开(公告)号:US20160029496A1

    公开(公告)日:2016-01-28

    申请号:US14872076

    申请日:2015-09-30

    Applicant: APPLE INC.

    CPC classification number: G06F1/1656

    Abstract: A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structured such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

    Abstract translation: 描述用于执行电子设备结构的局部校正动作的处理。 该结构可以包括被配置为接收另一结构化的配合表面,使得两个结构例如可以粘合在一起。 局部校正动作被配置成不改进配合表面,而且还防止电子设备内的光在电子设备的不期望的区域中逸出。 在一些实施例中,校正动作包括使用移除工具去除表面的识别部分。 在其他实施例中,校正动作包括使用不同的工具来添加表面的材料识别部分。 所识别的装置可以包括自动检查系统。

    LIQUID CONTACT INDICATOR
    3.
    发明申请

    公开(公告)号:US20170254760A1

    公开(公告)日:2017-09-07

    申请号:US15451296

    申请日:2017-03-06

    Applicant: Apple Inc.

    Abstract: An electronic device having an indication member for determining liquid exposure in an electronic device is disclosed. The indication member may include ink and a layer covering the ink. The layer may include a liquid-permeable layer that allows liquid to pass through the layer and contact the ink. In this regard, at least some of the ink may rise through the layer and to a top surface of the indication member. Although the ink may be exposed at the top surface, in some cases, the ink is visible or detectable when exposed to light from an ultraviolet light source. Also, the top surface may include a pattern or other indicia that is also visible or detectable when exposed to the light source. When the indication member is exposed to liquid, the pattern may be altered or disturbed in a location corresponding to an exposed portion of the indication member.

    THREE-DIMENSIONAL PRINTING PLASTIC ONTO METAL

    公开(公告)号:US20170087769A1

    公开(公告)日:2017-03-30

    申请号:US15271183

    申请日:2016-09-20

    Applicant: Apple Inc.

    CPC classification number: B33Y30/00 B29C64/124 B29L2031/34 B33Y10/00

    Abstract: A three-dimensional printing system includes a reservoir containing a UV curable resin therein, a UV light, an oxygen delivery system, and a movable platform having a build surface configured to support a three-dimensional printed part at a non-planar feature thereon. The bottom of the reservoir can be UV-transparent and oxygen permeable, so the resin is cured by UV light at the build surface or printing part, but not cured despite UV light at the oxygen rich region near the reservoir bottom. Non-planar features include recesses and/or protrusions at the build surface, which can help form backsides of printed parts. Metal parts can be fitted to non-planar features to have thin insulative three-dimensional layers printed thereto. Many identical non-planar features can be used to mass-produce identical printed parts, which can be for electronic devices.

    MICRO-PERFORATION OVERMOLDING GATE
    9.
    发明申请
    MICRO-PERFORATION OVERMOLDING GATE 有权
    微型门窗过压门

    公开(公告)号:US20160143168A1

    公开(公告)日:2016-05-19

    申请号:US14815376

    申请日:2015-07-31

    Applicant: Apple Inc.

    Abstract: An electronic device having protruding features and a method for molding the protruding features to the electronic device are described. The protruding features may be formed by a molding tool that releases a material that flows through several apertures of a substrate. Also, the molding tool is positioned with respect to the substrate such that the material from the molding tool flows from an interior region of the substrate to an exterior region of the substrate via the several apertures. Accordingly, each aperture extends from an opening of the interior region and to an opening of the exterior region of the substrate. In some cases, the apertures may include a conical shape. For example, the opening in the interior region may include a diameter greater than a diameter of the opening in the exterior region. In this manner, the material, when cured, is mechanically secured to the substrate.

    Abstract translation: 描述具有突出特征的电子设备和用于将突出特征模制到电子设备的方法。 突出特征可以通过模制工具形成,该模制工具释放流过基底的若干孔的材料。 此外,模制工具相对于基底定位,使得来自模制工具的材料经由多个孔从衬底的内部区域流动到衬底的外部区域。 因此,每个孔从内部区域的开口延伸到衬底的外部区域的开口。 在一些情况下,孔可以包括圆锥形。 例如,内部区域中的开口可以包括大于外部区域中的开口的直径的直径。 以这种方式,当固化时,材料机械地固定到基底上。

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