公开(公告)号：US20190220065A1

公开(公告)日：2019-07-18

申请号：US16248704

申请日：2019-01-15

Applicant: Apple Inc.

Inventor： Simon Regis Louis LANCASTER-LAROCQUE ,  Kent JOHNSTON ,  Michael MALONEY ,  John C. DIFONZO ,  Gurshan DEOL ,  Kamal H. HABBOUB ,  Keith J. HENDREN ,  Karan BIR ,  Steven J. OSBORNE ,  Christiaan A. LIGTENBERG

IPC: G06F1/16 ,  F16B21/20 ,  H01F7/02

CPC classification number: G06F1/1679 ,  F16B21/20 ,  G06F1/1616 ,  G06F1/1662 ,  G06F1/1681 ,  H01F7/0252

Abstract: This application relates to hidden fasteners within an electronic device. An electronic device can include a top portion and a base portion that includes a housing and a cover attached to the housing by at least one fastener that is not visible through an external surface of the cover. Each fastener includes a receiver housing that retrains spherical components and a pin that can be inserted into an opening in the receiver housing. The pin is retained in the receiver housing by a force imparted against a surface of the pin by the spherical components, which are biased towards an inner surface of the receiver housing sloped towards the opening. The pin can be released when an external magnetic field from a magnet placed proximate the bottom surface of the receiver housing retracts the spherical components away from the opening, thereby reducing the force against the surface of the pin.

公开(公告)号：US20160342179A1

公开(公告)日：2016-11-24

申请号：US15160054

申请日：2016-05-20

Applicant: Apple Inc.

Inventor： Steven J. OSBORNE ,  Joss N. GIDDINGS ,  Adam T. GARELLI ,  William F. LEGGETT ,  Sarah J. MONTPLAISIR ,  Eric T. CORRIVEAU ,  Tyler J. EWING

IPC: G06F1/16

CPC classification number: G06F1/16 ,  B23K1/0016 ,  B23K1/06 ,  B23K1/19 ,  B23K20/10 ,  B23K20/106 ,  B23K20/227 ,  B23K20/2275 ,  B23K20/233 ,  B23K20/2336 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/18 ,  G06F1/1633

Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Abstract translation: 公开了将电子设备的外壳中的结构特征结合在一起的技术。 结构特征可以被超声波焊接到外壳以提供结构支撑并在该装置内形成磁路。 此外，超声波焊接可以将各种特征粘合到外壳的内部区域，而不会在对应于各种特征的位置处留下标记或迹线到外壳的外部区域。 此外，一个或多个特征可以被驱动以抵靠外壳，以通过摩擦焊接来接合一个或多个特征。 此外，旋转摩擦焊接机可以将具有相对较小直径的特征以相对较高的速度旋转到外壳上，以将特征驱动到外壳中，并将该特征与外壳摩擦焊接。 此外，摩擦焊接在外部区域上不会留下任何外观的化妆品变形。