Integrated photonics device having integrated edge outcouplers

    公开(公告)号:US11960131B2

    公开(公告)日:2024-04-16

    申请号:US17575326

    申请日:2022-01-13

    Applicant: Apple Inc.

    Abstract: Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.

    Broadband Controllable Optical Phase Shifters

    公开(公告)号:US20240061280A1

    公开(公告)日:2024-02-22

    申请号:US18229872

    申请日:2023-08-03

    Applicant: Apple Inc.

    CPC classification number: G02F1/0134 G02F2201/063 G02F2203/05

    Abstract: Various embodiments disclosed herein describe optomechanical phase shifters. The optomechanical phase shifters may be configured with an asymmetry that improves the performance of the OM phase shifter as a function of wavelength. In some instances, the optomechanical phase shifter includes a section of a waveguide having an asymmetric cross-sectional shape. In other instances an optomechanical phase shifter is incorporated into a controllable optical switch, such that OM phase shifters may be actuated to selectively route light to different outputs of the controllable optical switch.

    Compact Optical Splitter
    3.
    发明公开

    公开(公告)号:US20230358964A1

    公开(公告)日:2023-11-09

    申请号:US18142729

    申请日:2023-05-03

    Applicant: Apple Inc.

    CPC classification number: G02B6/2804

    Abstract: Optical splitters and system and methods utilizing optical splitters are disclosed. The optical splitter may include an input waveguide, a free propagation region, and a plurality output waveguides. The output waveguides are connected to the free propagation region at a corresponding plurality of output ports that are positioned along a non-circular path. The output ports may be positioned such that the output waveguides have the same width.

    Integrated Photonics Device Having Integrated Edge Outcouplers

    公开(公告)号:US20220236503A1

    公开(公告)日:2022-07-28

    申请号:US17575326

    申请日:2022-01-13

    Applicant: Apple Inc.

    Abstract: Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.

    Efficient Pin Phase Shifters
    5.
    发明公开

    公开(公告)号:US20240280842A1

    公开(公告)日:2024-08-22

    申请号:US18424171

    申请日:2024-01-26

    Applicant: Apple Inc.

    CPC classification number: G02F1/025 G02B6/02 G02B6/12

    Abstract: Embodiments are directed to photonic integrated circuits that include a carrier-based phase shifter. The carrier-based phase shifter is configured as a PIN phase shifter with a waveguide formed from a strip extending from a slab waveguide. The PIN phase shifter includes a first set of doping regions positioned in a slab waveguide and a second set of doping regions positioned the strip. Each of the first set of doping regions has a first conductivity type, and each of the second set of doping regions has a second conductivity type that is different that the first conductivity type.

    Photonic Passive Delay Lines with Reduced Parasitic Losses

    公开(公告)号:US20240094468A1

    公开(公告)日:2024-03-21

    申请号:US18234562

    申请日:2023-08-16

    Applicant: Apple Inc.

    CPC classification number: G02B6/125

    Abstract: Various embodiments disclosed herein describe photonic passive delay lines that have a waveguide wound into a plurality of straight segments and bends. The photonic passive delay lines are configured to reduce losses from parasitic modes of light generated at the bends. Embodiments of the photonic passive delay lines vary the dimensions of the straight segments to provide different amounts of dephasing between a mode of input light received by the photonic passive delay line and one or more parasitic modes.

    Optical Splitters with Reflective Surfaces
    7.
    发明公开

    公开(公告)号:US20240103224A1

    公开(公告)日:2024-03-28

    申请号:US18230475

    申请日:2023-08-04

    Applicant: Apple Inc.

    CPC classification number: G02B6/2817

    Abstract: Configurations for an optical splitter that includes a continuous curved reflector and methods thereof are disclosed. The optical splitter includes an input waveguide, one or more continuous curved reflector, and multiple output waveguides. The one or more continuous curved reflector may direct light toward the output waveguides. The optical splitter may include a single continuous curved reflector, or may include multiple continuous curved reflectors. In other instances, an optical splitter may include a lensed reflector that includes a plurality of continuous curved segments.

    Interference Devices for Wavelength Locking

    公开(公告)号:US20230100317A1

    公开(公告)日:2023-03-30

    申请号:US17945862

    申请日:2022-09-15

    Applicant: Apple Inc.

    Abstract: Configurations for a modal interference device used for wavelength locking are disclosed. The modal interference device may be an interference device that includes an input waveguide, an interference waveguide, and an output waveguide. A fundamental mode of light may be launched into the input waveguide and the interference waveguide may receive the fundamental mode and generate a higher order mode of light, where the two modes of light may be superimposed while propagating through the interference waveguide. The two modes of light may be received at an output waveguide that collapses the two modes into a single mode and generates an output signal corresponding to the interference between the two modes of light. The output signal may be used to wavelength lock a measured wavelength to a target wavelength. The multiple output waveguides may produce output signals that have dead zones that do not align with one another for any wavelength in the wavelength range of interest.

    Integrated Photonics Device Having Integrated Edge Outcouplers

    公开(公告)号:US20210033805A1

    公开(公告)日:2021-02-04

    申请号:US16969034

    申请日:2019-02-13

    Applicant: Apple Inc.

    Abstract: Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.

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