公开(公告)号：US20240280767A1

公开(公告)日：2024-08-22

申请号：US18440193

申请日：2024-02-13

Applicant: Apple Inc.

Inventor： Jeremy D. Witmer ,  Jeffrey T. Hill ,  Yipin Wu ,  Zhechao Wang

IPC: G02B6/42

CPC classification number: G02B6/423

Abstract: An integrated photonic system including multiple photonic dies that are laterally aligned using contact between pairs of vertical surfaces. The vertical surfaces can be manufactured by defining, via photolithography processes for example, the shape of the vertical surfaces. Thereafter, the vertical surfaces can be aligned and engaged, thereby optically and mechanically intercoupling the multiple photonic dies.

公开(公告)号：US20240094468A1

公开(公告)日：2024-03-21

申请号：US18234562

申请日：2023-08-16

Applicant: Apple Inc.

Inventor： Jason S. Pelc ,  Yu Miao ,  Mark A. Arbore ,  Meng Huang ,  Zhechao Wang

IPC: G02B6/125

CPC classification number: G02B6/125

Abstract: Various embodiments disclosed herein describe photonic passive delay lines that have a waveguide wound into a plurality of straight segments and bends. The photonic passive delay lines are configured to reduce losses from parasitic modes of light generated at the bends. Embodiments of the photonic passive delay lines vary the dimensions of the straight segments to provide different amounts of dephasing between a mode of input light received by the photonic passive delay line and one or more parasitic modes.