公开(公告)号：US20210398940A1

公开(公告)日：2021-12-23

申请号：US16908928

申请日：2020-06-23

Applicant: Amkor Technology Singapore Holding Pte. Ltd.

Inventor： Min Ho Kim ,  Seok Ho Na ,  Dong Hyeon Park ,  Choong Hoe Kim ,  Woo Kyung Ju ,  Yun Seok Song ,  Dong Su Ryu

IPC: H01L23/00

Abstract: In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.

公开(公告)号：US20230411342A1

公开(公告)日：2023-12-21

申请号：US18240966

申请日：2023-08-31

Applicant: Amkor Technology Singapore Holding Pte. Ltd.

Inventor： Dong Hyeon Park ,  Min Ho Kim ,  Dong Su Ryu ,  Seok Ho Na ,  Choong Hoe Kim ,  Yun Seok Song ,  Woo Kyung Ju ,  Dong Joo Park

IPC: H01L23/00 ,  B23K1/005 ,  B23K26/067 ,  B23K26/06

CPC classification number: H01L24/75 ,  H01L24/81 ,  B23K1/0056 ,  B23K26/067 ,  B23K26/0604 ,  B23K2101/40

Abstract: In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.

公开(公告)号：US20210398936A1

公开(公告)日：2021-12-23

申请号：US17244463

申请日：2021-04-29

Applicant: Amkor Technology Singapore Holding Pte. Ltd.

Inventor： Dong Hyeon Park ,  Min Ho Kim ,  Dong Su Ryu ,  Seok Ho Na ,  Choong Hoe Kim ,  Yun Seok Song ,  Woo Kyung Ju

IPC: H01L23/00 ,  B23K26/18 ,  B23K1/005

Abstract: In one example, a system can comprise a laser assisted bonding (LAB) tool comprising a stage block and a laser source facing the stage block. The stage block can be configured to support a first substrate and a first electronic component coupled with the first substrate, the first electronic component comprising a first interconnect. The laser source can be configured to emit a first laser towards the stage block to induce a first heat on the first interconnect to bond the first interconnect with the first substrate. Other examples and related methods are also disclosed herein.

公开(公告)号：US20240069629A1

公开(公告)日：2024-02-29

申请号：US18238729

申请日：2023-08-28

Applicant: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.

Inventor： Tae Ho Yoon ,  Yang Gyoo Jung ,  Min Ho Kim ,  Youn Seok Song ,  Dong Soo Ryu ,  Choong Hoe Kim

IPC: G06F3/01 ,  G02B27/00 ,  G02B27/01 ,  G06F3/033 ,  G09G5/377 ,  G09G5/38

CPC classification number: G06F3/012 ,  G02B27/0093 ,  G02B27/0172 ,  G06F3/033 ,  G09G5/377 ,  G09G5/38 ,  G02B2027/0138 ,  G02B2027/014 ,  G09G2320/106 ,  G09G2354/00

Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

公开(公告)号：US11749637B2

公开(公告)日：2023-09-05

申请号：US16908928

申请日：2020-06-23

Applicant: Amkor Technology Singapore Holding Pte. Ltd.

Inventor： Min Ho Kim ,  Seok Ho Na ,  Dong Hyeon Park ,  Choong Hoe Kim ,  Woo Kyung Ju ,  Yun Seok Song ,  Dong Su Ryu

IPC: B23K26/50 ,  H01L23/00 ,  B23K101/40

CPC classification number: H01L24/81 ,  B23K26/50 ,  H01L24/75 ,  B23K2101/40 ,  H01L2224/75263 ,  H01L2224/81048 ,  H01L2224/81201 ,  H05K2201/068

Abstract: In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.

公开(公告)号：US11742216B2

公开(公告)日：2023-08-29

申请号：US17005021

申请日：2020-08-27

Applicant: Amkor Technology Singapore Holding Pte. Ltd.

Inventor： Tae Ho Yoon ,  Yang Gyoo Jung ,  Min Ho Kim ,  Youn Seok Song ,  Dong Soo Ryu ,  Choong Hoe Kim

IPC: H01L21/48 ,  H01L23/00 ,  G02B27/09 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00 ,  H01L21/60

CPC classification number: H01L21/4853 ,  G02B27/0927 ,  H01L24/75 ,  H01L24/81 ,  H01L23/3128 ,  H01L25/0657 ,  H01L25/50 ,  H01L2021/60112 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/75263 ,  H01L2224/81002 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/131 ,  H01L2924/014

Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

公开(公告)号：US20230088061A1

公开(公告)日：2023-03-23

申请号：US18071318

申请日：2022-11-29

Applicant: Amkor Technology Singapore Holding Pte. Ltd.

Inventor： Dong Hyeon Park ,  Min Ho Kim ,  Dong Su Ryu ,  Seok Ho Na ,  Choong Hoe Kim ,  Yun Seok Song ,  Woo Kyung Ju ,  Dong Joo Park

IPC: H01L23/00 ,  B23K1/005 ,  B23K26/067 ,  B23K26/06

Abstract: In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.