公开(公告)号：US20240069629A1

公开(公告)日：2024-02-29

申请号：US18238729

申请日：2023-08-28

申请人： AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.

发明人： Tae Ho Yoon ,  Yang Gyoo Jung ,  Min Ho Kim ,  Youn Seok Song ,  Dong Soo Ryu ,  Choong Hoe Kim

IPC分类号： G06F3/01 ,  G02B27/00 ,  G02B27/01 ,  G06F3/033 ,  G09G5/377 ,  G09G5/38

CPC分类号： G06F3/012 ,  G02B27/0093 ,  G02B27/0172 ,  G06F3/033 ,  G09G5/377 ,  G09G5/38 ,  G02B2027/0138 ,  G02B2027/014 ,  G09G2320/106 ,  G09G2354/00

摘要： A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

公开(公告)号：US11742216B2

公开(公告)日：2023-08-29

申请号：US17005021

申请日：2020-08-27

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Tae Ho Yoon ,  Yang Gyoo Jung ,  Min Ho Kim ,  Youn Seok Song ,  Dong Soo Ryu ,  Choong Hoe Kim

IPC分类号： H01L21/48 ,  H01L23/00 ,  G02B27/09 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00 ,  H01L21/60

CPC分类号： H01L21/4853 ,  G02B27/0927 ,  H01L24/75 ,  H01L24/81 ,  H01L23/3128 ,  H01L25/0657 ,  H01L25/50 ,  H01L2021/60112 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/75263 ,  H01L2224/81002 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/131 ,  H01L2924/014

摘要： A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.