公开(公告)号：US20240250051A1

公开(公告)日：2024-07-25

申请号：US18627896

申请日：2024-04-05

申请人： ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

发明人： SUMING HU ,  FARSHAD GHAHGHAHI

IPC分类号： H01L23/00

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/11622 ,  H01L2224/13006 ,  H01L2224/13018 ,  H01L2224/13541 ,  H01L2224/13552 ,  H01L2224/13582 ,  H01L2224/16227 ,  H01L2224/16238

摘要： In an implementation, a semiconductor chip includes a device layer, an interconnect layer fabricated on the device layer, the interconnect layer including a conductive pad, and a conductive pillar coupled to the conductive pad. The conductive pillar includes at least a first portion having a first width and a second portion having a second width, the first portion being disposed between the second portion and the conductive pad, wherein the first width of the first portion is greater than the second width of the second portion.

公开(公告)号：US20230154878A1

公开(公告)日：2023-05-18

申请号：US17528523

申请日：2021-11-17

申请人： ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

发明人： SUMING HU ,  FARSHAD GHAHGHAHI

IPC分类号： H01L23/00

CPC分类号： H01L24/13 ,  H01L24/16 ,  H01L24/11 ,  H01L2224/16238 ,  H01L2224/16227 ,  H01L2224/11622 ,  H01L2224/13582 ,  H01L2224/13541 ,  H01L2224/13552 ,  H01L2224/13006 ,  H01L2224/13018

摘要： In an implementation, a semiconductor chip includes a device layer, an interconnect layer fabricated on the device layer, the interconnect layer including a conductive pad, and a conductive pillar coupled to the conductive pad. The conductive pillar includes at least a first portion having a first width and a second portion having a second width, the first portion being disposed between the second portion and the conductive pad, wherein the first width of the first portion is greater than the second width of the second portion.

公开(公告)号：US20230101770A1

公开(公告)日：2023-03-30

申请号：US17489286

申请日：2021-09-29

申请人： ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

发明人： SUMING HU ,  FARSHAD GHAHGHAHI ,  ANDREW KWAN WAI LEUNG

IPC分类号： H01L21/673 ,  H01L21/67 ,  H01L21/02

摘要： A carrier boat for die package flux cleaning, including: a body having at least one pair of substantially parallel sides, the body comprising one or more die package receptacles each oriented at a non-parallel angle relative to the substantially parallel sides of the body such that, when a die package is seated in a die package receptacle of the one or more die package receptacles, a first pair of opposing sides of a die of the die package are substantially perpendicular to the substantially parallel sides,