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    ELECTRICALLY CONDUCTIVE BONDING TAPE WITH LOW PASSIVE INTERMODULATION
    2.
    发明申请
    ELECTRICALLY CONDUCTIVE BONDING TAPE WITH LOW PASSIVE INTERMODULATION 有权

    公开(公告)号：US20230110790A1

    公开(公告)日：2023-04-13

    申请号：US17992224

    申请日：2022-11-22

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jeongwan Choi ,  Jeffrey W. McCutcheon ,  Marina M. Kaplun ,  Steven Y. Yu ,  Jinbae Kim

    IPC: C09J7/38 ,  H01R4/04 ,  H05K9/00 ,  C09J7/28 ,  C09J7/25

    Abstract: An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

    ELECTRICALLY CONDUCTIVE ADHESIVE TAPES AND ARTICLES THEREFROM
    3.
    发明申请
    ELECTRICALLY CONDUCTIVE ADHESIVE TAPES AND ARTICLES THEREFROM 审中-公开
    电导电胶带及其制品

    公开(公告)号：US20160333232A1

    公开(公告)日：2016-11-17

    申请号：US15112595

    申请日：2015-01-21

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jeongwan Choi ,  Jeffrey W. McCutcheon

    IPC: C09J9/02 ,  C09J7/02

    CPC classification number: C09J9/02 ,  C09J7/21 ,  C09J7/26 ,  C09J7/30 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2400/263 ,  C09J2433/00 ,  C09J2467/006

    Abstract: An electrically conductive, single-sided tape includes a conductive adhesive layer, which includes a first conductive porous substrate having a plurality of passageways and an adhesive material positioned within at least a portion of the passageways; and a second conductive porous substrate positioned adjacent the conductive adhesive layer. Optionally, the electrically conductive, single-sided tape may include an opaque coating adjacent to a major surface of the second conductive porous substrate. Optionally, the adhesive material may include a plurality of conductive particles dispersed within the adhesive material.

    Abstract translation: 导电单面胶带包括导电粘合剂层，其包括具有多个通道的第一导电多孔基材和位于通道的至少一部分内的粘合材料; 以及邻近所述导电粘合剂层定位的第二导电多孔基材。 可选地，导电单面胶带可以包括与第二导电多孔基材的主表面相邻的不透明涂层。 可选地，粘合剂材料可以包括分散在粘合剂材料内的多个导电颗粒。

    ELECTRICALLY CONDUCTIVE POLYMER RESIN AND METHOD FOR MAKING SAME
    5.
    发明申请
    ELECTRICALLY CONDUCTIVE POLYMER RESIN AND METHOD FOR MAKING SAME 有权
    电导电聚合物树脂及其制造方法

    公开(公告)号：US20150137046A1

    公开(公告)日：2015-05-21

    申请号：US14608963

    申请日：2015-01-29

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jeongwan Choi ,  Un Nyoung Sa ,  Won-Sik Kim

    IPC: H01B1/24 ,  H01B1/22

    CPC classification number: H01B1/24 ,  C08F2/44 ,  C08F2/48 ,  C08L101/12 ,  H01B1/22 ,  H05K9/0083

    Abstract: Disclosed are polymer resins, including polymer resin sheets, having good electroconductivity and a method for manufacturing the same. The polymer resins exhibit flexibility and show electroconductivity on their surface as well as along their thickness, and thus can be used as electromagnetic wave-shielding materials having impact- and vibration-absorbing properties as well as conductivity.

    Abstract translation: 公开了具有良好导电性的聚合物树脂，包括聚合物树脂片及其制造方法。 聚合物树脂表现出柔韧性并且在其表面以及沿其厚度显示导电性，因此可以用作具有冲击和振动吸收特性以及导电性的电磁波屏蔽材料。

    NONWOVEN ADHESIVE TAPES AND ARTICLES THEREFROM
    8.
    发明申请
    NONWOVEN ADHESIVE TAPES AND ARTICLES THEREFROM 有权
    非金属胶带和其他文章

    公开(公告)号：US20140069698A1

    公开(公告)日：2014-03-13

    申请号：US13811681

    申请日：2012-10-18

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jeongwan Choi

    IPC: H05K1/02

    CPC classification number: H05K1/02 ,  C09J7/205 ,  C09J7/21 ,  C09J9/02

    Abstract: A conductive double-sided tape includes a conductive, nonwoven adhesive layer including an adhesive material, a nonconductive, nonwoven substrate having a plurality of passageways, and a plurality of conductive particles penetrating through the nonconductive, nonwoven substrate and the adhesive material. The nonconductive, nonwoven substrate is embedded in the adhesive material. The conductive particles have a D99 particle size larger than a thickness of the nonconductive, nonwoven substrate and the adhesive material.

    Abstract translation: 导电双面胶带包括导电性无纺粘合剂层，其包括粘合剂材料，具有多个通道的非导电非织造基材，以及贯穿非导电非织造基材和粘合剂材料的多个导电颗粒。 非导电非织造基材被嵌入粘合剂材料中。 导电颗粒的D99粒径大于非导电非织造衬底和粘合剂材料的厚度。

    INTEGRAL ELECTRONIC STACK
    9.
    发明申请
    INTEGRAL ELECTRONIC STACK 有权

    公开(公告)号：US20240414845A1

    公开(公告)日：2024-12-12

    申请号：US18698113

    申请日：2022-10-05

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jeongwan Choi ,  Jong-Pil Kim ,  Jinbae Kim ,  Jeffrey W. McCutcheon

    IPC: H05K1/14 ,  H05K3/46

    Abstract: The disclosure relates to an integral electronic stack and a multi-layer stack. Specifically, according to an embodiment of the disclosure, there is provided an integral electronic stack for grounding an electrically conductive component in which passive intermodulation (PIM) is reduced, wherein the integral electronic stack includes a first integral stack and a second integral stack, the first integral stack being bonded to the second integral stack, wherein the first integral stack includes: a first board which is substantially rigid; a first electrically conductive layer which is disposed on at least part of a first main surface of the first board; a first electrically conductive adhesive layer and a second electrically conductive adhesive layer; and a first electrically conductive film which is disposed between the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, and is bonded to the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, respectively, the first electrically conductive adhesive layer and the second electrically conductive adhesive layer including a plurality of electrically conductive elements substantially distributed in an electrically insulative material, wherein the first electrically conductive adhesive layer bonds the first electrically conductive film to the one or more first electrically conductive layer.

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