公开(公告)号：US11697609B2

公开(公告)日：2023-07-11

申请号：US17905022

申请日：2021-02-26

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Samuel F. Joly ,  Georg P. Victor ,  Bernd Ruisinger

IPC: C03B11/08 ,  C04B35/581 ,  C04B35/645

CPC classification number: C03B11/084 ,  C04B35/581 ,  C04B35/645 ,  C03B2215/07 ,  C04B2235/3409 ,  C04B2235/386 ,  C04B2235/3865 ,  C04B2235/656 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/9669

Abstract: The present disclosure relates to a mold for glass forming, wherein the mold comprises a ceramic material, and wherein the ceramic material comprises aluminum nitride and hexagonal boron nitride, and wherein the ceramic material comprises from 50 to 80% by weight of aluminum nitride and from 20 to 50% by weight of hexagonal boron nitride, based on the total weight of the ceramic material. The present disclosure further relates to a process for using such molds to form curved glass plates.

公开(公告)号：US20230135623A1

公开(公告)日：2023-05-04

申请号：US17905022

申请日：2021-02-26

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Samuel F. Joly ,  Georg P. Victor ,  Bernd Ruisinger

IPC: C03B11/08 ,  C04B35/581 ,  C04B35/645

Abstract: The present disclosure relates to a mold for glass forming, wherein the mold comprises a ceramic material, and wherein the ceramic material comprises aluminum nitride and hexagonal boron nitride, and wherein the ceramic material comprises from 50 to 80% by weight of aluminum nitride and from 20 to 50% by weight of hexagonal boron nitride, based on the total weight of the ceramic material. The present disclosure further relates to a process for using such molds to form curved glass plates.

公开(公告)号：US20220219357A1

公开(公告)日：2022-07-14

申请号：US17608541

申请日：2020-04-30

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Bernd Ruisinger ,  Armin Kayser ,  Mark W. Muggli ,  Michael C. Dadalas ,  Robert Veenendaal ,  Johanna Zimmermann-Ptacek

IPC: B29C43/44 ,  C08J5/18 ,  B29C43/00 ,  B29C43/02 ,  B29D7/01 ,  C08J3/20 ,  C08K3/38 ,  C08K7/00 ,  H05K1/03

Abstract: The present disclosure relates to a film usable for roll-to-roll processing of flexible electronic devices, the film comprising a composite material comprising a polymer and hexagonal boron nitride particles, wherein the hexagonal boron nitride particles comprise platelet-shaped hexagonal boron nitride particles. The present disclosure further relates to a process for producing said film, and to the use of said film.