摘要:
Provided are a plasma processing apparatus and method. The plasma processing apparatus includes a chamber, an upper electrode, a lower electrode, a substrate support, and a movement member. The upper electrode is disposed at an inner upper portion of the chamber. The lower electrode faces the upper electrode at an inner lower portion of the chamber to support a substrate such that a bevel of the substrate is exposed in a substrate level etching process. The substrate support is disposed between the upper electrode and the lower electrode to support the substrate such that a central region of a bottom surface of the substrate is exposed in a substrate backside etching process. The movement member is configured to move the substrate support to separate the substrate from the substrate support in the substrate backside etching process.
摘要:
Provided is a plasma display panel including: a first substrate and a second substrate facing each other; an upper dielectric layer formed on the inner surface of the first substrate; and a first ceramic layer which has about the same thermal expansion coefficient as the upper dielectric layer, faces the upper dielectric layer, and is formed on the outer surface of the first substrate. Alternatively, the plasma display panel includes: a first lower dielectric layer formed on the second substrate and having a thermal expansion coefficient greater than that of the second substrate by α; and a second lower dielectric layer formed on the first lower dielectric layer and having a thermal expansion coefficient less than that of the second substrate by α.
摘要:
A plasma display device is provided having a plasma display panel, a chassis base arranged substantially parallel to the plasma display panel, a tape bonding the plasma display panel to the chassis base, and a radiative sheet interposed between and adhering to the plasma display panel and the chassis base. The radiative sheet is of material having a layered crystal structure. The layered crystal structure is arranged to extend at an angle from the plasma display panel. The angle is not horizontal/parallel to a surface of the plasma display panel.
摘要:
The present invention relates to a method for controlling a transmission control protocol window size in an asynchronous transfer mode which determines a TCP congestion window size by using an explicit rate value in a resource management cell. According to the present invention, cells transmitted pursuant to the explicit rate value are rarely dropped or tagged by a switch algorithm, thereby reducing a ratio of transmission.
摘要:
One object of the present invention is to provide a blade for forming ribs that is able to improve wear resistance; in order to achieve the object, the present invention provide a blade for forming ribs that forms ribs either on the surface of a substrate or via an undercoating layer on the surface of a substrate by moving a blade body in a fixed direction relative to a paste film in the state in which comb teeth formed on at least a portion of the periphery of said blade body are penetrated into said paste film formed on the surface of said substrate to plasticly deform said paste film; wherein, the surface of said comb teeth formed on said blade body that makes contact with said paste film is coated with a compound layer in which hard particles are dispersed in a metal.
摘要:
There are provided an apparatus and method for processing a substrate. By using the apparatus and method, plasma processing can be individually performed on each of edge and rear regions of a substrate in a single chamber. The apparatus includes a chamber providing a reaction space; a stage installed in the chamber; a plasma shielding unit installed opposite to the stage in the chamber; a support unit for supporting a substrate between the stage and the plasma shielding unit; a first supply pipe provided at the stage to supply a reaction or non-reaction gas to one surface of the substrate; and second and third supply pipes provided at the plasma shielding unit, the second supply pipe supplying a reaction gas to the other surface of the substrate, the third supply pipe supplying a non-reaction gas to the other surface.
摘要:
The present disclosure relates to a silane-containing inorganic nanofiller, a varnish including the silane-containing inorganic nanofiller, an enameled wire including the silane-containing inorganic nanofiller, and a method for preparing the enameled wire.
摘要:
Provided are a plasma processing apparatus and method. The plasma processing apparatus includes a chamber, an upper electrode, a lower electrode, a substrate support, and a movement member. The upper electrode is disposed at an inner upper portion of the chamber. The lower electrode faces the upper electrode at an inner lower portion of the chamber to support a substrate such that a bevel of the substrate is exposed in a substrate level etching process. The substrate support is disposed between the upper electrode and the lower electrode to support the substrate such that a central region of a bottom surface of the substrate is exposed in a substrate backside etching process. The movement member is configured to move the substrate support to separate the substrate from the substrate support in the substrate backside etching process.
摘要:
A plasma display panel (PDP) including: first and second opposing substrates; a discharge layer disposed between the substrates, having discharge cells; address electrodes disposed on the first substrate, extending in a first direction, across the discharge cells; and display electrodes disposed on the second substrate, extending across the discharge cells in a second direction. The discharge layer includes: a discharge enhancement layer disposed on the first substrate, having first spaces; and a barrier rib layer disposed on the discharge enhancement layer, having second spaces that are connected to the first spaces, so as to form the discharge cells. The discharge enhancement layer further includes a perimeter member disposed in a dummy area provided at the edges of an effective area of the PDP.
摘要:
Provided are a substrate holder, a substrate supporting apparatus, a substrate processing apparatus, and a substrate processing method. Particularly, there are provided a substrate holder, a substrate supporting apparatus, a substrate processing apparatus, and a substrate processing method that are adapted to improve process efficiency and etch uniformity at the back surface of a substrate.