公开(公告)号：US08099862B2

公开(公告)日：2012-01-24

申请号：US12285000

申请日：2008-09-25

申请人： Yoshio Uematsu ,  Kenjirou Watanabe ,  Takuya Satoh

发明人： Yoshio Uematsu ,  Kenjirou Watanabe ,  Takuya Satoh

IPC分类号： B23P19/04 ,  G11B5/50

CPC分类号： G11B5/4826 ,  G11B5/4853 ,  Y10T29/49023 ,  Y10T29/49027 ,  Y10T29/53165 ,  Y10T29/53261 ,  Y10T29/53274 ,  Y10T29/53283

摘要： An apparatus for detaching a head slider bonded onto a mounting plate of a suspension includes a platform on which a head gimbal assembly is mounted; a heating device for heating a joint section between the head slider and the suspension to decrease the bonding force; a latching part for latching the mounting plate at a position on a center line of the mounting plate in the lengthwise direction and/or at positions symmetric about the center line; and a clamp device for moving the head slider in a direction along the center line with the heating to detach the head slider from the mounting plate.

摘要翻译： 用于拆卸粘合到悬架的安装板上的磁头滑块的装置包括：平台，安装有磁头万向架组件; 加热装置，用于加热头部滑块和悬架之间的接合部分以降低接合力; 用于将安装板在长度方向上的中心线的中心线的位置和/或关于中心线对称的位置处锁定的闩锁部分; 以及夹持装置，用于沿着具有加热的中心线的方向移动头部滑块​​，以将头部滑块从安装板上分离。

公开(公告)号：US07583475B2

公开(公告)日：2009-09-01

申请号：US11066949

申请日：2005-02-25

申请人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

发明人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

IPC分类号： G11B5/48

CPC分类号： H05K3/3442 ,  G11B5/4853 ,  H05K1/111 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613

摘要： Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.

摘要翻译： 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。

公开(公告)号：US07486480B2

公开(公告)日：2009-02-03

申请号：US11355470

申请日：2006-02-15

申请人： Takuya Satoh ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Yoshio Uematsu

发明人： Takuya Satoh ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Yoshio Uematsu

IPC分类号： G11B5/40 ,  B23K35/14

CPC分类号： H05K3/3442 ,  G11B5/4853 ,  H01L2224/742 ,  H01L2924/01327 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/4903 ,  Y10T29/49211 ,  H01L2924/00

摘要： Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.

摘要翻译： 本发明的实施例涉及当在磁盘驱动器中使用的头/滑块中的焊接连接失败时重新连接。 在一个实施例中，沉积在头/滑块的滑块上的焊料块与引线焊盘分离，并且在滑块焊盘和引线焊盘之间尚未形成焊球连接。 将成型尖端加热至接近焊料熔点的温度。 成形尖端与滑块的表面平行地移动到铅焊盘的侧面以软化焊料质量。 然后用激光束照射焊料，以形成焊锡圆角，从而在引线焊盘和滑块之间形成焊接连接​​。

公开(公告)号：US07210221B2

公开(公告)日：2007-05-01

申请号：US10929512

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： B23P19/02

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US07137189B2

公开(公告)日：2006-11-21

申请号：US10964224

申请日：2004-10-13

申请人： Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

发明人： Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

IPC分类号： G11B5/127 ,  H04R31/00

CPC分类号： G11B5/4853 ,  G11B5/484 ,  G11B5/486 ,  H01L2224/742 ,  H05K1/189 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2203/041 ,  H05K2203/107 ,  H05K2203/159 ,  Y02P70/613 ,  Y10T29/49025 ,  Y10T29/4903 ,  Y10T29/49032 ,  Y10T29/49046 ,  Y10T29/49144 ,  Y10T29/49179

摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

公开(公告)号：US06879465B2

公开(公告)日：2005-04-12

申请号：US10459343

申请日：2003-06-11

申请人： Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

发明人： Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

IPC分类号： G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  H05K1/18 ,  H05K3/34 ,  G11B21/22 ,  G11B5/54 ,  H05K1/11

CPC分类号： G11B5/4853 ,  G11B5/484 ,  G11B5/486 ,  H01L2224/742 ,  H05K1/189 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2203/041 ,  H05K2203/107 ,  H05K2203/159 ,  Y02P70/613 ,  Y10T29/49025 ,  Y10T29/4903 ,  Y10T29/49032 ,  Y10T29/49046 ,  Y10T29/49144 ,  Y10T29/49179

摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

公开(公告)号：US08031437B2

公开(公告)日：2011-10-04

申请号：US12313641

申请日：2008-11-20

申请人： Hiroyuki Suzuki ,  Yoshio Uematsu

发明人： Hiroyuki Suzuki ,  Yoshio Uematsu

IPC分类号： G11B5/48

CPC分类号： G11B5/4853 ,  B23K1/0016 ,  B23K1/008 ,  B23K35/262 ,  B23K2101/36 ,  C22C13/00

摘要： Embodiments of the present invention provide a highly reliable hard disk drive (HDD). In an HDD according to an embodiment of the present invention, solder at a solder joint for joining a pad of a head slider and a pad of a transmission wiring comprises the main component of Sn and atomic percent to atomic percent of indium. The solder exhibits the γ phase within the range of −150° C. to 120° C. Accordingly, even if the HDD is left at a low temperature for a long time, the solder joint is not broken.

摘要翻译： 本发明的实施例提供了一种高度可靠的硬盘驱动器（HDD）。 在根据本发明的实施例的HDD中，用于连接磁头滑块的焊盘和传输线的焊盘的焊接点处的焊料包括Sn的主要成分和铟的原子百分比。 焊料的γ相位在-150℃〜120℃的范围内。因此，即使HDD长时间处于低温下，焊点也不会断裂。

公开(公告)号：US20090077792A1

公开(公告)日：2009-03-26

申请号：US12285000

申请日：2008-09-25

申请人： Yoshio Uematsu ,  Kenjirou Watanabe ,  Takuya Satoh

发明人： Yoshio Uematsu ,  Kenjirou Watanabe ,  Takuya Satoh

IPC分类号： G11B5/50 ,  B23P19/04

CPC分类号： G11B5/4826 ,  G11B5/4853 ,  Y10T29/49023 ,  Y10T29/49027 ,  Y10T29/53165 ,  Y10T29/53261 ,  Y10T29/53274 ,  Y10T29/53283

摘要： Embodiments of the present invention help to prevent deformation of a gimbal in detaching a head slider from a suspension. In an embodiment of the present invention, after a head slider has been mounted on a suspension, a test on the assembly is conducted. If a defect head slider is found in the test, the head slider is detached from the suspension. The head slider is discarded but the suspension is reused and a new head slider is mounted on the suspension. In detaching the head slider, a pin inserted in a through-hole on the center line of a gimbal tongue latches the gimbal tongue.

摘要翻译： 本发明的实施例有助于防止将万向节从头部滑动件脱离悬架的变形。 在本发明的一个实施例中，在磁头滑块已经安装在悬架上之后，进行组件的测试。 如果在测试中发现缺陷磁头滑块，则磁头滑块与悬架分离。 磁头滑块被丢弃，但悬架被重新使用，并且在悬架上安装了一个新的磁头滑块。 在拆卸磁头滑动器时，插入万向节舌片中心线上的通孔中的销钉锁定万向节舌头。

公开(公告)号：US07417827B2

公开(公告)日：2008-08-26

申请号：US11071394

申请日：2005-03-02

申请人： Hiroyasu Tsuchida ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yuhsuke Matsumoto ,  Yoshio Uematsu ,  Tatsuya Tanaka

发明人： Hiroyasu Tsuchida ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yuhsuke Matsumoto ,  Yoshio Uematsu ,  Tatsuya Tanaka

IPC分类号： G11B5/60

CPC分类号： G11B5/484 ,  G11B5/4853 ,  H01L2224/742 ,  H05K1/189 ,  H05K3/326 ,  H05K3/3442 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/10727 ,  H05K2203/041 ,  Y02P70/613

摘要： Embodiments of the invention provide a head/slider supporting structure which has connection properties excellent in solder ball connections of a slider pad and a lead pad. According to one embodiment, in a head/slider supporting structure for connecting a slider and a lead wire by re-flowing a solder ball, a connection distance between a slider pad and an extreme end portion of the lead wire is reduced to enhance the performance of solder connection. The lead wire is inclined forwardly of the slider pad.

摘要翻译： 本发明的实施例提供一种头/滑块支撑结构，其具有在滑块焊盘和引线焊盘的焊球连接方面优异的连接特性。 根据一个实施例，在用于通过重新流动焊球来连接滑块和引线的头/滑块支撑结构中，滑块与引线的末端部分之间的连接距离减小，以提高性能 的焊接连接。 引线向前倾斜滑块。

公开(公告)号：US07400470B2

公开(公告)日：2008-07-15

申请号：US11112719

申请日：2005-04-21

申请人： Yuhsuke Matsumoto ,  Tatsushi Yoshida ,  Takaaki Murokawa ,  Tatsumi Tsuchiya ,  Yoshio Uematsu ,  Nobuyuki Hashi

发明人： Yuhsuke Matsumoto ,  Tatsushi Yoshida ,  Takaaki Murokawa ,  Tatsumi Tsuchiya ,  Yoshio Uematsu ,  Nobuyuki Hashi

IPC分类号： G11B5/60

CPC分类号： G11B5/4826 ,  H01L2224/742 ,  H01L2924/01322 ,  H05K3/3442 ,  H05K2201/0397 ,  H05K2201/10727 ,  H05K2203/041 ,  H05K2203/0465 ,  Y02P70/613

摘要： Embodiments of the invention provide a head gimbal assembly (HGA) capable of effecting solder ball connection with use of low energy. In one embodiment, the HGA includes a head/slider. In the head/slider, slider pads and lead wire pads are connected to each other by reflow of solder balls under the radiation of a laser beam. Lead layers are connected to a magnetic head and electrode studs are connected to the lead layers, respectively, and are also connected to the slider pads. The diameter R (m) of a solder ball and a sectional area S (m2) of an electrode stud are in a relation of R2≧4S.

摘要翻译： 本发明的实施例提供一种能够使用低能量实现焊球连接的头万向架组件（HGA）。 在一个实施例中，HGA包括头/滑块。 在头/滑块中，通过在激光束的辐射下回流焊球，滑块和引线焊盘彼此连接。 引线层连接到磁头，电极柱分别连接到引线层，并且还连接到滑块。 焊球的直径R（m）和电极柱的截面积S（m 2）之间的关系为R 2 2 / S 2 = 4S。