摘要:
A head-gimbal assembly (HGA). The HGA includes a deformable plate affixed to a load beam, a piezoelectric element affixed to the deformable plate, and a base plate affixed to the deformable plate. The deformable plate includes: a hole; a first section in front of the hole and affixed to the load beam; a second section behind the hole and affixed to the base plate; and, first and second spring members that join the first section and the second section, can deform in a front-back direction, and are positioned to sandwich the hole in a left-right direction. The piezoelectric element is affixed between the first section and the second section. The base plate includes projection members on a front edge of the plate and projecting out toward the first section. The front edges of the projection member are positioned further to a front edge than a back edge of the hole.
摘要:
A head-gimbal assembly (HGA). The HGA includes a deformable plate affixed to a load beam, a piezoelectric element affixed to the deformable plate, and a base plate affixed to the deformable plate. The deformable plate includes: a hole; a first section in front of the hole and affixed to the load beam; a second section behind the hole and affixed to the base plate; and, first and second spring members that join the first section and the second section, can deform in a front-back direction, and are positioned to sandwich the hole in a left-right direction. The piezoelectric element is affixed between the first section and the second section. The base plate includes projection members on a front edge of the plate and projecting out toward the first section. The front edges of the projection member are positioned further to a front edge than a back edge of the hole.
摘要:
The present invention provides an image data processing method of recording image data coded with the MPEG (Moving Picture Experts Group) technique to a recording medium. For transition of the bit occupancy in a VBV buffer to a target value, the initial value of a bit occupancy in a VBV buffer is calculated on the basis of auxiliary data read from a recording medium, a comparison is made between the target and initial values of the bit occupancy, and the number of bits for assignment to each GOP of to-be-coded image data correspondingly to the result of comparison.
摘要:
Embodiments of the invention improve the impact-resisting performance of a disk drive. In a head actuator assembly according to an embodiment of the invention, the difference in resonance frequency between an arm bending mode and a coil bending mode is set at a predetermined value or less. Since there is a phase difference between these two modes, an oscillation gain in the arm bending mode can be greatly decreased by approximating the two resonance frequencies to each other. Consequently, it is possible to suppress collision of a head with a recording disk caused by an external shock and thereby improve the impact-resisting performance of a disk drive.
摘要:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要:
Embodiments of the invention provide a head/slider supporting structure which has connection properties excellent in solder ball connections of a slider pad and a lead pad. According to one embodiment, in a head/slider supporting structure for connecting a slider and a lead wire by re-flowing a solder ball, a connection distance between a slider pad and an extreme end portion of the lead wire is reduced to enhance the performance of solder connection. The lead wire is inclined forwardly of the slider pad.
摘要:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要:
In order to provide a suspension, a head suspension assembly, and a disk drive apparatus that can contribute to an increase of record and playback reliability, holes 3c in ribs 3b of the head suspension assembly 3 are provided. This design decreases the displacement of a head slider 2 that is caused by Karman vortex streets occurring near the ribs 3b in company with the rotation of the magnetic disk 1.
摘要翻译:为了提供可以有助于提高记录和播放可靠性的悬架,磁头悬架组件和磁盘驱动装置, 3 BOLD> c < 头部悬挂组件 3 BOLD> 3 BOLD> b BAL> >提供。 这种设计减少了由靠近肋骨 3 BOLD> 2 BOLD> > b ITALIC> ,随着磁盘 1的旋转。 BOLD> PTEXT>
摘要:
Approaches for integrated lead suspension that provides many benefits, such as enabling a dual stage actuator (DSA) to be used with a single layer flex with a reduced amount of crosstalk. An integrated lead suspension comprises a tail end having a plurality of conductive pads positioned thereat. The plurality of conductive pads includes a first and second dual stage actuator (DSA) pad. The first and second DSA pads are electrically coupled to a conductive member by way of conductive vias. The conductive member may be a stainless steel island. The first DSA pad conducts a signal to a first terminal at each of a plurality of dual stage actuators, while a second terminal at each of the plurality of dual stage actuators is connected to ground.