Abstract:
A semiconductor device includes an electric fuse circuit and a program protective circuit. The electric fuse circuit includes a fuse element and a transistor connected together in series and placed between a program power supply and a grounding, and controlling sections. The program protective circuit is placed in parallel with the electric fuse circuit and between the program power supply and the grounding. When a surge voltage is applied between the program power supply and the grounding, the foregoing structure allows a part of a surge electric current can flow through the program protective circuit.
Abstract:
In a nonvolatile semiconductor memory device storing data by accumulating charges in a floating gate, memory units, each of which includes a first MOS transistor as a read device, a bit cell composed of a first capacitor as a capacitance coupling device and a second capacitor as an erase device, and a decode device including a second MOS transistor and a third MOS transistor, are arranged in array. This attains nonvolatile memory capable of bit by bit selective erase arranged in array to thus reduce the core area remarkably.
Abstract:
An electronic equipment system includes a semiconductor integrated circuit having a nonvolatile memory storing information on a characteristic of the semiconductor integrated circuit; and a controller configured to control the semiconductor integrated circuit. The controller has a function of adjusting an access parameter to the semiconductor integrated circuit based on the information stored in the nonvolatile memory.
Abstract:
A nonvolatile semiconductor memory device for storing data by accumulating charge in a floating gate includes a plurality of MOS transistors sharing the floating gate. In the device, a PMOS is used for coupling during writing and an n-type depletion MOS (DMOS) is used for coupling during erasure. Coupling of channel inversion capacitance by the PMOS is used for writing and coupling of depletion capacitance by the n-type DMOS is used for erasure, thereby increasing the erase speed without increase of area, as compared to a conventional three-transistor nonvolatile memory element.
Abstract:
A memory cell is constructed by connecting in series a variable-resistance element having a resistance which is varied by application of a positive voltage to one terminal (first node) thereof using a potential at the other terminal thereof as a reference and a diode which allows a current to flow therethrough by application of a positive voltage to the other terminal thereof using a potential at one terminal (second node) thereof as a reference. The first node is connected to the corresponding column select line and the second node is connected to the corresponding row select line. Then, to a non-selected row select line, a potential higher than when the row select line is selected is applied by using a row control circuit. By using column-select-line driver circuits, predetermined potentials corresponding to a non-selection period, a data write period, a reset period, and a data read period are applied to the column select line.
Abstract:
The invention provides an electrical fuse device comprising: a plurality of fuse cores, each having an electrical fuse element and a switching element serially connected to the electrical fuse element; a program control circuit generating a program shift signal by sequentially shifting a program control transmission signal in synchronization with an effective program clock signal and subsequently generating a program signal to be sent to each of the switching elements in the plurality of fuse cores based on program data and the program shift signal; and a program clock control circuit controlling the conducting and non-conducting states of a program clock signal in accordance with a program clock enable signal and, when the program clock signal is in a conducting state, transmitting the program clock signal to the program control circuit as the effective program clock signal.
Abstract:
An electrical fuse circuit of the present invention includes a plurality of electrical fuse cores (1) each of which has an electrical fuse element (3) and a switch transistor (4) connected in series with each other, and shift registers (2) connected to the plurality of electrical fuse cores (1) to program the electrical fuse elements (3). Program enable signals (Si) are sequentially generated and transferred by the shift registers (2), the switch transistors (4) are sequentially brought into conduct according to the program enable signals (Si) and the information of program data (Di), and the electrical fuse elements (3) are blown one by one.
Abstract:
A semiconductor device includes an MIS transistor and an electric fuse. The MIS transistor includes a gate insulating film formed on the semiconductor substrate, and a gate electrode including a first polysilicon layer, a first silicide layer, and a first metal containing layer made of a metal or a conductive metallic compound. The electric fuse includes an insulating film formed on the semiconductor substrate, a second polysilicon layer formed over the insulating film, and a second silicide layer formed on the second polysilicon layer.
Abstract:
A memory to which a bit line potential step-down technique is applied is provided. The memory includes an IO block including first transistors which control potentials of first bit lines provided with respect to columns of memory cells, and first logic gates which control the first transistors. The drain or source of each first transistor is connected to an input of the corresponding first logic gate, and the gate of each first transistor is connected to an output of the corresponding first logic gate. The first transistors are driven by pulses.
Abstract:
A system LSI (100) having a logic circuit (104) and a plurality of SRAM macros (103) includes a power supply circuit (102) configured to receive a voltage (VDDP) supplied from the outside of the system LSI (100), and to generate a stabilized voltage (VDDM) lower than the voltage (VDDP). An SRAM memory cell (103a) of each of the plurality of SRAM macros (103) is supplied with the voltage (VDDM) generated by the power supply circuit (102), and an SRAM logic circuit (103b) of each of the plurality of SRAM macros (103) is supplied with a voltage (VDD) supplied from the outside. In addition, the logic circuit (104) is supplied with the voltage (VDD) from the outside.