Abstract:
A terahertz wave radiating element includes: a first nitride semiconductor layer formed on a substrate; a second nitride semiconductor layer formed over the first nitride semiconductor layer, and having a wider bandgap than the first nitride semiconductor layer; and source, gate, and drain electrodes formed on the second nitride semiconductor layer. The source electrode is formed by a plurality of source electrode fingers that are arranged periodically, and the drain electrode is formed by a plurality of drain electrode fingers that are arranged periodically.
Abstract:
The present invention provides a thermal transfer receiving sheet obtained by sequentially forming a hollow particle-containing intermediate layer and an image receiving layer on one surface of a sheet-like support mainly comprising cellulose pulp, wherein the moisture content of the entire thermal transfer receiving sheet is from 2 to 8 mass % and the moisture permeability of the entire receiving sheet is 400 g/m2·day or less; and a production method thereof. The present invention further provides a thermal transfer receiving sheet obtained by sequentially forming a hollow particle-containing intermediate layer and an image receiving layer on one surface of a sheet-like support mainly comprising cellulose pulp and providing a backside layer on another surface of the support, wherein the backside layer mainly comprises an acryl-based resin having a glass transition point (Tg) of 45° C. or less and contains a resin filler having an average particle diameter of 5 to 22 μm and the Bekk smoothness according to JIS P 8119 on the backside layer surface is 100 seconds or less.
Abstract:
A thermal transfer receiving sheet having laminated, on one side of its support, an intermediate layer, a barrier layer and an image receiving layer in this order, wherein said intermediate layer comprises hollow particles, and said barrier layer comprises a polyvinyl alcohol derivative, and comprises, as further main components, a resin or a mixture of two or more resins selected from the group consisting of a styrene-maleic acid copolymer, a styrene-acrylic copolymer, an acrylic acid ester polymer and polyester, or wherein said barrier layer comprises, as main components, an ethylene vinyl alcohol copolymer and polyurethane.
Abstract:
An inventive method includes the steps of: growing a first p-type semiconductor layer of a compound semiconductor containing phosphorus on a substrate; and growing a second p-type semiconductor layer of a compound semiconductor containing arsenic on the first p-type semiconductor layer. While the first p-type semiconductor layer is grown, magnesium is added to the first semiconductor layer. While the second p-type semiconductor layer is grown, a p-type impurity other than magnesium is added to the second semiconductor layer.
Abstract:
An optical semiconductor device includes an active layer having a quantum well structure including alternately stacked well layers and barrier layers with a larger band gap than the well layers. The band gap of each of the well layers and the barrier layers is constant, each well layer is uniformly provided with compression strain and each barrier layer is provided with large extension strain in a center portion thereof along the thickness direction and small extension strain in portions thereof in the vicinity of the well layers.
Abstract:
A thermal transfer receiving sheet comprising: the sequential formation of an intermediate layer containing hollow particles and an image receiving layer on at least one side of a sheet-form substrate; wherein, the mean particle diameter of the hollow particles is 0.2 to 30 μm, the volumetric hollow rate is 40 to 95%, the printing smoothness (Rp value) of the surface of the image receiving layer as determined 10 msec after the start of pressurization at a printing pressure of 0.1 MPa using a microtopograph is 1.5 μm or less, and the 20° gloss in accordance with JIS Z 8741 is 80 or less.
Abstract translation:一种热转印接收片,包括:在片状基底的至少一侧上顺序地形成含有中空颗粒的中间层和图像接收层; 其中,中空粒子的平均粒径为0.2〜30μm,体积中空率为40〜95%,加压开始10秒后确定图像接收层的表面的印刷平滑度(Rp值) 使用微照相印刷机的印刷压力为0.1MPa时为1.5μm以下,根据JIS Z 8741的20°光泽度为80以下。
Abstract:
A thermal transfer receiving sheet having laminated, on one side of its support, an intermediate layer, a barrier layer and an image receiving layer in this order, wherein said intermediate layer comprises hollow particles, and said barrier layer comprises a polyvinyl alcohol derivative, and comprises, as further main components, a resin or a mixture of two or more resins selected from the group consisting of a styrene-maleic acid copolymer, a styrene-acrylic copolymer, an acrylic acid ester polymer and polyester, or wherein said barrier layer comprises, as main components, an ethylene vinyl alcohol copolymer and polyurethane.
Abstract:
A method for manufacturing an electron emission element comprising, between its electrodes, a conductive film having an electron emission section. The method comprising the steps of forming a gap in the conductive film located between the electrodes, and applying a voltage between the electrodes in an atmosphere that has an aromatic compound with a polarity or a polar group and in which the partial pressure ratio of water to the aromatic compound is 100 or less.
Abstract:
A semiconductor laser device includes: an active layer formed on a substrate and including an AlGaAs layer; and an upper spacer layer formed at least one of above and below the active layer and including AlaGabIn1-a-bP (where 0≦a≦1, 0≦b≦1, and 0≦a+b≦1). The upper spacer layer has a composition enough to serve as a barrier layer against electrons injected into the active layer.
Abstract translation:半导体激光器件包括:形成在衬底上并包括AlGaAs层的有源层; 以及形成在有源层的上方和下方中的至少一个并且包括Al-1-ab P(其中第一个和第二个)的上隔离层 0 <= a <= 1,0 <= b <= 1,0 <= a + b <= 1)。 上间隔层具有足以用作抵抗注入有源层的电子的阻挡层的组成。
Abstract:
An inventive method includes the steps of: growing a first p-type semiconductor layer of a compound semiconductor containing phosphorus on a substrate; and growing a second p-type semiconductor layer of a compound semiconductor containing arsenic on the first p-type semiconductor layer. While the first p-type semiconductor layer is grown, magnesium is added to the first semiconductor layer. While the second p-type semiconductor layer is grown, a p-type impurity other than magnesium is added to the second semiconductor layer.