摘要:
The substrate 20 of the present invention includes pixel electrodes 25 formed in an area demarcated by a plurality of gate wiring lines 26 and source wiring lines 27 that intersect each other, and capacitance wiring lines 126 that are arranged in parallel with the gate wiring lines 26 and that form a capacitance with the pixel electrodes 25. The capacitance wiring lines 126 are arranged overlapping outer edges 125 and 125 of the adjacent pixel electrodes 25 and 25, and the following are formed on the capacitance wiring line 126: a first insulating film that covers the capacitance wiring line 126; a linear height-increasing part 30 formed on the first insulating film; and a second insulating film that covers the height-increasing part 30 and that includes a protruding band part 129 rising along the height-increasing part 30. The pixel electrodes 25 are above the second insulating film and are formed so the outer edges 125 ride up on the protruding band part 129.
摘要:
The array substrate 20 of the present invention includes pixel electrodes 25 formed in an area demarcated by a plurality of gate wiring lines 26 and source wiring lines 27 that intersect each other, and capacitance wiring lines 126 that are arranged in parallel with the gate wiring lines 26 and that form a capacitance with the pixel electrodes 25. The capacitance wiring lines 126 are arranged overlapping outer edges of the adjacent pixel electrodes 25, and formed on the capacitance wiring line 126 are: a first insulating film that covers the capacitance wiring line 126; a second insulating film 29 that is an insulating film formed on the first insulating film, and that has a protruding band part 129 with a line width narrower than the capacitance wiring line 126 and arranged along the capacitance wiring line 126. The pixel electrodes 25 are above the second insulating film 29 and are formed so the outer edges 125 of the adjacent pixel electrodes 25 and 25 ride up on the protruding band part 129.
摘要:
It is an object of the present invention to provide a lighting device including a chassis, a lamp, and a lamp holder for mounting the lamp on the chassis, in which the lamp is less likely to be damaged due to warping or distortion of the chassis. A backlight according to the present invention includes linear cold cathode fluorescent tubes arranged in parallel with each other, a chassis housing the cold cathode fluorescent tubes, and lamp clips mounting the cold cathode fluorescent tubes on the chassis. The lamp clips are each arranged at least 0.125X away from ends of the chassis in an axial direction of the cold cathode fluorescent tube, in which is a length of the chassis measured in the axial direction of the cold cathode fluorescent tube.
摘要:
Disclosed is a heat dissipation structure of dissipating heat through a heat dissipation sheet disposed between a cover member and an IC chip, which is a heat-generating element, mounted on a substrate. Specifically disclosed is a heat dissipation structure of an electronic device that can ensure that the heat dissipation sheet is reliably disposed between the IC chip and the cover member without falling off upon being attached to the IC chip and that dissipates heat sufficiently, thereby improving reliability of the electronic device. In order to achieve this heat dissipation structure, a heat dissipation sheet (1) is provided with, on a bottom surface (11) that corresponds to a contact surface with the IC chip 3, a heat transfer surface (11B) that comes in contact with the heat-generating section of the IC chip and that has no adhesive applied thereon and a bonding surface (11A) that comes in contact with an area other than the heat-generating section and that has an adhesive applied thereon.
摘要:
Disclosed is a display device wherein moving of a display panel in the planar direction is suppressed, while reducing EMI. The liquid crystal display device is provided with the liquid crystal display panel, and a holding member, which holds the end portion of the liquid crystal display panel. The holding member includes: a front side holding section, which is disposed on the front side of the liquid crystal display panel; a rear side holding section, which is disposed on the rear side of the liquid crystal display panel; and regulating sections, which are disposed on the side of the liquid crystal display panel, and which regulate moving of the liquid crystal display panel in the planar direction of the liquid crystal display panel. The front side holding section has a function of blocking electromagnetic waves.
摘要:
Provided is an electronic device whereby it is possible to suppress a decline in heat-dissipating properties. This liquid crystal display device (electronic device) (1) is provided with a semiconductor element (6a, 6b), a substrate (7) to which the semiconductor element is attached, and a chassis (5) disposed in opposition to the substrate and furnished with a rib (11, 12) that protrudes towards the semiconductor element side. The rib includes a contact part (11a, 12a) for contacting the semiconductor element. A pressing member (9) for inducing the semiconductor element into contact with the contact part is furnished at least at a position corresponding to the center part (7c) of the substrate.
摘要:
Provided is an electronic device whereby it is possible to suppress a decline in heat-dissipating properties. This liquid crystal display device (electronic device) (1) is provided with a semiconductor element (6a, 6b), a substrate (7) to which the semiconductor element is attached, and a chassis (5) disposed in opposition to the substrate and furnished with a rib (11, 12) that protrudes towards the semiconductor element side. The rib includes a contact part (11a, 12a) for contacting the semiconductor element. A pressing member (9) for inducing the semiconductor element into contact with the contact part is furnished at least at a position corresponding to the center part (7c) of the substrate.
摘要:
The array substrate 20 of the present invention includes pixel electrodes 25 formed in an area demarcated by a plurality of gate wiring lines 26 and source wiring lines 27 that intersect each other, and capacitance wiring lines 126 that are arranged in parallel with the gate wiring lines 26 and that form a capacitance with the pixel electrodes 25. The capacitance wiring lines 126 are arranged overlapping outer edges of the adjacent pixel electrodes 25, and formed on the capacitance wiring line 126 are: a first insulating film that covers the capacitance wiring line 126; a second insulating film 29 that is an insulating film formed on the first insulating film, and that has a protruding band part 129 with a line width narrower than the capacitance wiring line 126 and arranged along the capacitance wiring line 126. The pixel electrodes 25 are above the second insulating film 29 and are formed so the outer edges 125 of the adjacent pixel electrodes 25 and 25 ride up on the protruding band part 129.
摘要:
The substrate 20 of the present invention includes pixel electrodes 25 formed in an area demarcated by a plurality of gate wiring lines 26 and source wiring lines 27 that intersect each other, and capacitance wiring lines 126 that are arranged in parallel with the gate wiring lines 26 and that form a capacitance with the pixel electrodes 25. The capacitance wiring lines 126 are arranged overlapping outer edges 125 and 125 of the adjacent pixel electrodes 25 and 25, and the following are formed on the capacitance wiring line 126: a first insulating film that covers the capacitance wiring line 126; a linear height-increasing part 30 formed on the first insulating film; and a second insulating film that covers the height-increasing part 30 and that includes a protruding band part 129 rising along the height-increasing part 30. The pixel electrodes 25 are above the second insulating film and are formed so the outer edges 125 ride up on the protruding band part 129.
摘要:
An electronic device includes: a semiconductor package; a substrate having an attachment surface to which the semiconductor package is attached; a chassis which is arranged opposite a surface on the opposite side to the attachment surface of the substrate and in which ribs protruding to the side of the substrate are provided; and a heat dissipation sheet which is arranged between the ribs of the chassis and the substrate.