公开(公告)号：US07998793B2

公开(公告)日：2011-08-16

申请号：US12434637

申请日：2009-05-02

Applicant: Takashi Sato ,  Junichi Takano ,  Takashi Sato ,  Tokuo Naitou

Inventor： Takashi Sato ,  Junichi Takano ,  Takashi Sato ,  Tokuo Naitou

IPC: H01L21/00

CPC classification number: H01L21/67092 ,  H01L21/78 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

Abstract translation: 在切割装置（1）的盖（8）的前表面和后表面上布置照射波长为1.1μm以下的光的照明装置（7a）和（7b）。 在将晶片放置在切割台（3）上之后，当通过安装在主轴（5）上的刀片（4a）切割晶片时，将光照射在上表面（元件形成表面）的整个表面上 晶片通过照明装置（7a）和（7b）。 此时，晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式，在切割操作期间，晶片上不存在由主轴（5）等构成遮光区域的区域。

公开(公告)号：US20080138962A1

公开(公告)日：2008-06-12

申请号：US11632993

申请日：2004-07-22

Applicant: Takashi Sato ,  Junichi Takano ,  Takashi Sato ,  Tokuo Naitou

Inventor： Takashi Sato ,  Junichi Takano ,  Takashi Sato ,  Tokuo Naitou

IPC: H01L21/304

CPC classification number: H01L21/67092 ,  H01L21/78 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

Abstract translation: 在切割装置（1）的盖（8）的前表面和后表面上布置照射具有1.1μm或更小的波长的光的照明装置（7a）和（7b）。 在将晶片放置在切割台（3）上之后，当通过安装在主轴（5）上的刀片（4a）切割晶片时，将光照射在上表面（元件形成表面）的整个表面上 通过照明装置（7a）和（7b）的晶片。 此时，晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式，在切割操作期间，晶片上不存在由主轴（5）等构成遮光区域的区域。

公开(公告)号：US20090215247A1

公开(公告)日：2009-08-27

申请号：US12434637

申请日：2009-05-02

Applicant: Takashi Sato ,  Junichi Takano ,  Takashi Sato ,  Tokuo Naitou

Inventor： Takashi Sato ,  Junichi Takano ,  Takashi Sato ,  Tokuo Naitou

IPC: H01L21/304

CPC classification number: H01L21/67092 ,  H01L21/78 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

Abstract translation: 在扫描装置（1）的盖（8）的前表面和后表面上布置照射波长为1.1μm以下的光的照明装置（7a）和（7b）。 在将晶片放置在切割台（3）上之后，当通过安装在主轴（5）上的刀片（4a）切割晶片时，将光照射在上表面（元件形成表面）的整个表面上 晶片通过照明装置（7a）和（7b）。 此时，晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式，在切割操作期间，晶片上不存在由主轴（5）等构成遮光区域的区域。

公开(公告)号：US20220110934A1

公开(公告)日：2022-04-14

申请号：US17645509

申请日：2021-12-22

Applicant: Takashi SATO ,  Takeshi Shimosato ,  Tatsuru Moritani ,  Tadahiko Morinaga ,  Yuichi Sato ,  Akihiro Kotsugai

Inventor： Takashi SATO ,  Takeshi Shimosato ,  Tatsuru Moritani ,  Tadahiko Morinaga ,  Yuichi Sato ,  Akihiro Kotsugai

IPC: A61K31/496 ,  A61K9/16

Abstract: A pharmaceutical composition including particles each containing a water-soluble base material and a poorly water-soluble compound, the water-soluble base material containing a rapidly water-soluble compound, wherein the poorly water-soluble compound is a kinase inhibitor and exists in an amorphous state in the water-soluble base material.

公开(公告)号：US09750257B2

公开(公告)日：2017-09-05

申请号：US13141763

申请日：2010-01-21

Applicant: Takatoshi Terada ,  Manabu Tagami ,  Takashi Sato ,  Atsushi Iwata ,  Taro Yokochi ,  Yasushi Kobayashi

Inventor： Takatoshi Terada ,  Manabu Tagami ,  Takashi Sato ,  Atsushi Iwata ,  Taro Yokochi ,  Yasushi Kobayashi

IPC: A01N25/26 ,  A01N51/00 ,  A01C1/06

CPC classification number: A01N51/00 ,  A01C1/06 ,  A01N25/00 ,  A01N25/08 ,  A01N25/10

Abstract: A coated seed obtained by coating a seed with a coating material containing an inorganic mineral powder and a thermosetting resin powder having an average particle diameter of 10 to 200 μm, wherein the thermosetting resin powder is a thermosetting resin powder obtained by aggregating a powdery pesticide with a thermosetting resin has an excellent quality.

公开(公告)号：US09450244B2

公开(公告)日：2016-09-20

申请号：US11908079

申请日：2006-03-28

Applicant: Kei Yonezawa ,  Takashi Sato ,  Tsuyoshi Okawa ,  Yoshikatsu Yamamoto

Inventor： Kei Yonezawa ,  Takashi Sato ,  Tsuyoshi Okawa ,  Yoshikatsu Yamamoto

IPC: H01M4/13 ,  H01M4/525 ,  H01M4/38 ,  H01M10/04 ,  H01M10/0525 ,  H01M10/0569 ,  H01M10/0587 ,  H01M10/42 ,  H01M4/131 ,  H01M4/133 ,  H01M4/485 ,  H01M4/505 ,  H01M4/02

CPC classification number: H01M4/525 ,  H01M4/131 ,  H01M4/133 ,  H01M4/38 ,  H01M4/485 ,  H01M4/505 ,  H01M10/0436 ,  H01M10/0525 ,  H01M10/0569 ,  H01M10/0587 ,  H01M10/4235 ,  H01M2004/028 ,  H01M2010/4292 ,  H01M2300/0037 ,  Y02E60/122

Abstract: A battery capable of improving load characteristics, low-temperature characteristics and high-temperature cycle characteristics is provided. A cathode (13) includes a lithium cobalt complex oxide represented by LiaCoxMIyMIIzO2 (MI includes at least one kind selected from the group consisting of Al, Cr, V, Mn and Fe, MII includes at least one kind selected from the group consisting of Mg and Ca, 0.9≦a≦1.1, 0.9≦x

Abstract translation: 提供能够改善负载特性，低温特性和高温循环特性的电池。 阴极（13）包括由LiaCoxMIyMIIzO2表示的锂钴复合氧化物（MI包括选自Al，Cr，V，Mn和Fe中的至少一种，MII包括选自Mg Ca，0.9≤a≤1.1,0.9≤x<1,0.00≤y≤0.05,0.001≤z≤0.05，x + y + z = 1），进一步含有Zr作为亚成分元素。 作为在钴酸锂复合氧化物中Zr与Co的比例（Zr / Co），Zr的含量在0.01mol％〜10mol％的范围内。

公开(公告)号：US09337519B2

公开(公告)日：2016-05-10

申请号：US13391183

申请日：2010-08-12

Applicant: Takashi Sato ,  Taketsugu Yamamoto

Inventor： Takashi Sato ,  Taketsugu Yamamoto

IPC: H01M8/22 ,  H01M12/06

CPC classification number: H01M12/06

Abstract: An air battery containing an electrode and a polymer film, wherein the polymer film is disposed on the air intake side of the electrode, and the polymer film is a film of a polymer comprising a repeating unit represented by the following formula (1), wherein R1, R2, and m are defined in the specification.

Abstract translation: 一种包含电极和聚合物膜的空气电池，其中聚合物膜设置在电极的进气侧，聚合物膜是包含由下式（1）表示的重复单元的聚合物的膜，其中 R1，R2和m在本说明书中定义。

公开(公告)号：US20150353657A1

公开(公告)日：2015-12-10

申请号：US14764000

申请日：2014-01-30

Applicant: Noriaki YUKIMURA ,  Takahiro YOSHIZAWA ,  Kazuhiro KODAMA ,  Hiroaki YUASA ,  Noriaki SHIINA ,  Takashi SATO ,  Hiroyuki ISHITOBI ,  Mifuyu UENO ,  Shinya NAKASHIMA ,  Masaki ABE ,  BRIDGESTONE CORPORATION ,  OTSUKA CHEMICAL CO., LTD.

Inventor： Noriaki YUKIMURA ,  Takahiro YOSHIZAWA ,  Kazuhiro KODAMA ,  Hiroaki YUASA ,  Noriaki SHIINA ,  Takashi SATO ,  Hiroyuki ISHITOBI ,  Mifuyu UENO ,  Shinya NAKASHIMA ,  Masaki ABE

IPC: C08F136/08 ,  C08L9/00 ,  C08L7/00

CPC classification number: C08F136/08 ,  B60C1/00 ,  C08K5/29 ,  C08K5/3447 ,  C08K5/3725 ,  C08L7/00 ,  C08L9/00 ,  C08L21/00

Abstract: The invention provides a rubber composition prepared by mixing, per 100 parts by mass of the rubber component comprising at least 50% by mass of a diene-based rubber, from 20 to 150 parts by mass of a filler, and from 0.05 to 30 parts by mass of a compound A which has a specific amidine structure and has a functional group reactive with the diene-based rubber. The rubber composition improves both a high elastic modulus and a low tan δ. The invention also provides a pneumatic tire using the rubber composition.

Abstract translation: 本发明提供一种橡胶组合物，其通过将每100质量份包含至少50质量％的二烯系橡胶的橡胶组分，20〜150质量份的填料和0.05〜30份的混合物 的具有特定脒结构且具有与二烯系橡胶反应的官能团的化合物A。 橡胶组合物改善了高弹性模量和低tanδ。 本发明还提供了一种使用该橡胶组合物的充气轮胎。

公开(公告)号：US09120193B2

公开(公告)日：2015-09-01

申请号：US13885679

申请日：2011-11-15

Applicant: Yee Ming Stephen Wan ,  Takashi Sato

Inventor： Yee Ming Stephen Wan ,  Takashi Sato

IPC: B24B9/08 ,  B24B1/00 ,  B24B35/00 ,  B24B9/10

CPC classification number: B24B1/005 ,  B24B9/102 ,  B24B35/00

Abstract: Disclosed is a method and apparatus for polishing an edge of an article involving providing at least one carrier including: first and second opposing surfaces defining a groove, the first and second opposing surfaces being spaced apart in a first direction to receive the edge; and magnetic field generator configured to provide a magnetic field in the groove to stiffen magnetorheological (MR) fluid disposed in the groove to provide at least one polishing zone; receiving the edge in the polishing zone; and driving relative motion between the at least one carrier and the edge in a second direction substantially transverse to the first direction.

Abstract translation: 公开了一种用于抛光制品的边缘的方法和装置，包括提供至少一个载体，所述载体包括：限定凹槽的第一和第二相对表面，所述第一和第二相对表面在第一方向上间隔开以接收边缘; 以及磁场发生器，其被配置为在所述凹槽中提供磁场以加强设置在所述凹槽中的磁流变（MR）流体，以提供至少一个抛光区; 接收抛光区中的边缘; 以及在基本上横向于所述第一方向的第二方向上驱动所述至少一个载体和所述边缘之间的相对运动。

公开(公告)号：US08975550B2

公开(公告)日：2015-03-10

申请号：US13344381

申请日：2012-01-05

Applicant: Daisuke Sugai ,  Takashi Sato ,  Tomoaki Utsumi ,  Takashi Shirone ,  Kazuhiro Satou ,  Takafumi Hosono

Inventor： Daisuke Sugai ,  Takashi Sato ,  Tomoaki Utsumi ,  Takashi Shirone ,  Kazuhiro Satou ,  Takafumi Hosono

IPC: H01H9/40 ,  H01H33/666 ,  H01H31/00

CPC classification number: H01H33/6661 ,  H01H31/003

Abstract: A switch unit includes a plurality of switches, which are linearly disposed. The movable electrode in one switch and the fixed electrode in another switch are electrically connected to each other.

Abstract translation: 开关单元包括线性布置的多个开关。 一个开关中的可动电极和另一个开关中的固定电极彼此电连接。