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    Process for producing carboxylated compound
    1.
    发明授权
    Process for producing carboxylated compound 失效
    羧化化合物的制备方法

    公开(公告)号：US5310944A

    公开(公告)日：1994-05-10

    申请号：US975444

    申请日：1992-01-17

    Applicant: Takao Kawaki ,  Yuh Miyauchi ,  Toshio Watanabe ,  Katsushige Hayashi ,  Satoshi Ueno ,  Hiroshi Ogawa ,  Fumiya Zaima

    Inventor： Takao Kawaki ,  Yuh Miyauchi ,  Toshio Watanabe ,  Katsushige Hayashi ,  Satoshi Ueno ,  Hiroshi Ogawa ,  Fumiya Zaima

    IPC: C07B41/08 ,  C07B41/12 ,  C07C51/285 ,  C07D315/00 ,  C07D313/04 ,  C07D307/33 ,  C07D309/30

    CPC classification number: C07D315/00 ,  C07B41/08 ,  C07B41/12 ,  C07C51/285

    Abstract: A process for producing a carboxylated compound, which comprises reacting a carbonyl compound with hydrogen peroxide in the presence of an organo-arsenic acid of the formula (1), ##STR1## wherein: R.sup.1 is a C.sub.1 -C.sub.12 alkyl group which may be substituted or an aryl group which may be substituted,R.sup.2 is a hydroxyl group or the same group as that which defines R.sup.1,or alternatively, R.sup.1 and R.sup.2 may bond to each other to form a five-membered or six-membered ring together with As atoms to which these groups are bonded, andthe substituent(s) substituted on the above groups is/are selected from hydroxyl, carboxyl, carbonyl, sulfonyl, sulfonium, an amino group, an ammonium group, an alkyl group, an alkoxyl group and a halogen atom,while a water concentration in a reaction system is maintained at not more than 2% by weight, thereby to form a corresponding carboxylated compound.

    Abstract translation: 一种羧化化合物的制备方法，其包括在式（1）的有机砷酸存在下使羰基化合物与过氧化氢反应，其中：R1是C1-C12烷基， 可以被取代，或者可以被取代的芳基，R 2是与定义R 1的羟基或者相同的基团，或者，R 1和R 2可以彼此键合以形成五元或六元环在一起 与这些基团键合的As原子，并且上述取代基的取代基选自羟基，羧基，羰基，磺酰基，锍，氨基，铵基，烷基，烷氧基 基团和卤素原子，而反应体系中的水浓度保持在不超过2重量％，从而形成相应的羧化化合物。

    Heat-resistant resin composition
    2.
    发明授权
    Heat-resistant resin composition 失效
    耐热树脂组合物

    公开(公告)号：US5321097A

    公开(公告)日：1994-06-14

    申请号：US054194

    申请日：1993-04-30

    Applicant: Takao Kawaki ,  Akikazu Amagai ,  Masahiko Ishikawa ,  Toshiaki Yamada ,  Yasuhiro Hirai ,  Hajime Ban

    Inventor： Takao Kawaki ,  Akikazu Amagai ,  Masahiko Ishikawa ,  Toshiaki Yamada ,  Yasuhiro Hirai ,  Hajime Ban

    IPC: C08G18/40 ,  C08G18/64 ,  C08L79/08 ,  C08L81/02 ,  C08L81/04

    CPC classification number: C08L79/08 ,  C08G18/4081 ,  C08G18/6438 ,  C08G18/6453 ,  C08L81/02

    Abstract: A heat-resistant resin composition comprising a melt-kneaded product of:(A) at least one member selected from the group consisting of a polyamideimide resin precursor composed mainly of a recurring unit of the formula (1)-a, ##STR1## wherein R is a divalent aromatic group or aliphatic group, R.sup.1 is a hydrogen atom, an alkyl group or a phenyl group, and Ar is a trivalent aromatic group composed of at least one six-membered ring, and a polyamideimide resin composed mainly of a recurring unit of the formula (1)-b, ##STR2## wherein R, R.sup.1 and Ar are as defined in the above formula (1)-a, (B) a polyphenylene sulfide resin, and(C) an organic isocyanate compound having at least two isocyanate groups in the molecule, the amount of said organic isocyanate compound being 0.5 to 5 parts by weight based on 100 parts by weight of the total amount of the compounds (A) and (B).

    Abstract translation: 1.一种耐热性树脂组合物，其特征在于，含有以下物质的熔融混炼物：（A）选自主要由式（1）-a，（IMAGE）的重复单元组成的组的聚酰胺酰亚胺树脂前体中的至少一种 1）-a其中R是二价芳族基团或脂族基团，R1是氢原子，烷基或苯基，Ar是由至少一个六元环组成的三价芳族基团和聚酰胺酰亚胺树脂 主要由式（1）-b，其中R，R 1和Ar如上述式（1）-a定义的重复单元-b，（B）聚苯硫醚树脂， 和（C）分子中具有至少两个异氰酸酯基的有机异氰酸酯化合物，所述有机异氰酸酯化合物的量相对于化合物（A）和（A）的总量的100重量份为0.5〜5重量份， B）。

    Resin composition
    5.
    发明授权
    Resin composition 失效
    树脂组成

    公开(公告)号：US5543474A

    公开(公告)日：1996-08-06

    申请号：US318833

    申请日：1994-10-17

    Applicant: Takao Kawaki ,  Akikazu Amagai ,  Toshiaki Yamada ,  Hidefumi Harada ,  Hajime Ban ,  Yuji Takeda ,  Koji Yamamoto

    Inventor： Takao Kawaki ,  Akikazu Amagai ,  Toshiaki Yamada ,  Hidefumi Harada ,  Hajime Ban ,  Yuji Takeda ,  Koji Yamamoto

    IPC: C08L67/02 ,  C08L79/08 ,  C08L81/02 ,  C08L59/02

    CPC classification number: C08L67/02 ,  C08L79/08 ,  C08L81/02

    Abstract: There is provided a resin composition having well balanced moldability, heat resistance and mechanical strength, which comprises (A) all aromatic polyamideimide resin and (B) a Polyester resin, (C) a polyphenylene sulfide resin or (D) a resin capable of forming an anisotropic molten phase, said aromatic polyamideimide resin containing 5 to 95 mol % of a recurring unit of the formula (1) and 5 to 95 mol % of at least one of a recurring unit of the formula (2) and a recurring unit of the formula (3). Said aromatic polyamideimide resin is prepared by conducting a polymerization reaction of an aromatic tricarboxylic acid anhydride and at least any one of all aromatic dicarboxylic acid and an aliphatic dicarboxylic acid with a diisocyanate compound in plural steps in which in the first step the polymerization reaction is conducted in a temperature range of 50.degree. to 110.degree. C. and in the second and subsequent steps the polymerization reaction is conducted in a temperature range of higher than 110.degree. C. but not higher than 200.degree. C. ##STR1## wherein Ar denotes a trivalent aromatic group, Ar.sub.1 denotes a divalent aromatic group, R.sub.1 denotes a divalent aliphatic group, and R denotes a divalent aromatic or aliphatic group.

    Abstract translation: PCT No.PCT / JP94 / 00232 Sec。 371日期：1994年10月17日 102（e）日期1994年10月17日PCT 1994年2月16日PCT PCT。 出版物WO94 / 19410 日本1994年9月1日提供了具有良好平衡的成型性，耐热性和机械强度的树脂组合物，其包含（A）全芳香族聚酰胺酰亚胺树脂和（B）聚酯树脂，（C）聚苯硫醚树脂或（D） 能够形成各向异性熔融相的树脂，所述芳香族聚酰胺酰亚胺树脂含有5〜95摩尔％的式（1）的重复单元和5〜95摩尔％的式（2）的重复单元中的至少一种， 和式（3）的重复单元。 所述芳香族聚酰胺酰亚胺树脂通过芳族三羧酸酐和至少任意一种芳族二羧酸和脂族二羧酸与二异氰酸酯化合物进行多步反应来制备，其中在第一步中进行聚合反应 在50〜110℃的温度范围内，在第二和随后的步骤中，聚合反应在高于110℃但不高于200℃的温度范围内进行。 （3）其中Ar表示三价芳族基团，Ar 1表示二价芳族基团，R 1表示二价脂肪族基团，R表示二价芳香族或脂肪族基团。

    Photosensitive polyimide precursor
    8.
    发明授权
    Photosensitive polyimide precursor 失效
    感光聚酰亚胺前体

    公开(公告)号：US4861854A

    公开(公告)日：1989-08-29

    申请号：US200864

    申请日：1988-06-01

    Applicant: Akitoshi Sugio ,  Takao Kawaki ,  Makoto Kobayashi ,  Katsushige Hayashi ,  Masahito Watanabe

    Inventor： Akitoshi Sugio ,  Takao Kawaki ,  Makoto Kobayashi ,  Katsushige Hayashi ,  Masahito Watanabe

    IPC: C08G73/10 ,  G03F7/037 ,  G03F7/038

    CPC classification number: G03F7/0387 ,  C08G73/10 ,  C08G73/1053 ,  C08G73/1064 ,  C08G73/1067 ,  C08G73/1071

    Abstract: A photosensitive polyimide precursor composed of the structural units (A) represented by the following general formula (I) and the structural units (B) represented by the following general formula (II), in which the ratio of the molar quantity of the structural units (A) to the sum of the molar quantity of the structural units (A) and that of the structural units (B) is 0.01 or greater, and having a viscosity of 100 cP or above as measured at 25.degree. C. in the state of a 10% by weight solution in N-methylpyrrolidone: ##STR1## wherein R.sub.1 represents a tetravalent aromatic hydrocarbon residue; R.sub.2 represents a divalent aromatic hydrocarbon residue; X, identical or different represents a halogen or an alkyl group; and m represents 0 or an integer from 1 to 4. The photosensitivity of the present photosensitive polyimide precursor is about 20 to 100 times that of conventional products. After heat dehydration cyclization, it shows a heat resistance of 400.degree. C. or above.

    Abstract translation: 由以下通式（I）表示的结构单元（A）和由以下通式（II）表示的结构单元（B））组成的光敏聚酰亚胺前体，其中结构单元 （A）和结构单元（B）的摩尔量的总和为0.01以上，粘度为100cP以上，在该状态下在25℃下测定 的10重量％的N-甲基吡咯烷酮溶液：其中R1表示四价芳烃残基;（I）其中R 1表示四价芳烃残基; R2表示二价芳烃残基; X相同或不同，表示卤素或烷基; m表示0或1〜4的整数。本发明的感光性聚酰亚胺前体的光敏度为常规产品的约20〜100倍。 热脱水环化后，其耐热性为400℃以上。

    Photosensitive polyimide precursor and process for producing the same
    9.
    发明授权
    Photosensitive polyimide precursor and process for producing the same 失效
    感光聚酰亚胺前体及其制备方法

    公开(公告)号：US4670535A

    公开(公告)日：1987-06-02

    申请号：US875044

    申请日：1986-06-17

    Applicant: Akitoshi Sugio ,  Takao Kawaki ,  Katsushige Hayashi

    Inventor： Akitoshi Sugio ,  Takao Kawaki ,  Katsushige Hayashi

    IPC: C08G73/00 ,  C08F290/00 ,  C08F299/02 ,  C08G73/10 ,  C08G73/12 ,  G03F7/038 ,  C08G16/00

    CPC classification number: C08G73/1082 ,  G03F7/0387

    Abstract: The photosensitive polyimide precursor of the invention has a recurring unit represented by the following general formula [I]: ##STR1## (R.sub.1 represents a tetravalent aromatic hydrocarbon residue; R.sub.2 and R.sub.3 each represent a divalent aromatic or aliphatic hydrocarbon residue; and R.sub.4 represents a divalent aromatic hydrocarbon residue represented by ##STR2## wherein R.sub.5, R.sub.6, R.sub.7, R.sub.8, R.sub.9, R.sub.10, R.sub.11 and R.sub.12, identical or different, each represent hydrogen atom, a halogen group or an alkyl group). The photosensitive polyimide precursor of the invention has a viscosity of 50 centipoises or above as measured at 23.degree. C. in the state of a 10% (by weight) solution in N,N-dimethylacetamide. Its photosensitivity is as high as about 20-100 times that of prior products. After heat cyclization, it exhibits a heat resistance of 400.degree. C. or above.The photosensitive polyimide precursor of the invention can be produced by subjecting a tetracarboxylic acid dianhydride and a diamino compound to a polycondensation reaction in an organic polar solvent.

    Abstract translation: 本发明的光敏聚酰亚胺前体具有由以下通式[I]表示的重复单元：（R 1表示四价芳烃残基; R 2和R 3各自表示二价芳族或脂族烃 R4代表由下式表示的二价芳烃残基：其中R5，R6，R7，R8，R9，R10，R11和R12相同或不同，分别代表氢原子，卤素基团或烷基）。 本发明的光敏聚酰亚胺前体在23℃下的粘度为10厘泊（N，N-二甲基乙酰胺）溶液的状态下的粘度为50厘泊或更高。 其光敏度高达现有产品的约20-100倍。 热环化后，其耐热性为400℃以上。 本发明的感光性聚酰亚胺前体可以通过在有机极性溶剂中使四羧酸二酐和二氨基化合物进行缩聚反应来制造。

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