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    MULTI-LAYER METAL SUPPORT
    2.
    发明申请
    MULTI-LAYER METAL SUPPORT 审中-公开
    多层金属支持

    公开(公告)号：US20130200497A1

    公开(公告)日：2013-08-08

    申请号：US13558836

    申请日：2012-07-26

    申请人： Venkatesan Murali ,  Thomas Edward Dinan, JR. ,  Steve Bababyan ,  Gopal Prabhu ,  Christopher J. Petti

    发明人： Venkatesan Murali ,  Thomas Edward Dinan, JR. ,  Steve Bababyan ,  Gopal Prabhu ,  Christopher J. Petti

    IPC分类号： H01L21/20 ,  H01L29/06

    CPC分类号： H01L29/06 ,  H01L21/265

    摘要： The invention provides a method of forming an electronic device from a lamina that has a coefficient of thermal expansion that is matched or nearly matched to a constructed metal support. In some embodiments the method comprises implanting the top surface of a donor body with an ion dosage to form a cleave plane followed by exfoliating a lamina from the donor body. After exfoliating the lamina, a flexible metal support that has a coefficient of thermal expansion with a value that is within 10% of the value of the coefficient of thermal expansion of the lamina is constructed on the lamina. In some embodiments the coefficients of thermal expansion of the metal support and the lamina are within 10% or within 5% of each other between the temperatures of 500 and 1050° C.

    摘要翻译： 本发明提供了一种从薄片形成电子器件的方法，其具有与构造的金属支撑件匹配或接近匹配的热膨胀系数。 在一些实施方案中，该方法包括用离子剂量植入供体体的顶表面以形成切割平面，随后从供体体剥离薄片。 在剥离层之后，在层板上形成具有热膨胀系数为10％以内的层的热膨胀系数的柔性金属支撑体。 在一些实施例中，金属载体和薄层的热膨胀系数在500和1050℃的温度之间彼此的10％或5％以内。

    Multi-layer metal support
    3.
    发明授权
    Multi-layer metal support 有权
    多层金属支撑

    公开(公告)号：US08916954B2

    公开(公告)日：2014-12-23

    申请号：US13558826

    申请日：2012-07-26

    申请人： Venkatesan Murali ,  Thomas Edward Dinan, Jr. ,  Steve Bababyan ,  Gopal Prabhu

    发明人： Venkatesan Murali ,  Thomas Edward Dinan, Jr. ,  Steve Bababyan ,  Gopal Prabhu

    IPC分类号： H01L29/06

    CPC分类号： H01L21/84 ,  H01L31/1892 ,  Y02E10/50

    摘要： The invention provides a method of forming an electronic device from a lamina that has a coefficient of thermal expansion that is matched or nearly matched to a constructed metal support. In some embodiments the method comprises implanting the top surface of a donor body with an ion dosage to form a cleave plane followed by exfoliating a lamina from the donor body. After exfoliating the lamina, a flexible metal support that has a coefficient of thermal expansion with a value that is within 10% of the value of the coefficient of thermal expansion of the lamina is constructed on the lamina. In some embodiments the coefficients of thermal expansion of the metal support and the lamina are within 10% or within 5% of each other between the temperatures of 100 and 600° C.

    摘要翻译： 本发明提供了一种从薄片形成电子器件的方法，其具有与构造的金属支撑件匹配或接近匹配的热膨胀系数。 在一些实施方案中，该方法包括用离子剂量植入供体体的顶表面以形成切割平面，随后从供体体剥离薄片。 在剥离层之后，在层板上形成具有热膨胀系数为10％以内的层的热膨胀系数的柔性金属支撑体。 在一些实施例中，金属载体和薄层的热膨胀系数在100和600℃的温度之间彼此的10％或5％以内。

    MULTI-LAYER METAL SUPPORT
    5.
    发明申请
    MULTI-LAYER METAL SUPPORT 有权
    多层金属支持

    公开(公告)号：US20130200496A1

    公开(公告)日：2013-08-08

    申请号：US13558826

    申请日：2012-07-26

    申请人： Venkatesan Murali ,  Thomas Edward Dinan, JR. ,  Steve Bababyan ,  Gopal Prabhu

    发明人： Venkatesan Murali ,  Thomas Edward Dinan, JR. ,  Steve Bababyan ,  Gopal Prabhu

    IPC分类号： H01L21/30 ,  H01L29/02 ,  H01L21/20

    CPC分类号： H01L21/84 ,  H01L31/1892 ,  Y02E10/50

    摘要： The invention provides a method of forming an electronic device from a lamina that has a coefficient of thermal expansion that is matched or nearly matched to a constructed metal support. In some embodiments the method comprises implanting the top surface of a donor body with an ion dosage to form a cleave plane followed by exfoliating a lamina from the donor body. After exfoliating the lamina, a flexible metal support that has a coefficient of thermal expansion with a value that is within 10% of the value of the coefficient of thermal expansion of the lamina is constructed on the lamina. In some embodiments the coefficients of thermal expansion of the metal support and the lamina are within 10% or within 5% of each other between the temperatures of 100 and 600 ° C.

    摘要翻译： 本发明提供了一种从薄片形成电子器件的方法，其具有与构造的金属支撑件匹配或接近匹配的热膨胀系数。 在一些实施方案中，该方法包括用离子剂量植入供体体的顶表面以形成切割平面，随后从供体体剥离薄片。 在剥离层之后，在层板上形成具有热膨胀系数为10％以内的层的热膨胀系数的柔性金属支撑体。 在一些实施例中，金属载体和薄层的热膨胀系数在100和600℃的温度之间彼此的10％或5％以内。