知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

119 records (took 0.028 seconds)

    Transistor employing vertically stacked self-aligned carbon nanotubes
    3.
    发明授权
    Transistor employing vertically stacked self-aligned carbon nanotubes 有权
    晶体管采用垂直堆叠的自对准碳纳米管

    公开(公告)号：US08895371B2

    公开(公告)日：2014-11-25

    申请号：US13605238

    申请日：2012-09-06

    Applicant: Qing Cao ,  Dechao Guo ,  Shu-Jen Han ,  Yu Lu ,  Keith Kwong Hon Wong

    Inventor： Qing Cao ,  Dechao Guo ,  Shu-Jen Han ,  Yu Lu ,  Keith Kwong Hon Wong

    IPC: H01L21/335 ,  H01L51/05 ,  H01L29/775 ,  H01L29/66 ,  H01L51/00 ,  H01L29/12 ,  B82Y10/00 ,  B82Y30/00 ,  H01L29/78

    CPC classification number: H01L51/057 ,  B82Y10/00 ,  B82Y30/00 ,  H01L29/125 ,  H01L29/66439 ,  H01L29/775 ,  H01L29/7827 ,  H01L51/0045 ,  H01L51/0048 ,  Y10S977/742 ,  Y10S977/842 ,  Y10S977/938

    Abstract: A fin structure including a vertical alternating stack of a first isoelectric point material layer having a first isoelectric point and a second isoelectric material layer having a second isoelectric point less than the first isoelectric point is formed. The first and second isoelectric point material layers become oppositely charged in a solution with a pH between the first and second isoelectric points. Negative electrical charges are imparted onto carbon nanotubes by an anionic surfactant to the solution. The electrostatic attraction causes the carbon nanotubes to be selectively attached to the surfaces of the first isoelectric point material layer. Carbon nanotubes are attached to the first isoelectric point material layer in self-alignment along horizontal lengthwise directions of the fin structure. A transistor can be formed, which employs a plurality of vertically aligned horizontal carbon nanotubes as the channel.

    Abstract translation: 形成包括具有第一等电点的第一等电点材料层和具有小于第一等电点的第二等电点的第二等电子材料层的垂直交替堆叠的鳍结构。 第一和第二等电点材料层在具有第一和第二等电点之间的pH的溶液中相反地充电。 通过阴离子表面活性剂将负电荷赋予碳纳米管。 静电引力使得碳纳米管选择性地附着在第一等电点材料层的表面上。 碳纳米管沿翅片结构的水平长度方向自对准地附接到第一等电点材料层。 可以形成晶体管，其采用多个垂直排列的水平碳纳米管作为沟道。

    Vertical stacking of carbon nanotube arrays for current enhancement and control
    4.
    发明授权
    Vertical stacking of carbon nanotube arrays for current enhancement and control 有权
    用于当前增强和控制的碳纳米管阵列的垂直堆叠

    公开(公告)号：US08890116B2

    公开(公告)日：2014-11-18

    申请号：US13610089

    申请日：2012-09-11

    Applicant: Zhihong Chen ,  Aaron Daniel Franklin ,  Shu-Jen Han

    Inventor： Zhihong Chen ,  Aaron Daniel Franklin ,  Shu-Jen Han

    IPC: H01L29/06 ,  H01L51/00 ,  B82Y10/00 ,  H01L51/05

    CPC classification number: H01L51/0048 ,  B82Y10/00 ,  H01L51/0558 ,  Y10S977/742 ,  Y10S977/938

    Abstract: Transistor devices having vertically stacked carbon nanotube channels and techniques for the fabrication thereof are provided. In one aspect, a transistor device is provided. The transistor device includes a substrate; a bottom gate embedded in the substrate with a top surface of the bottom gate being substantially coplanar with a surface of the substrate; a stack of device layers on the substrate over the bottom gate, wherein each of the device layers in the stack includes a first dielectric, a carbon nanotube channel on the first dielectric, a second dielectric on the carbon nanotube channel and a top gate on the second dielectric; and source and drain contacts that interconnect the carbon nanotube channels in parallel. A method of fabricating a transistor device is also provided.

    Abstract translation: 提供具有垂直堆叠的碳纳米管通道的晶体管器件及其制造技术。 一方面，提供一种晶体管器件。 晶体管器件包括衬底; 嵌入基板中的底栅与底栅的顶表面基本上与基板的表面共面; 在底栅上的衬底上的一叠器件层，其中堆叠中的每个器件层包括第一电介质，第一电介质上的碳纳米管通道，碳纳米管通道上的第二电介质和 第二电介质; 以及并联连接碳纳米管通道的源极和漏极触点。 还提供了一种制造晶体管器件的方法。

    Transistor device with reduced gate resistance
    6.
    发明授权
    Transistor device with reduced gate resistance 有权
    具有降低栅极电阻的晶体管器件

    公开(公告)号：US08642997B2

    公开(公告)日：2014-02-04

    申请号：US13610381

    申请日：2012-09-11

    Applicant: Shu-Jen Han ,  Alberto Valdes Garcia

    Inventor： Shu-Jen Han ,  Alberto Valdes Garcia

    IPC: H01L29/775

    CPC classification number: H01L29/66742 ,  H01L29/42384 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78636 ,  H01L29/78684

    Abstract: A device with reduced gate resistance includes a gate structure having a first conductive portion and a second conductive portion formed in electrical contact with the first conductive portion and extending laterally beyond the first conductive portion. The gate structure is embedded in a dielectric material and has a gate dielectric on the first conductive portion. A channel layer is provided over the first conductive portion. Source and drain electrodes are formed on opposite end portions of a channel region of the channel layer. Methods for forming a device with reduced gate resistance are also provided.

    Abstract translation: 具有降低的栅极电阻的器件包括具有第一导电部分和形成为与第一导电部分电接触并且横向延伸超过第一导电部分延伸的第二导电部分的栅极结构。 栅极结构嵌入电介质材料中，并且在第一导电部分上具有栅极电介质。 沟道层设置在第一导电部分上。 源极和漏极形成在沟道层的沟道区的相对端部上。 还提供了形成栅极电阻降低的器件的方法。

    Method of providing threshold voltage adjustment through gate dielectric stack modification
    9.
    发明授权
    Method of providing threshold voltage adjustment through gate dielectric stack modification 有权
    通过栅介质叠层修改提供阈值电压调整的方法

    公开(公告)号：US08354309B2

    公开(公告)日：2013-01-15

    申请号：US13347014

    申请日：2012-01-10

    Applicant: Brian J. Greene ,  Michael P. Chudzik ,  Shu-Jen Han ,  William K. Henson ,  Yue Liang ,  Edward P. Maciejewski ,  Myung-Hee Na ,  Edward J. Nowak ,  Xiaojun Yu

    Inventor： Brian J. Greene ,  Michael P. Chudzik ,  Shu-Jen Han ,  William K. Henson ,  Yue Liang ,  Edward P. Maciejewski ,  Myung-Hee Na ,  Edward J. Nowak ,  Xiaojun Yu

    IPC: H01L21/00 ,  H01L21/84

    CPC classification number: H01L21/823462 ,  H01L21/28229 ,  H01L21/84 ,  H01L27/1203

    Abstract: Multiple types of gate stacks are formed on a doped semiconductor well. A high dielectric constant (high-k) gate dielectric is formed on the doped semiconductor well. A metal gate layer is formed in one device area, while the high-k gate dielectric is exposed in other device areas. Threshold voltage adjustment oxide layers having different thicknesses are formed in the other device areas. A conductive gate material layer is then formed over the threshold voltage adjustment oxide layers. One type of field effect transistors includes a gate dielectric including a high-k gate dielectric portion. Other types of field effect transistors include a gate dielectric including a high-k gate dielectric portion and a first threshold voltage adjustment oxide portions having different thicknesses. Field effect transistors having different threshold voltages are provided by employing different gate dielectric stacks and doped semiconductor wells having the same dopant concentration.

    Abstract translation: 在掺杂半导体阱上形成多种类型的栅叠层。 在掺杂半导体阱上形成高介电常数（高k）栅极电介质。 在一个器件区域中形成金属栅极层，而在其他器件区域中暴露高k栅极电介质。 在其他器件区域中形成具有不同厚度的阈值电压调节氧化物层。 然后在阈值电压调整氧化物层上形成导电栅极材料层。 一种类型的场效应晶体管包括包括高k栅极电介质部分的栅极电介质。 其他类型的场效应晶体管包括包括高k栅极电介质部分的栅极电介质和具有不同厚度的第一阈值电压调整氧化物部分。 具有不同阈值电压的场效应晶体管通过采用具有相同掺杂剂浓度的不同栅极电介质叠层和掺杂半导体阱来提供。

    GRAPHENE SENSOR
    10.
    发明申请
    GRAPHENE SENSOR 审中-公开
    石墨传感器

    公开(公告)号：US20120329193A1

    公开(公告)日：2012-12-27

    申请号：US13605107

    申请日：2012-09-06

    Applicant: Dechao Guo ,  Shu-Jen Han ,  Chung-Hsun Lin ,  Ning Su

    Inventor： Dechao Guo ,  Shu-Jen Han ,  Chung-Hsun Lin ,  Ning Su

    IPC: H01L21/336

    CPC classification number: G01N27/4145 ,  G01N27/4146 ,  H01L29/1606 ,  H01L29/42384 ,  H01L29/4908 ,  H01L29/66742 ,  H01L29/78684 ,  H01L51/0048

    Abstract: A method for forming a sensor includes forming a channel in substrate, forming a sacrificial layer in the channel, forming a sensor having a first dielectric layer disposed on the substrate, a graphene layer disposed on the first dielectric layer, and a second dielectric layer disposed on the graphene layer, a source region, a drain region, and a gate region, wherein the gate region is disposed on the sacrificial layer removing the sacrificial layer from the channel.

    Abstract translation: 一种用于形成传感器的方法，包括在衬底中形成通道，在通道中形成牺牲层，形成具有设置在衬底上的第一介电层的传感器，设置在第一电介质层上的石墨烯层，以及设置在第二电介质层 在石墨烯层上，源区域，漏极区域和栅极区域，其中栅极区域设置在牺牲层上，从沟道去除牺牲层。

Patent Agency Ranking