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公开(公告)号：US07397322B2
公开(公告)日：2008-07-08
申请号：US11297740
申请日：2005-12-08
CPC分类号： H05K1/165 , H04B3/28 , H05K1/0233 , H05K1/0237 , H05K2201/09236
摘要： A radiation noise suppression circuit for a differential transmission line includes a differential transmission line which has plus line signal wiring to which a plus line signal of a differential signal is applied, and minus line signal wiring to which a minus line signal of the differential signal is applied, and connects a differential driver and a differential receiver. Plus line signal GND wiring and minus line signal GND wiring which are connected between the differential driver and the differential receiver are wired along the differential transmission line. A distance between the plus line signal wiring and the plus line signal GND wiring is substantially equal to a distance between the minus line signal wiring and the minus line signal GND wiring.
摘要翻译： 用于差分传输线的辐射噪声抑制电路包括差分传输线，其具有加上差分信号的正线信号的正线信号布线和差分信号的负线信号的负线信号布线 应用并连接差分驱动器和差分接收器。 连接在差分驱动器和差分接收器之间的线路信号GND布线和负线信号GND布线沿差动传输线进行布线。 正线信号线和正线信号GND布线之间的距离基本上等于负线信号线和负线信号GND布线之间的距离。
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公开(公告)号：US20060125570A1
公开(公告)日：2006-06-15
申请号：US11297288
申请日：2005-12-08
IPC分类号： H04B3/28
CPC分类号： H04B3/30
摘要： A radiation noise suppression circuit for a differential transmission line includes a differential transmission line which has plus line signal wiring of a differential signal and minus line signal wiring of the differential signal, and connects a differential driver and a differential receiver; signal GND wiring one end of which is connected to the differential driver, and is wired outside along the differential transmission line; a coil unit in which each of the plus line signal wiring, the minus line signal wiring, and said signal GND wiring is wound in the same winding direction; a first impedance element and a second impedance element which have substantially the same impedance value, and which are connected in series between the plus line signal wiring and the minus line signal wiring at a location nearer to the differential receiver than the coil unit; and, a third impedance element one end of which is connected to a junction point, where the first impedance element and the second impedance element are connected, and another end of which is connected to another end of the signal GND wiring.
摘要翻译： 用于差动传输线的辐射噪声抑制电路包括具有差分信号的正线信号布线和差分信号的负线信号布线的差分传输线，并连接差分驱动器和差分接收器; 信号GND布线，其一端连接到差分驱动器，并沿着差动传输线接线到外部; 线圈单元，其中正线信号布线，负线信号布线和所述信号GND布线中的每一个以相同的卷绕方向缠绕; 第一阻抗元件和第二阻抗元件，其具有基本相同的阻抗值，并且在比线圈单元更靠近差分接收器的位置处串联连接在正线信号布线和负线信号布线之间; 以及第三阻抗元件，其一端连接到第一阻抗元件和第二阻抗元件连接的接合点，并且另一端连接到信号GND布线的另一端。
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公开(公告)号：US06794283B2
公开(公告)日：2004-09-21
申请号：US09320271
申请日：1999-05-27
申请人： Hiroyuki Watanabe , Hideki Mizuhara , Shinichi Tanimoto , Atsuhiro Nishida , Yoshikazu Yamaoka , Yasunori Inoue
发明人： Hiroyuki Watanabe , Hideki Mizuhara , Shinichi Tanimoto , Atsuhiro Nishida , Yoshikazu Yamaoka , Yasunori Inoue
IPC分类号： H01L214763
CPC分类号： H01L21/02126 , H01L21/022 , H01L21/02274 , H01L21/02351 , H01L21/31155 , H01L21/316 , H01L21/76801 , H01L21/76807 , H01L21/76808 , H01L21/7681 , H01L21/76825 , H01L23/5226 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device superior in reliability and suitable for microminiaturization is provided. An organic SOG film is formed on a silicon oxide film. Boron ions are implanted into the organic SOG film. By introducing boron ions into the organic SOG film, the organic components in the film are decomposed. Also, the moisture and hydroxyl group included in the film are reduced. After a metal interconnection is embedded in a modified SOG film by the Damascene method, a modified SOG film is formed thereon. Then, contact holes are formed. After a contact hole interconnection is embedded in the contact holes, a modified SOG film and an upper metal interconnection are formed by the Damascene method.
摘要翻译： 提供了可靠性优异并且适合于微型化的半导体器件。 在氧化硅膜上形成有机SOG膜。 将硼离子注入到有机SOG膜中。 通过将硼离子引入有机SOG膜中，膜中的有机成分被分解。 此外，膜中包含的水分和羟基也被还原。 通过镶嵌法将金属互连嵌入改性SOG膜中之后，形成改性SOG膜。 然后，形成接触孔。 在接触孔嵌入接触孔互连后，通过镶嵌法形成改性SOG膜和上金属互连。
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4.发明授权Computer aided design apparatus for aiding design of a printed wiring board to effectively reduce noise 失效计算机辅助设计设备，用于协助设计印刷电路板，有效降低噪音公开(公告)号：US06631509B2
公开(公告)日：2003-10-07
申请号：US09771843
申请日：2001-01-29
IPC分类号： G06F1750
CPC分类号： G06F17/5068 , H05K1/0231 , H05K3/0005
摘要： A CAD apparatus includes a determining unit for determining a component order in ascending order of impedance of components for passive components amongst components to be placed on a printed wiring board. The CAD apparatus places each passive component in the determined component order in a vicinity of power pins of non-passive components that are already placed.
摘要翻译： CAD装置包括：确定单元，用于以放置在印刷线路板上的各组件之间的无源部件的部件的阻抗的升序来确定部件顺序。 CAD装置将已被放置的非被动部件的电源引脚附近的确定的分量顺序中的每个无源部件。
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5.发明授权Method for forming low-leakage impurity regions by sequence of high-and low-temperature treatments 有权通过高温和低温处理顺序形成低泄漏杂质区的方法公开(公告)号：US06342440B1
公开(公告)日：2002-01-29
申请号：US09518246
申请日：2000-03-03
IPC分类号： H01L21425
CPC分类号： H01L29/6659 , H01L21/26513 , H01L21/324 , H01L21/8234 , H01L29/665
摘要： A method of manufacturing a semiconductor device capable of suppressing increase of a leakage current resulting from a high-temperature heat treatment is obtained. In this manufacturing method, an impurity region is formed by selectively ion-implanting an impurity into the main surface of a semiconductor substrate. The impurity region is activated by performing a high-temperature heat treatment. The semiconductor device is recovered from crystal defects resulting from the high-temperature heat treatment by performing a low-temperature heat treatment after performing the high-temperature heat treatment. According to this manufacturing method, the semiconductor device is recovered from the crystal defects resulting from the ion implantation by the high-temperature heat treatment, and recovered from the crystal defects resulting from the high-temperature heat treatment by the low-temperature heat treatment. Thus, increase of a leakage current caused by the crystal defects resulting from the high-temperature heat treatment can be effectively prevented.
摘要翻译： 获得能够抑制由高温热处理引起的漏电流增加的半导体装置的制造方法。 在该制造方法中，通过选择性地将杂质离子注入到半导体衬底的主表面中来形成杂质区。 通过进行高温热处理来激活杂质区域。 通过在进行高温热处理后进行低温热处理，从高温热处理得到的晶体缺陷中回收半导体装置。 根据该制造方法，通过高温热处理从离子注入产生的晶体缺陷中回收半导体器件，并且通过低温热处理从高温热处理引起的晶体缺陷中回收。 因此，可以有效地防止由高温热处理引起的晶体缺陷引起的漏电流的增加。
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公开(公告)号：US5635763A
公开(公告)日：1997-06-03
申请号：US215374
申请日：1994-03-21
申请人： Yasunori Inoue , Kazutoshi Tsujimura , Shinichi Tanimoto , Yasuhiko Yamashita , Kiyoshi Yoneda , Yoshikazu Ibara
发明人： Yasunori Inoue , Kazutoshi Tsujimura , Shinichi Tanimoto , Yasuhiko Yamashita , Kiyoshi Yoneda , Yoshikazu Ibara
IPC分类号： H01L23/532 , H01L23/48
CPC分类号： H01L23/53223 , H01L2924/0002
摘要： A semiconductor device is disclosed, which includes an insulating layer and an interconnection layer having a conductive layer provided over the insulating layer. The interconnection layer is patterned by photolithography. The device further includes a cap-metal layer, which is deposited on the conductive layer and suppresses reflection of light beams at the time of patterning the interconnection layer. The cap-metal layer has any one of the following structures: a double-layered structure having a titanium nitride layer and a titanium layer located between the titanium nitride layer and the conductive layer; a double-layered structure having a titanium nitride layer and an aluminum-titanium alloy layer located between the titanium nitride layer and the conductive layer; and a single-layered structure consisting essentially of an aluminum-titanium alloy. These design ensure accurate interconnection patterning in the photolithography, and provide improved EM and SM immunities of the interconnection.
摘要翻译： 公开了一种半导体器件，其包括绝缘层和在绝缘层上设置有导电层的互连层。 通过光刻将互连层图案化。 该装置还包括帽形金属层，其沉积在导电层上并抑制在构图互连层时光束的反射。 帽金属层具有以下结构之一：具有氮化钛层和位于氮化钛层和导电层之间的钛层的双层结构; 具有氮化钛层和位于氮化钛层和导电层之间的铝 - 钛合金层的双层结构; 以及主要由铝 - 钛合金组成的单层结构。 这些设计确保在光刻中精确的互连图案化，并且提供互连的改善的EM和SM抗扰度。
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公开(公告)号：US07741876B2
公开(公告)日：2010-06-22
申请号：US12108739
申请日：2008-04-24
IPC分类号： H03K19/094 , H03K19/0175
CPC分类号： H04B3/34 , H01L2224/48137 , H01L2224/49175 , H01L2924/3011 , H04L25/0272 , H05K1/0245 , H05K1/0248 , H05K1/0298 , H05K2201/09236 , H05K2201/09672 , H01L2924/00
摘要： A differential transmission line that has three or more signal lines and with which there is little unwanted radiation noise is provided. The differential transmission line 2 is provided with three signal lines 2a, 2b, and 2c that transmit differential signals from a differential driver IC1 to a differential receiver IC3, and the majority of the signal lines 2a, 2b, and 2c is provided in conductor layers T2 and T3 of a printed circuit board 4. The signal lines 2a, 2b, and 2c are provided with a signal line parallel segment, a signal line route length adjustment segment that is on the differential driver IC1 side and that connects from differential signal output terminals 1Ea, 1Eb, and 1Ec in the differential driver IC1 to the signal line parallel segment, and a signal line route length adjustment segment that is on the differential receiver IC3 side and that connects from the signal line parallel segment to differential signal input terminals in the differential receiver IC3, wherein the signal lines 2a, 2b, and 2c are formed such that their signal line route length adjustment segments on the differential driver IC1 side are equal in length to one another.
摘要翻译： 提供具有三条或更多条信号线并且几乎不存在不需要的辐射噪声的差分传输线。 差分传输线2设置有将差分信号从差分驱动器IC1传输到差分接收器IC3的三条信号线2a，2b和2c，并且大部分信号线2a，2b和2c设置在导体层 信号线2a，2b，2c设置有信号线并行段，信号线路径长度调节段，位于差分驱动器IC1侧，并从差动信号输出端 差分驱动器IC1中的端子1Ea，1Eb和1Ec与信号线并联段，以及信号线路径长度调节段，位于差分接收器IC3侧，并且从信号线并行段连接到差分信号输入端 差分接收器IC3，其中信号线2a，2b和2c形成为使得它们的信号线路径长度调节段在差分驱动器IC1侧 长度相等。
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公开(公告)号：US20080304578A1
公开(公告)日：2008-12-11
申请号：US12135668
申请日：2008-06-09
CPC分类号： H04B3/30 , H01B11/00 , H04L25/0272
摘要： A transmission cable that has three signal lines, and in which there is little unwanted radiation noise, is provided. In a section that is perpendicular to the longitudinal direction of the differential transmission cable, the distance between any two signal lines of the three signal lines is equal to a predetermined value. The differential transmission cable is twisted in its longitudinal direction. The differential transmission cable further includes a dielectric core line, and the signal lines are formed on the surface of the dielectric core line. In the differential transmission cable, the signal lines are formed in a helix in the longitudinal direction of the dielectric core line.
摘要翻译： 提供具有三条信号线并且其中没有不希望的辐射噪声的传输电缆。 在与差动传输电缆的纵向方向垂直的部分中，三条信号线的任意两条信号线之间的距离等于预定值。 差速传动电缆在其纵向方向上扭转。 差分传输电缆还包括介质芯线，并且信号线形成在介质芯线的表面上。 在差分传输电缆中，信号线在介质芯线的纵向上以螺旋形成。
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公开(公告)号：US07388449B2
公开(公告)日：2008-06-17
申请号：US11297288
申请日：2005-12-08
CPC分类号： H04B3/30
摘要： A radiation noise suppression circuit for a differential transmission line includes a differential transmission line which has plus line signal wiring of a differential signal and minus line signal wiring of the differential signal, and connects a differential driver and a differential receiver; signal GND wiring. A first impedance element and a second impedance element have substantially the same impedance value, and are connected in series between the plus line signal wiring and the minus line signal wiring at a location nearer to the differential receiver than a coil unit. A third impedance element is connected to a junction point. The first impedance element and the second impedance element are connected.
摘要翻译： 用于差动传输线的辐射噪声抑制电路包括具有差分信号的正线信号布线和差分信号的负线信号布线的差分传输线，并连接差分驱动器和差分接收器; 信号GND接线。 第一阻抗元件和第二阻抗元件具有基本上相同的阻抗值，并且在比线圈单元更接近差分接收器的位置处串联连接在正线信号布线和负线信号布线之间。 第三阻抗元件连接到连接点。 连接第一阻抗元件和第二阻抗元件。
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10.发明授权Wiring board design aiding apparatus, design aiding method, storage medium, and computer program 失效接线板设计辅助设备，设计辅助方法，存储介质和计算机程序公开(公告)号：US07257792B2
公开(公告)日：2007-08-14
申请号：US10151368
申请日：2002-05-20
IPC分类号： G06F17/50
CPC分类号： H05K3/0005 , G06F17/5072 , H05K1/0269 , H05K3/303 , H05K3/4644 , H05K2201/09227
摘要： In a design aiding apparatus of the present invention, a plane clearance setting unit acquires information showing a predetermined margin, a component placement unit determines a placement area of a component such that, as seen in a lamination direction of a multilayer wiring board, at least one of the component and a pad connected to the component is included within a candidate area of a plane foil excluding a perimeter area, and a wiring unit determines a placement area of a wiring foil and a via in the same way that the placement area of the component is determined. Furthermore, in regard to a component, a component pad, a wiring foil, and a via whose placement areas have already been determined, a component placement inspection unit reports a design condition violation if the placement area of at least one of the component and the pad deviates outside the candidate area as seen in the lamination direction of the board, and a wiring inspection unit reports a design condition violation if the placement area of the wiring foil or the via deviates outside the candidate area as seen in the lamination direction of the board.
摘要翻译： 在本发明的设计辅助装置中，平面间隙设定单元获取表示预定余量的信息，部件放置单元确定部件的放置面积，使得从多层布线基板的层叠方向看，至少 连接到部件的部件和焊盘中的一个包括在除了周边区域之外的平面箔的候选区域内，并且布线单元以与布置箔和通孔的放置面积相同的方式确定布线箔和通孔的放置面积 确定组件。 此外，对于已经确定了放置区域的部件，部件焊盘，布线箔和通孔，如果部件和部件的至少一个的放置区域，则部件放置检查单元报告设计条件违反 如从电路板的层压方向看，偏移在候选区域外面，如果布线箔或通孔的放置区域偏离候选区域，则布线检查单元报告设计条件违反， 板。
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