Pulverizing apparatus and pulverizing method
    1.
    发明授权
    Pulverizing apparatus and pulverizing method 有权
    粉碎设备和粉碎方法

    公开(公告)号:US09409179B2

    公开(公告)日:2016-08-09

    申请号:US13579309

    申请日:2011-02-21

    摘要: A pulverizing apparatus for pulverizing a hard resin composition has a pulverizing mechanism having a pair of rollers arranged parallel to one another, these rollers pulverizing the hard resin composition by pressuring the hard resin composition between the rollers and a cooling device for cooling the hard resin composition during the hard resin composition being pulverized. Each of the rollers has a cylindrical shape with a hollow portion and the cooling device is configured to supply a coolant into the hollow portion of each of the rollers. The coolant flows in the hollow portion of each of the rollers in a longitudinal direction of each of the rollers. The cooling device has facilitating members respectively inserted into the hollow portions of the rollers.

    摘要翻译: 用于粉碎硬质树脂组合物的粉碎装置具有一个具有彼此平行布置的一对辊的粉碎机构,这些辊通过将辊之间的硬树脂组合物加压和用于冷却硬树脂组合物的冷却装置来粉碎硬树脂组合物 在硬质树脂组合物被粉碎的过程中。 每个辊具有中空部分的圆柱形形状,并且冷却装置构造成将冷却剂供应到每个辊的中空部分中。 冷却剂沿每个辊的纵向在每个辊的中空部分中流动。 冷却装置具有分别插入辊的中空部分中的便利构件。

    Degassing apparatus
    2.
    发明授权
    Degassing apparatus 有权
    脱气装置

    公开(公告)号:US08906147B2

    公开(公告)日:2014-12-09

    申请号:US13574841

    申请日:2011-02-01

    摘要: A degassing apparatus 1 includes a housing 2 having a degassing chamber 22, a rotor 3 rotatably provided in the housing 2 and a decompressing mechanism 4 for decompressing the degassing chamber 22 of the housing 2. The housing 2 further includes a conduit line 21 and a cylindrical portion 23. The degassing chamber 22 is provided in a middle part of the conduit line 21. An upper end of the conduit line 21 constitutes an inlet port 24 and a lower end of the conduit line 21 constitutes an outlet port 25. The rotor 3 is rotatably provided inside the cylindrical portion 23 so that a passage between the outlet portion 25 and the degassing chamber 22 can be hermetically separated by the rotor 3. The rotor 3 has four partitioning plates 31 which partition the inside of the cylindrical portion into four spaces 231-234.

    摘要翻译: 脱气装置1包括具有脱气室22的壳体2,可旋转地设置在壳体2中的转子3和用于使壳体2的脱气室22减压的减压机构4.壳体2还包括导管21和 脱气室22设置在导管21的中间部分。导管21的上端构成入口24,导管21的下端构成出口25.转子 3可旋转地设置在圆筒部23的内部,使得出口部分25和脱气室22之间的通道可以被转子3气密地分开。转子3具有四个分隔板31,其将圆筒部分的内部分成四个 空格231-234。

    DEGASSING APPARATUS
    3.
    发明申请
    DEGASSING APPARATUS 有权
    脱脂装置

    公开(公告)号:US20120291631A1

    公开(公告)日:2012-11-22

    申请号:US13574841

    申请日:2011-02-01

    IPC分类号: B01D19/00

    摘要: A degassing apparatus 1 includes a housing 2 having a degassing chamber 22, a rotor 3 rotatably provided in the housing 2 and a decompressing mechanism 4 for decompressing the degassing chamber 22 of the housing 2. The housing 2 further includes a conduit line 21 and a cylindrical portion 23. The degassing chamber 22 is provided in a middle part of the conduit line 21. An upper end of the conduit line 21 constitutes an inlet port 24 and a lower end of the conduit line 21 constitutes an outlet port 25. The rotor 3 is rotatably provided inside the cylindrical portion 23 so that a passage between the outlet portion 25 and the degassing chamber 22 can be hermetically separated by the rotor 3. The rotor 3 has four partitioning plates 31 which partition the inside of the cylindrical portion into four spaces 231-234.

    摘要翻译: 脱气装置1包括具有脱气室22的壳体2,可旋转地设置在壳体2中的转子3和用于使壳体2的脱气室22减压的减压机构4.壳体2还包括导管21和 脱气室22设置在导管21的中间部分。导管21的上端构成入口24,导管21的下端构成出口25.转子 3可旋转地设置在圆筒部23的内部,使得出口部分25和脱气室22之间的通道可以被转子3气密地分开。转子3具有四个分隔板31,其将圆筒部分的内部分成四个 空格231-234。

    PULVERIZING APPARATUS AND PULVERIZING METHOD
    4.
    发明申请
    PULVERIZING APPARATUS AND PULVERIZING METHOD 有权
    PULVERIZING装置和粉碎方法

    公开(公告)号:US20120318896A1

    公开(公告)日:2012-12-20

    申请号:US13579309

    申请日:2011-02-21

    摘要: A pulverizing apparatus for pulverizing a hard resin composition has a pulverizing mechanism having a pair of rollers arranged parallel to one another, these rollers pulverizing the hard resin composition by pressuring the hard resin composition between the rollers and a cooling device for cooling the hard resin composition during the hard resin composition being pulverized. Each of the rollers has a cylindrical shape with a hollow portion and the cooling device is configured to supply a coolant into the hollow portion of each of the rollers. The coolant flows in the hollow portion of each of the rollers in a longitudinal direction of each of the rollers. The cooling device has facilitating members respectively inserted into the hollow portions of the rollers.

    摘要翻译: 用于粉碎硬质树脂组合物的粉碎装置具有一个具有彼此平行布置的一对辊的粉碎机构,这些辊通过将辊之间的硬树脂组合物加压和用于冷却硬树脂组合物的冷却装置来粉碎硬树脂组合物 在硬质树脂组合物被粉碎的过程中。 每个辊具有中空部分的圆柱形形状,并且冷却装置构造成将冷却剂供应到每个辊的中空部分中。 冷却剂沿每个辊的纵向在每个辊的中空部分中流动。 冷却装置具有分别插入辊的中空部分中的便利构件。

    COOLING APPARATUS AND COOLING METHOD
    5.
    发明申请
    COOLING APPARATUS AND COOLING METHOD 有权
    冷却装置和冷却方法

    公开(公告)号:US20120318002A1

    公开(公告)日:2012-12-20

    申请号:US13580258

    申请日:2011-02-21

    IPC分类号: F25D25/04

    摘要: A cooling apparatus includes a conveying means which conveys a resin composition formed into a sheet shape along a direction parallel to a surface of the sheet-shaped resin composition and a cooling means which cools the resin composition being conveyed by the conveying means. A temperature of the resin composition just before being cooled by the cooling means is in the range of 40 to 60° C. and the cooling means has a cooling ability to cool the resin composition such that a cooling rate of the resin composition is in the range of 0.2 to 5° C./min. Further, the cooling means includes a fan section having at least one outlet port which discharges cooling air of which temperature is in the range of −40 to 0° C. to the resin composition.

    摘要翻译: 冷却装置包括输送装置,该输送装置沿着平行于片状树脂组合物的表面的方向输送形成片状的树脂组合物,以及冷却由输送装置输送的树脂组合物的冷却装置。 由冷却装置冷却之前的树脂组合物的温度在40〜60℃的范围内,冷却装置具有冷却树脂组合物的冷却能力,使得树脂组合物的冷却速度在 范围为0.2〜5℃/ min。 此外,冷却装置包括具有至少一个出口的风扇部分,其将温度在-40℃至0℃范围内的冷却空气排出到树脂组合物。

    Resin composition for encapsulating semiconductor chip and semiconductor device therewith
    6.
    发明授权
    Resin composition for encapsulating semiconductor chip and semiconductor device therewith 失效
    用于将半导体芯片和半导体器件封装的树脂组合物

    公开(公告)号:US07023098B2

    公开(公告)日:2006-04-04

    申请号:US10797706

    申请日:2004-03-10

    IPC分类号: H01L23/28

    摘要: An epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, a resin composition for encapsulating a semiconductor chip containing an epoxy resin (A), a phenol resin (B), an inorganic filler (C) and a curing accelerator (D) as main components, and further containing a silane coupling agent (E) in 0.01 wt % to 1 wt % both inclusive of the total amount of the epoxy resin composition and Compound (F) contains two hydroxyl groups combined with each of adjacent carbon atoms in an aromatic ring in more than or equal to 0.01 wt % of the total amount of the epoxy resin composition.

    摘要翻译: 一种用于封装半导体芯片的环氧树脂组合物,其具有良好的流动性,而不会降低固化性。 具体而言,将包含环氧树脂(A),酚醛树脂(B),无机填料(C),固化促进剂(D))作为主要成分的半导体芯片的密封用树脂组合物进一步含有硅烷偶联剂( E)为0.01重量%〜1重量%,包括环氧树脂组合物的总量,化合物(F)在芳环中含有与相邻碳原子中的每一个相结合的两个羟基,大于或等于0.01重量% 的环氧树脂组合物的总量。

    Kneading apparatus and method for producing semiconductor encapsulating resin composition

    公开(公告)号:US09694513B2

    公开(公告)日:2017-07-04

    申请号:US13636881

    申请日:2011-03-02

    摘要: The kneading apparatus 1 includes a casing 2, a pair of elongated screws 4a, 4b rotatably provided in the casing 2. The screws 4a, 4b are arranged parallel and horizontally with respect to one another. The casing 2 has a main body 20 and a screw container 3 provided in the casing 2. The screw container 3 defines a kneading section 30 therein. The screw 4a includes a screw axis 41 having an outer periphery, a first screw member 42 provided on the outer periphery of the screw axis 41 and a kneading member 43 provided on the outer periphery of the screw axis 41. The first screw member 42 and kneading member 43 are provided in the kneading section 30. The screw 4a, the first screw member 42 and the kneading member 43 respectively have core portions 411, 412, 413 having a surface and outer layers 45 respectively provided on the surfaces of the core portions 411, 412, 413. The screw container 3 and the outer layers 45 are constituted of a nonmetallic material.

    COMPACT PRODUCTION APPARATUS AND METHOD FOR PRODUCING COMPACT
    8.
    发明申请
    COMPACT PRODUCTION APPARATUS AND METHOD FOR PRODUCING COMPACT 有权
    紧凑型生产设备及其制造方法

    公开(公告)号:US20130015607A1

    公开(公告)日:2013-01-17

    申请号:US13637032

    申请日:2011-03-01

    IPC分类号: B29C43/02

    摘要: A compact production apparatus includes a main body having at least one molding die in which a cavity is formed, a first flow passage member for supplying powder into the cavity, an upper compaction member having an upper punch surface, a lower compaction member having a lower punch surface which is allowed to compress the powder in the cavity in cooperation with the upper punch surface to thereby obtain a compact of the powder, and a second flow passage member from which the compact separated from the cavity is to be discharged. Further, at least 80% or more of a total surface area of an upper surface of the main body, an inner circumferential surface defining the cavity, an inner circumferential surface of the first flow passage member, an inner circumferential surface of the second flow passage member, the upper punch surface of the upper compaction member and the lower punch surface of the lower compaction member is made of a nonmetallic material.

    摘要翻译: 一种紧凑的生产设备包括主体,其具有至少一个成型模,其中形成有空腔,用于将粉末供应到空腔中的第一流动通道构件,具有上冲头表面的上压紧构件,具有下冲压件的下压紧构件 冲压面,其与上冲头表面协作地压缩空腔中的粉末,从而获得粉末的压块;以及第二流路构件,从空腔分离的压块将从该第二流动通道构件排出。 此外,主体的上表面的总表面积,限定空腔的内周面,第一流路构件的内周面,第二流路的内周面的至少80%以上 上压实件的上冲头表面和下压紧件的下冲头表面由非金属材料制成。

    KNEADING APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR ENCAPSULATING RESIN COMPOSITION
    9.
    发明申请
    KNEADING APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR ENCAPSULATING RESIN COMPOSITION 有权
    制造半导体包封树脂组合物的制造装置和方法

    公开(公告)号:US20130010566A1

    公开(公告)日:2013-01-10

    申请号:US13636881

    申请日:2011-03-02

    IPC分类号: B29B7/80

    摘要: The kneading apparatus 1 includes a casing 2, a pair of elongated screws 4a, 4b rotatably provided in the casing 2. The screws 4a, 4b are arranged parallel and horizontally with respect to one another. The casing 2 has a main body 20 and a screw container 3 provided in the casing 2. The screw container 3 defines a kneading section 30 therein. The screw 4a includes a screw axis 41 having an outer periphery, a first screw member 42 provided on the outer periphery of the screw axis 41 and a kneading member 43 provided on the outer periphery of the screw axis 41. The first screw member 42 and kneading member 43 are provided in the kneading section 30. The screw 4a, the first screw member 42 and the kneading member 43 respectively have core portions 411, 412, 413 having a surface and outer layers 45 respectively provided on the surfaces of the core portions 411, 412, 413. The screw container 3 and the outer layers 45 are constituted of a nonmetallic material.

    摘要翻译: 捏合装置1包括壳体2,可旋转地设置在壳体2中的一对细长螺钉4a,4b。螺钉4a,4b相对于彼此平行和水平地布置。 壳体2具有设置在壳体2中的主体20和螺旋容器3。螺旋容器3在其中限定捏合部30。 螺钉4a包括具有外周的螺纹轴41,设置在螺杆轴线41的外周上的第一螺纹构件42和设置在螺杆轴线41的外周上的揉面构件43.第一螺纹构件42和 捏合部件43设置在捏合部分30中。螺杆4a,第一螺纹部件42和捏合部件43分别具有分别设置在芯部的表面上的表面和外层45的芯部411,412,413 螺钉容器3和外层45由非金属材料构成。

    Epoxy resin composition
    10.
    发明授权
    Epoxy resin composition 失效
    环氧树脂组合物

    公开(公告)号:US5578660A

    公开(公告)日:1996-11-26

    申请号:US287592

    申请日:1994-08-08

    摘要: Disclosed is an epoxy resin composition for sealing semiconductors which comprises as essential components: (A) an epoxy resin containing a biphenyl type epoxy resin represented by the following formula (1) in an amount of 30-100% by weight on the basis of the total amount of the epoxy resin, ##STR1## wherein R.sub.1 -R.sub.8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, (B) a hardener containing a phenolic resin hardener represented by the following formula (2a) or a naphthol resin hardener represented by the following formula (2b) in an amount of 30-100% by weight on the basis of the total amount of the hardener, ##STR2## wherein R.sub.1 -R.sub.8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, R.sub.9 is a group selected from phenyl, naphthyl, anthracenyl and alkyl groups, and n is 1-6, ##STR3## wherein R is a group selected from phenyl, naphthyl, anthracenyl and alkyl groups, and n is 1-6, (C) an inorganic filler, and (D) a hardening accelerator.

    摘要翻译: 公开了一种用于密封半导体的环氧树脂组合物,其包括作为必要组分:(A)含有下式(1)表示的联苯型环氧树脂的环氧树脂,其量为30-100重量% 环氧树脂的总量,其中R1-R8是选自氢,卤素和烷基的相同或不同的原子或基团,(B)含有由下式表示的酚醛树脂固化剂的固化剂(1) 2a)或由下式(2b)表示的萘酚树脂固化剂,其量为30-100重量%,基于固化剂的总量,其中R 1 -R 8相同或相同,或 不同的选自氢,卤素和烷基的原子或基团,R9为选自苯基,萘基,蒽基和烷基的基团,n为1-6,其中R为选自苯基, 萘基,蒽基和烷基,n为1-6,(C)无机f (D)硬化加速器。