公开(公告)号：US11178773B2

公开(公告)日：2021-11-16

申请号：US16949509

申请日：2020-10-30

Applicant: Sheng-Kun Lan

Inventor： Sheng-Kun Lan

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/28 ,  H05K3/42 ,  H05K3/46 ,  H01L21/00 ,  H01L21/58 ,  H01L21/60 ,  H01L23/48 ,  H01L23/52 ,  H01L23/66 ,  H01L23/488 ,  H01L23/528

Abstract: A conductor trace structure reducing insertion loss of circuit board, the circuit board laminates an outer layer circuit board, an inner layer circuit board and a glass fiber resin films which arranged between each board; before laminated process, the conductor traces of the inner layers had formed by etching of imaging transfer process and conductor traces had been roughed process for making the glass fiber resin films having good adhesive performance during laminating; before etching of imaging transfer process that forms the conductor traces of the outer layers or solder resist coat process or coating polymer materials, the conductor traces have been roughed process to make insulating resin layer of the solder resist coat or polymer materials to has better associativity; wherein a smooth trench is formed by physical or chemical process constructed on the roughed conductor traces surface to guide electric ions transmitted on these smooth trench surface to enhance electric ions transmission rate, resulting in reducing the impedance so as to achieve reducing insertion loss.

公开(公告)号：US20210136919A1

公开(公告)日：2021-05-06

申请号：US16949509

申请日：2020-10-30

Applicant: SHENG-KUN LAN

Inventor： SHENG-KUN LAN

IPC: H05K3/00 ,  H05K1/03

Abstract: A conductor trace structure reducing insertion loss of circuit board, the circuit board laminates an outer layer circuit board, an inner layer circuit board and a glass fiber resin films which arranged between each board; before laminated process, the conductor traces of the inner layers had formed by etching of imaging transfer process and conductor traces had been roughed process for making the glass fiber resin films having good adhesive performance during laminating; before etching of imaging transfer process that forms the conductor traces of the outer layers or solder resist coat process or coating polymer materials, the conductor traces have been roughed process to make insulating resin layer of the solder resist coat or polymer materials to has better associativity; wherein a smooth trench is formed by physical or chemical process constructed on the roughed conductor traces surface to guide electric ions transmitted on these smooth trench surface to enhance electric ions transmission rate, resulting in reducing the impedance so as to achieve reducing insertion loss.