Ultrathin glass with special chamfer shape and high strength

    公开(公告)号:US12187638B2

    公开(公告)日:2025-01-07

    申请号:US17098121

    申请日:2020-11-13

    Inventor: Ning Da Feng He

    Abstract: A chemically toughened glass article is provided that has a thickness (t) of equal to or less than 0.4 mm, a first surface, a second surface, and a compressive stress region that is defined by a compressive stress (CS) of at least 100 MPa and at least one edge connecting the first surface and the second surface. The at least one edge has at least one chamfer with a chamfer width (A) and a chamfer height (B). The chamfer has a ratio of chamfer width/chamfer height (A/B) of between 1.5-20 and the chamfer has a ratio of chamfer width/glass thickness (A/t) of at least 0.5.

    Electronic device glass structure

    公开(公告)号:US10579165B2

    公开(公告)日:2020-03-03

    申请号:US15782086

    申请日:2017-10-12

    Abstract: An electronic device structure and an ultra-thin glass sheet used therein. The electronic device structure includes a functional device and an ultra-thin glass above the functional device. The ultra-thin glass has a thickness of no more than 0.4 mm and also has a toughening layer, of which the thickness does not exceed 50% of the thickness of the ultra-thin glass. The ultra-thin glass has a total thickness variation of no more than 20 μm. The ultra-thin glass used in the electronic device structure according to the present invention provides quality assurance for subsequent potential processes, such as cutting, drilling, coating, screen-printing, laminating, gluing and the like, due to the toughening layer. Moreover, the ultra-thin glass improves functionality of the electronic device structure, in particular of the device, due to its small total thickness variation.

    Bonded Article of Thin Glass on Support Substrate, Preparation Method and Use Thereof
    9.
    发明申请
    Bonded Article of Thin Glass on Support Substrate, Preparation Method and Use Thereof 审中-公开
    薄玻璃保护底物的制备方法及用途

    公开(公告)号:US20160114565A1

    公开(公告)日:2016-04-28

    申请号:US14975900

    申请日:2015-12-21

    Abstract: A method for making a bonded article, wherein a thin glass substrate is bonded on a support substrate in the absence of any interlayer by an electrostatic adhesion process with the assistance of external pressure, the pressure is applied constantly or stepwise during the adhesion process by use of a tool such as a roll or a wheel or other movable device with curved surface. The bonded article has no defects, e.g. bubbles or inclusions, in the bonded interface, which benefits transportation of the thin glass substrate and its post-processing as well. Such defect-free bonded article is also disclosed. Pressure supported electrostatic adhesion, initiated by electrostatic charges adhesion of a two members, e.g. a substrate member and a support member, is enabled to minimize, prevent and exclude defects, distortion between the adhered surfaces.

    Abstract translation: 一种接合制品的制造方法,其中在外部辅助的情况下,通过静电粘附工艺在不存在任何夹层的情况下将薄玻璃基板粘结在支撑基板上,通过使用在粘合过程中不断地或逐步地施加压力 诸如辊或车轮的工具或具有弯曲表面的其它可移动装置。 粘合制品没有缺陷,例如 粘结界面中的气泡或夹杂物,这有利于薄玻璃基板的输送及其后处理。 还公开了这种无缺陷的粘合制品。 由两个构件的静电电荷附着引起的压力支持的静电粘附,例如。 衬底构件和支撑构件能够最小化,防止和排除缺陷,粘附表面之间的变形。

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