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    SEMICONDUCTOR DEVICE
    2.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20150138733A1

    公开(公告)日：2015-05-21

    申请号：US14400105

    申请日：2012-08-24

    申请人： Ryo Tsuda ,  Kazuhiro Morishita

    发明人： Ryo Tsuda ,  Kazuhiro Morishita

    IPC分类号： H05K7/02 ,  H01L23/04 ,  H01L25/10

    CPC分类号： H05K7/02 ,  H01L23/04 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/73 ,  H01L25/105 ,  H01L25/115 ,  H01L25/18 ,  H01L2224/0603 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H05K1/0263 ,  H01L2924/00012 ,  H01L2924/00

    摘要： Each of semiconductor module includes a semiconductor chip, a case surrounding the semiconductor chip, and a main electrode connected to the semiconductor chip and led out to an upper surface of case. A connecting electrode is connected and fixed to the main electrodes of the adjacent semiconductor modules. The connecting electrode is formed only of a metal plate. The rated current, the rated voltage and the circuit configuration can easily be changed by changing the connection using the connecting electrode, thus enabling reduction of the design time and facilitating manufacture management. Only a malfunctioning one of the semiconductor modules may be replaced. There is, therefore, no need to replace the entire device. The connecting electrode is formed of an electrically conductive plate and, therefore, enables reduction of the number of component parts and reduction of the device in size in comparison with the conventional wiring bus bar.

    摘要翻译： 半导体模块中的每一个包括半导体芯片，围绕半导体芯片的壳体以及连接到半导体芯片并被引导到壳体的上表面的主电极。 连接电极连接固定在相邻半导体模块的主电极上。 连接电极仅由金属板形成。 通过改变使用连接电极的连接，可以方便地改变额定电流，额定电压和电路配置，从而减少设计时间，便于制造管理。 可以仅替换半导体模块中的故障的一个。 因此，无需更换整个设备。 连接电极由导电板形成，因此与传统的布线母线相比，能够减少部件数量和减小装置的尺寸。