- 专利标题： Semiconductor device
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申请号： US14400105申请日： 2012-08-24
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公开(公告)号： US09622368B2公开(公告)日： 2017-04-11
- 发明人: Ryo Tsuda , Kazuhiro Morishita
- 申请人： Ryo Tsuda , Kazuhiro Morishita
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Electric Corporation
- 当前专利权人： Mitsubishi Electric Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Studebaker & Brackett PC
- 国际申请： PCT/JP2012/071453 WO 20120824
- 国际公布： WO2014/030254 WO 20140227
- 主分类号： H01R13/46
- IPC分类号： H01R13/46 ; H05K5/00 ; H05K7/02 ; H01L23/498 ; H01L25/11 ; H01L23/04 ; H01L25/10 ; H01L25/18 ; H05K1/02 ; H01L23/373 ; H01L23/24 ; H01L23/00
摘要：
Each of semiconductor module includes a semiconductor chip, a case surrounding the semiconductor chip, and a main electrode connected to the semiconductor chip and led out to an upper surface of case. A connecting electrode is connected and fixed to the main electrodes of the adjacent semiconductor modules. The connecting electrode is formed only of a metal plate.
公开/授权文献
- US20150138733A1 SEMICONDUCTOR DEVICE 公开/授权日：2015-05-21
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