公开(公告)号：US06924016B2

公开(公告)日：2005-08-02

申请号：US10395747

申请日：2003-03-24

申请人： Stanely F. Wanat ,  Robert R. Plass

发明人： Stanely F. Wanat ,  Robert R. Plass

IPC分类号： B24B37/30 ,  C09J11/00 ,  C09J125/00 ,  C09J129/04 ,  C09J131/04 ,  C09J133/02 ,  C09J133/04 ,  C09J135/00 ,  C09J183/04 ,  H01L21/304 ,  H01L21/306 ,  H01L21/68 ,  B32B33/00 ,  B32B9/00 ,  H01L21/44 ,  H01L21/48

CPC分类号： H01L21/6835 ,  B24B37/30 ,  H01L21/30625 ,  Y10T428/14

摘要： Disclosed is an assembly system for stationing a semiconductor wafer suitable for processing said wafer, said system comprising: (a) a holding block; (b) a semiconductor wafer; and (c) an aqueous adhesive composition interposed between the holding block and the semiconductor wafer. Also disclosed is a process for manufacturing a semiconductor wafer, comprising the steps of: (a) providing a holding block; (b) providing a semiconductor wafer; (c) coating either the holding block or one side of the semiconductor wafer with the foregoing aqueous adhesive composition; (d) contacting either one side of the semiconductor wafer to the coated holding block or the coated side of the semiconductor wafer to the holding block, such that the semiconductor wafer adheres to the coated holding block; (e) polishing the other side of the semiconductor wafer; and (f) removing the semiconductor wafer from the coated holding block.

摘要翻译： 公开了一种用于驻扎适合于处理所述晶片的半导体晶片的组装系统，所述系统包括：（a）保持块; （b）半导体晶片; 和（c）插入在保持块和半导体晶片之间的水性粘合剂组合物。 还公开了一种制造半导体晶片的方法，包括以下步骤：（a）提供保持块; （b）提供半导体晶片; （c）用上述水性粘合剂组合物涂覆半导体晶片的保持块或一侧; （d）将半导体晶片的一侧与涂覆的保持块或半导体晶片的涂覆侧接触到保持块，使得半导体晶片粘附到涂覆的保持块; （e）抛光半导体晶片的另一侧; 和（f）从涂覆的保持块移除半导体晶片。

公开(公告)号：US06911293B2

公开(公告)日：2005-06-28

申请号：US10120952

申请日：2002-04-11

申请人： Stanley F. Wanat ,  Joseph E. Oberlander ,  Robert R. Plass ,  Douglas McKenzie

发明人： Stanley F. Wanat ,  Joseph E. Oberlander ,  Robert R. Plass ,  Douglas McKenzie

IPC分类号： G03F7/004 ,  G03F7/022 ,  G03F7/023 ,  G03F7/038 ,  G03F7/039 ,  H01L21/027 ,  G03F7/30

CPC分类号： G03F7/0048 ,  G03F7/0233 ,  G03F7/0236 ,  G03F7/0382 ,  G03F7/0392 ,  Y10S430/106 ,  Y10S430/111

摘要： Disclosed is a photoresist composition comprising: a) at least one film forming resin selected from the group consisting of novolak resins, and polyhydroxystyrenes; b) at least one photoactive compound or photoacid generator; and c) a solvent composition comprising at least one solvent selected from the group consisting of acetals and ketals. Also disclosed is a photoresist composition comprising a polycarbonate resin and a solvent composition comprising at least one solvent selected from the group consisting of acetals and ketals. Also disclosed is a process for imaging a photoresist composition, comprising the steps of: a) coating a suitable substrate with any of the aforementioned photoresist compositions; b) baking the substrate to substantially remove the solvent; c) imagewise irradiating the photoresist film; and d) removing the imagewise exposed or, alternatively, the unexposed areas of the coated substrate with a suitable developer.

摘要翻译： 公开了一种光致抗蚀剂组合物，其包含：a）至少一种选自酚醛清漆树脂和聚羟基苯乙烯的成膜树脂; b）至少一种光敏化合物或光酸产生剂; 和c）包含至少一种选自缩醛和缩酮的溶剂的溶剂组合物。 还公开了一种光致抗蚀剂组合物，其包含聚碳酸酯树脂和包含至少一种选自缩醛和缩酮的溶剂的溶剂组合物。 还公开了一种用于对光致抗蚀剂组合物进行成像的方法，包括以下步骤：a）用任何上述光致抗蚀剂组合物涂覆合适的基材; b）烘烤基材以基本上除去溶剂; c）成像照射光刻胶膜; 以及d）用合适的显影剂除去成像曝光或替代地涂覆的基底的未曝光区域。

公开(公告)号：US07078157B2

公开(公告)日：2006-07-18

申请号：US10376356

申请日：2003-02-27

申请人： Hong Zhuang ,  Joseph E. Oberlander ,  Ping-Hung Lu ,  Stanely F. Wanat ,  Robert R. Plass

发明人： Hong Zhuang ,  Joseph E. Oberlander ,  Ping-Hung Lu ,  Stanely F. Wanat ,  Robert R. Plass

IPC分类号： G03C1/73 ,  G03F7/028 ,  G03F7/20 ,  G03F7/30 ,  G03F7/42

CPC分类号： G03F7/033 ,  Y10S430/117

摘要： A composition that comprises a photopolymerizable compound containing at least two pendant unsaturated groups; at least one ethylenically unsaturated photopolymerizable polyalkylene oxide hydrophilic monomer; at least one nonionic surfactant; and at least one photoinitiator is provided. The composition also preferably contains at least one amine modified acrylic oligomer and a dye. Other conventional photoresist components such as photosensitizers, adhesion promoters, leveling agents and solvents may also be included in the composition. Such compositions are useful for forming a pattern on a substrate, such as patterning microlithographic circuits on a substrate.

摘要翻译： 一种组合物，其包含含有至少两个侧链不饱和基团的光聚合化合物; 至少一种烯键式不饱和光聚合聚环氧烷亲水单体; 至少一种非离子表面活性剂; 并提供至少一种光引发剂。 组合物还优选含有至少一种胺改性的丙烯酸低聚物和染料。 其他常规光致抗蚀剂组分如光敏剂，粘合促进剂，流平剂和溶剂也可以包括在组合物中。 这样的组合物可用于在基底上形成图案，例如在基底上图案化微光刻电路。