摘要:
An optical pickup device includes an optical part module having a light emitting device and an optical pickup case to which the optical part module is fixed by way of an adhesive, in which the optical part module is adhesively fixed by disposing a bonding surface of the optical part module to the optical pickup case at least at two positions on lateral surfaces of the optical part module putting an optical axis therebetween, and a bonding distance L in the lateral surface between the optical part module and the optical pickup is defined as: 40 μm
摘要:
An optical pickup device having an optical module provided with an optical element and bonded and fixed to an optical pickup case, wherein the optical module is fixed to the optical pickup case by a first ultraviolet curing adhesive at at least two positions with an optical axis between the positions, the optical axis extending from the optical element to the optical pickup case, and at least a part of an exposed surface of the first ultraviolet curing adhesive is covered with a second ultraviolet curing adhesive higher in hardness or elastic modulus than the first ultraviolet curing adhesive to diminish an optical axis offset of the optical pickup device, further, a heat dissipating material higher in thermal conductivity than the first and second ultraviolet curing adhesives is brought into contact with both optical module and optical pickup case to improve the heat dissipating performance of the optical pickup device.
摘要:
In connecting flexible printed circuits, a structure with improved connection strength of the connection portion is provided. In this structure in which a first flexible printed circuit and a second flexible printed circuit are connected to each other, a through-hole is provided on the second flexible printed circuit, and a resin member passes through the through-hole and is adhered to the wires of a connection surface of the first flexible printed circuit and the side of the second flexible printed circuit opposite to the connection surface, whereby impact is absorbed by the elasticity of the resin; as for the first flexible printed circuit, adhesion is performed on a metal in a wiring layer with high adhesion strength, while as for the second flexible printed circuit, adhesion is performed on the back side upon which no peeling stress is exerted, improving joining strength to prevent peeling.
摘要:
A connection structure of Flexible printed circuits comprising: first and second Flexible printed circuits, respectively, including a base formed of a resin, a plurality of wiring patterns arranged side by side on the base, a cover film formed of a resin to cover opposite sides of the wiring patterns to the base, and a connection portion in which the plurality of wiring patterns are not covered by the cover film, the connection portions of the first and second Flexible printed circuits being connected with each other. The wiring patterns in the connection portions include a large width portion which is larger in width than the wiring patterns covered by the cover film. The large width portions on the first Flexible printed circuit and the large width portions on the second Flexible printed circuit are connected to each other by means of soldering.
摘要:
An optical pickup device having an optical module provided with an optical element and bonded and fixed to an optical pickup case, wherein the optical module is fixed to the optical pickup case by a first ultraviolet curing adhesive at at least two positions with an optical axis between the positions, the optical axis extending from the optical element to the optical pickup case, and at least a part of an exposed surface of the first ultraviolet curing adhesive is covered with a second ultraviolet curing adhesive higher in hardness or elastic modulus than the first ultraviolet curing adhesive to diminish an optical axis offset of the optical pickup device, further, a heat dissipating material higher in thermal conductivity than the first and second ultraviolet curing adhesives is brought into contact with both optical module and optical pickup case to improve the heat dissipating performance of the optical pickup device.
摘要:
A connection structure of Flexible printed circuits comprising: first and second Flexible printed circuits, respectively, including a base formed of a resin, a plurality of wiring patterns arranged side by side on the base, a cover formed of a resin to cover opposite sides of the wiring patterns to the base, and a connection portion in which the plurality of wiring patterns are not covered by the cover, the connection portions of the first and second Flexible printed circuits being connected with each other. The wiring patterns in the connection portions include a large width portion which is larger in width than the wiring patterns covered by the cover. The large width portions on the first Flexible printed circuit and the large width portions on the second Flexible printed circuit are connected to each other by means of soldering.
摘要:
The invention provides an optical pickup device that ensures complete curing of adhesive when a tilt adjusting holder is glued to an objective lens holder. The optical pickup device comprises: a light source; an objective lens for focusing light emitted from the light source onto an optical storage medium; a tilt adjusting holder to which to secure the objective lens; and an objective lens holder to which to glue the tilt adjusting holder. The objective lens holder includes: adhesive joint sections for securing the tilt adjusting holder to the objective lens holder using an adhesive; a seat section on which the tilt adjusting holder abuts; and adhesive anti-overflow pockets, located between the adhesive joint sections and the seat section, for receiving the adhesive when the adhesive flows from the adhesive joint sections.
摘要:
The present invention provides an optical pickup device employing a disc protector that includes a plurality of first protrusions and at least one second protrusion disposed on the lens holder, wherein the first protrusions are formed by applying a first adhesive to a plurality of areas of a top surface of the lens holder, wherein the first protrusions are arranged at different locations in the tracking direction such that the objective lens is sandwiched between the first protrusions, wherein the at least one second protrusion protrudes is formed by applying a second adhesive to at least one area of the top surface of the lens holder, and wherein tips of the first protrusions are closer to the optical disc than a tip of the at least one second protrusion.
摘要:
An optical pickup device, which is capable of inhibiting peeling from a bonded interface and deviation of an optical axis from being caused even by long-term environmental variations, has a photonic device 1, a flexible printed substrate 2, a holding member 3, an optical pickup case 5 and a bonding connection 4 for bonding the holding member 3 and the optical pickup case 5 together. The adhesive enters an inside of the optical pickup case. The adhesive has a cross-sectional area on the outer surface of the optical pickup case in communication with the inside smaller than a cross-sectional area in the inside of the optical pickup case.