公开(公告)号：US08789493B2

公开(公告)日：2014-07-29

申请号：US11352307

申请日：2006-02-13

Applicant: Daxing Ren ,  Enrico Magni ,  Eric Lenz ,  Ren Zhou

Inventor： Daxing Ren ,  Enrico Magni ,  Eric Lenz ,  Ren Zhou

IPC: C23C16/50 ,  H01L21/306 ,  C23F1/00

CPC classification number: H01J37/32532 ,  H01J37/32009 ,  Y10T156/10

Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing having a backing member having a bonding surface, an inner electrode having a lower surface on one side and a bonding surface on the other side, and an outer electrode having a lower surface on one side and a bonding surface on the other side. At least one of the electrodes has a flange, which extends underneath at least a portion of the lower surface of the other electrode.

Abstract translation: 一种用于半导体衬底加工的等离子体反应室的电极组件，具有具有接合面的背衬构件，具有一侧下表面的内电极和另一侧的接合面，以及外电极， 一侧和另一侧的接合表面。 至少一个电极具有凸缘，该凸缘在另一个电极的下表面的至少一部分的下方延伸。

公开(公告)号：US20140205534A1

公开(公告)日：2014-07-24

申请号：US14130354

申请日：2012-06-29

Applicant: Ren Zhou ,  Rui Huang

Inventor： Ren Zhou ,  Rui Huang

IPC: C01B17/76

CPC classification number: C01B17/76 ,  C01B17/508 ,  C01B17/806 ,  F28D7/1623 ,  F28D2021/0022 ,  F28F9/10 ,  F28F19/002 ,  F28F19/04 ,  F28F21/006 ,  F28F2230/00 ,  F28F2265/26

Abstract: Provided is a method for preparing sulfuric acid by using hydrogen sulfide. The method comprises the following steps: (1) performing a reduction-oxidation reaction between an H2S feed gas and oxygen comprised in an oxygen-rich air to prepare SO2, controlling residual oxygen after the reduction-oxidation reaction step at a molar percentage of ≧2%; (2) cooling the product acquired in step (1) to a temperature between 390° C. and 430° C., and then performing a catalyzed oxidation reaction with oxygen, wherein the catalyzed oxidation reaction is performed in stages until the conversion rate of SO2 is ≧98.7% or the outlet concentration of SO2 is ≦550 mg/Nm3; and (3) cooling the product acquired in step (2) to a temperature ≧10° C. over the dew point temperature of H2SO4, then further cooling to a temperature between 60° C. and 120° C., collecting H2SO4 product, and subjecting the gas acquired after cooling to a coalescent separation before discharging directly into the atmosphere. Also provided is a heat exchanger, comprising a housing and several glass pipes, wherein the glass pipes are arranged within the housing along the direction of a long axis of the housing, arching between two lateral walls thereof, and used for circulating cooling medium; the adjacent glass pipes are connected head-to-tail, thereby forming at least one cooling medium flow path of unidirectional flow. The method for preparing sulfuric acid provides high removal efficiency of hydrogen sulfide, simple process flow, and allows for economic efficiency of apparatus and reasonable utilization of energy.

Abstract translation: 提供了通过使用硫化氢制备硫酸的方法。 该方法包括以下步骤：（1）在H2S进料气体和富氧空气中包含的氧气之间进行还原氧化反应以制备SO 2，在还原 - 氧化反应步骤之后控制残余氧以≧ 2％; （2）将步骤（1）中获得的产物冷却至390℃至430℃之间的温度，然后与氧气进行催化氧化反应，其中催化氧化反应分级进行直至转化率 SO2为≥98.7％，SO2出口浓度为“N”; 550mg / Nm3; 和（3）在H 2 SO 4的露点温度下将步骤（2）中获得的产物冷却至≥10℃的温度，然后进一步冷却至60℃至120℃的温度，收集H 2 SO 4产物， 并在冷却后获得的气体进行聚结分离，然后直接排放到大气中。 还提供了一种热交换器，其包括壳体和几个玻璃管，其中玻璃管沿壳体的长轴方向布置在壳体内，在其两个侧壁之间拱起并用于循环冷却介质; 相邻的玻璃管头对头连接，从而形成至少一个单向流动的冷却介质流动路径。 制备硫酸的方法提供了较高的硫化氢去除效率，工艺流程简单，并且能够提高设备的经济效益和合理利用能源。

公开(公告)号：US20070187038A1

公开(公告)日：2007-08-16

申请号：US11352307

申请日：2006-02-13

Applicant: Daxing Ren ,  Enrico Magni ,  Eric Lenz ,  Ren Zhou

Inventor： Daxing Ren ,  Enrico Magni ,  Eric Lenz ,  Ren Zhou

IPC: B31B1/60 ,  C23F1/00

CPC classification number: H01J37/32532 ,  H01J37/32009 ,  Y10T156/10

Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing having a backing member having a bonding surface, an inner electrode having a lower surface on one side and a bonding surface on the other side, and an outer electrode having a lower surface on one side and a bonding surface on the other side. At least one of the electrodes has a flange, which extends underneath at least a portion of the lower surface of the other electrode.

Abstract translation: 一种用于半导体衬底加工的等离子体反应室的电极组件，具有具有接合面的背衬构件，具有一侧下表面的内电极和另一侧的接合面，以及外电极， 一侧和另一侧的接合表面。 至少一个电极具有凸缘，该凸缘在另一个电极的下表面的至少一部分的下方延伸。

公开(公告)号：US07040970B2

公开(公告)日：2006-05-09

申请号：US10892428

申请日：2004-07-15

Applicant: Simon McClatchie ,  Sabir Majumder ,  Ren Zhou ,  Xuyen Pham ,  Tuan A. Nguyen

Inventor： Simon McClatchie ,  Sabir Majumder ,  Ren Zhou ,  Xuyen Pham ,  Tuan A. Nguyen

IPC: B24B1/00

CPC classification number: B24B37/04 ,  B24B57/02

Abstract: An apparatus and method for evenly distributing a polishing fluid onto a polishing pad during a chemical mechanical planarization process, wherein the polishing fluid is dispersed by way of a spray being emitted from a spray nozzle. The pattern of polishing fluid applied to the polishing pad can be modified by adjustment of geometric parameters of the spray nozzle. The apparatus is configured with actuating mechanisms for translating and rotating the spray nozzle relative to the polishing pad in order to adjust a pattern of distribution of the polishing fluid. The method of dispersing polishing fluid onto the polishing pad produces an even distribution of polishing fluid across a width of the polishing pad.

Abstract translation: 一种用于在化学机械平面化工艺期间将抛光流体均匀地分布到抛光垫上的装置和方法，其中抛光液通过从喷嘴喷射的喷雾而分散。 可以通过调整喷嘴的几何参数来修改施加到抛光垫的抛光液的图案。 该装置配置有用于相对于抛光垫平移和旋转喷嘴的致动机构，以便调节抛光流体的分布模式。 将抛光液分散在抛光垫上的方法产生抛光液在抛光垫宽度上的均匀分布。

公开(公告)号：US07040954B1

公开(公告)日：2006-05-09

申请号：US10952608

申请日：2004-09-28

Applicant: Simon McClatchie ,  Peter Norton ,  Xuyen Pham ,  Ren Zhou

Inventor： Simon McClatchie ,  Peter Norton ,  Xuyen Pham ,  Ren Zhou

IPC: B24B49/18 ,  B24B53/00

CPC classification number: B24B37/005 ,  B24B49/18

Abstract: Apparatus and methods control CMP to uniformly polish a series of wafers. Average motor current I(avg) drawn by, and related average work W(avg) performed by, motors during CMP on the wafers reliably indicate quality of a roughness polishing characteristic of a polishing surface of a polishing pad. A conditioner controller controls a rate at which the quality of the polishing surface is restored by conditioning in relation to a rate of change of the quality of the polishing surface due to the CMP. Motor current is measured and averaged over many CMP-processed wafers. The method defines a baseline range of values of average work and controls conditioning according to whether average work is within the baseline range. When the polishing surface moves at constant velocity relative to each of the wafers that are being polished, a control signal based on average motor current represents the quality of the polishing characteristic.

Abstract translation: 设备和方法控制CMP以均匀抛光一系列晶片。 平均电动机电流I（avg），以及在晶圆上的CMP期间电动机执行的相关的平均功率W（avg）可靠地指示抛光垫的抛光表面的粗糙度抛光特性的质量。 调节器控制器通过调节相对于由CMP引起的抛光表面的质量的变化率来控制抛光表面的质量恢复的速率。 在许多CMP处理的晶片上测量和平均电动机电流。 该方法根据平均工作是否在基线范围内定义了平均工作值和控制条件的基准范围。 当抛光表面相对于被抛光的每个晶片以恒定速度移动时，基于平均电动机电流的控制信号表示抛光特性的质量。

公开(公告)号：US06872128B1

公开(公告)日：2005-03-29

申请号：US10676388

申请日：2003-09-30

Applicant: Xuyen Pham ,  Ren Zhou ,  Wen-Chiang Tu

Inventor： Xuyen Pham ,  Ren Zhou ,  Wen-Chiang Tu

IPC: B24B37/04 ,  B24B57/02 ,  B24B1/00

CPC classification number: B24B37/04 ,  B24B57/02

Abstract: A system and method of delivering a liquid to a CMP polishing pad includes supplying the liquid to a nozzle, the nozzle being oriented toward a polishing surface of the CMP polishing pad. The liquid flows at a rate of less than or equal to about 100 cc per minute. A pressurized carrier gas is also supplied to the nozzle. The liquid is substantially evenly sprayed from the nozzle onto the CMP polishing pad.

Abstract translation: 将液体输送到CMP抛光垫的系统和方法包括将液体供应到喷嘴，喷嘴朝向CMP抛光垫的抛光表面。 液体以小于或等于约100cc /分钟的速率流动。 加压的载气也被供应到喷嘴。 液体基本均匀地从喷嘴喷射到CMP抛光垫上。

公开(公告)号：US06821195B1

公开(公告)日：2004-11-23

申请号：US10187228

申请日：2002-06-28

Applicant: Xuyen Pham ,  Ren Zhou ,  Raisa Khavinson

Inventor： Xuyen Pham ,  Ren Zhou ,  Raisa Khavinson

IPC: B24B1900

CPC classification number: B24B37/30

Abstract: An invention is provided for a carrier head for use in a CMP process. The carrier head includes a metal plate that is capable of transferring a downforce to a wafer during a CMP operation. A plurality of vacuum holes is disposed within the metal plate, wherein each vacuum hole is positioned such that the vacuum hole is within five millimeters of an edge of the wafer during the CMP operation. In this manner, each vacuum hole can be positioned such that the vacuum hole is within an edge exclusion zone of the wafer during the CMP operation. In some embodiments, each vacuum hole is positioned such that the vacuum hole is within three millimeters of the edge of the wafer during the CMP operation, such as 2.7 millimeters from the edge of the wafer.

Abstract translation: 本发明提供一种用于CMP工艺的载体头。 载体头包括在CMP操作期间能够将下压力传递到晶片的金属板。 多个真空孔设置在金属板内，其中每个真空孔定位成使得在CMP操作期间真空孔在晶片边缘的5毫米内。 以这种方式，每个真空孔可以被定位成使得在CMP操作期间真空孔位于晶片的边缘排除区域内。 在一些实施例中，每个真空孔被定位成使得真空孔在CMP操作期间在晶片边缘的三毫米内，例如距离晶片边缘2.7毫米。

公开(公告)号：US5893882A

公开(公告)日：1999-04-13

申请号：US767657

申请日：1996-12-17

Applicant: David K. Peterson ,  Thomas L. Jirak ,  Ren Zhou ,  Michael R. S. Hill

Inventor： David K. Peterson ,  Thomas L. Jirak ,  Ren Zhou ,  Michael R. S. Hill

IPC: A61N1/362 ,  A61N1/365

CPC classification number: A61N1/3622 ,  A61N1/3688

Abstract: A pacemaker provided with a mode switching feature adapted to stabilize ventricular heart rate during atrial fibrillation. In a preferred embodiment of the invention, the device nominally operates in an atrial synchronized pacing mode such as DDD, DDDR, VDD or VDDR. In response to detection of atrial rhythm characteristics consistent with atrial fibrillation, the device switches into a non-atrial synchronized, ventricular rate stabilization pacing mode with the base ventricular pacing rate modulated on a beat by beat basis based upon preceding intrinsic or paced ventricular heartbeat intervals to adjust the pacing interval towards a desired preset rate stabilization target pacing interval which is typically less than the programmed base pacing interval of the device. While the ventricular rate stabilization mode is in effect, the current pacing interval is set equal to the preceding intrinsic or paced interval, with an increment if the preceding interval is less than the desired or target pacing interval, as typically will be the case, or with a decrement if the preceding interval is greater than the desired pacing interval. In a preferred embodiment of the invention, the device paces both the atria and ventricles in a DDI rate stabilization pacing mode with the ventricular pacing interval being modulated.

Abstract translation: 心脏起搏器配有模式切换功能，适用于在心房颤动期间稳定心室心率。 在本发明的优选实施例中，该装置名义上以心房同步起搏模式（例如DDD，DDDR，VDD或VDDR）操作。 为了响应与心房颤动一致的心房节律特征的检测，该装置转换成非心房同步的心室速率稳定起搏模式，其基本心室起搏速度基于先前的内在或起搏心室心跳间隔以搏动为基础进行调整 以将起搏间隔调整到期望的预设速率稳定化目标起搏间隔，其通常小于设备的编程的基本起搏间隔。 当心室速率稳定模式有效时，当前的起搏间隔被设置为等于前面的固有或起搏间隔，如果前一个间隔小于所需的或目标起搏间隔，增量（通常为这种情况），或 如果前一个间隔大于所需的起搏间隔，则递减。 在本发明的优选实施例中，该装置以调节心室起搏间隔的DDI速率稳定起搏模式对心房和心室起搏。

公开(公告)号：US5846263A

公开(公告)日：1998-12-08

申请号：US764568

申请日：1996-12-13

Applicant: David K. Peterson ,  Michael R. S. Hill ,  Ren Zhou ,  Kathleen A. Prieve

Inventor： David K. Peterson ,  Michael R. S. Hill ,  Ren Zhou ,  Kathleen A. Prieve

IPC: A61N1/362 ,  A61N1/39

CPC classification number: A61N1/3962 ,  A61N1/3622

Abstract: An implantable pacemaker employing an arrhythmia prevention pacing modality particularly optimized for inclusion in dual chamber pacemakers and anti-arrhythmia devices which include dual chamber pacemakers. When the pacing mode is in effect, the device alters timing of scheduled atrial and/or ventricular pacing pulses in response to depolarizations sensed during the refractory periods and to ventricular depolarizations sensed outside of the pacemaker's A-V escape intervals. The arrhythmia prevention pacing mode is activated and deactivated in conjunction with the operation of arrhythmia detection features which may also be employed by the device to trigger delivery of anti-arrhythmia therapies.

Abstract translation: 采用心律不齐预防起搏模式的植入式起搏器，其特别优化包括在双室起搏器和包括双室起搏器的抗心律失常装置中。 当起搏模式有效时，设备响应于在不应期期间感测到的去极化以及在起搏器的A-V逃逸间隔之外感测到的心室去极化来改变调度的心房和/或心室起搏脉冲的时间。 心律失常预防起搏模式与心律失常检测特征的操作一起被激活和失活，该功能也可以由该装置用于触发抗心律失常治疗的递送。

公开(公告)号：US07233824B2

公开(公告)日：2007-06-19

申请号：US10703956

申请日：2003-11-07

Applicant: Karen J. Kleckner ,  Kathleen A. Prieve ,  Jeffrey M. Gillberg ,  Ren Zhou ,  Kenneth M. Anderson ,  D. Curtis Deno ,  Glenn C. Zillmer ,  Ruth N. Klepfer ,  Vincent E. Splett

Inventor： Karen J. Kleckner ,  Kathleen A. Prieve ,  Jeffrey M. Gillberg ,  Ren Zhou ,  Kenneth M. Anderson ,  D. Curtis Deno ,  Glenn C. Zillmer ,  Ruth N. Klepfer ,  Vincent E. Splett

IPC: A61N1/365 ,  A61N1/368

CPC classification number: A61N1/3627 ,  A61N1/36114 ,  A61N1/36521 ,  A61N1/36564 ,  A61N1/36578 ,  A61N1/36585 ,  A61N1/3684 ,  A61N1/3962

Abstract: An extra-systolic stimulation (ESS) therapy addresses cardiac dysfunction including heart failure. ESS therapy employs atrial and/or ventricular extra-systoles via pacing-level stimulation to a heart. These extra-systoles must be timed correctly to achieve beneficial effects on myocardial mechanics (efficacy) while maintaining an extremely low level of risk of arrhythmia induction and excellent ICD-like arrhythmia sensing and detection (security). The present invention relates to therapy delivery guidance and options for improved ESS therapy delivery. These methods may be employed individually or in combinations in an external or implantable ESS therapy delivery device.

Abstract translation: 收缩期刺激（ESS）治疗涉及心脏功能障碍，包括心力衰竭。 ESS治疗通过对心脏的起搏水平刺激使用心房和/或心室超心动过速。 这些额外的收缩期必须正确定时，以达到对心肌力学（功效）的有益影响，同时保持心律失常诱导和优异的ICD样心律失常感知和检测（安全性）的极低水平的风险。 本发明涉及治疗递送指导和改善ESS治疗递送的选择。 这些方法可以在外部或可植入的ESS治疗递送装置中单独使用或组合使用。