Abstract:
A detector module (20) is described that includes at least one detector (30) for sensing photon radiation, an electronic circuit (40) coupled to the at least one detector (30), and a housing (50) having a first and a second body (60, 70), each having a bottom part (62, 72) and an at least partially cylindrical part (64, 74) extending from the bottom part (62, 72), wherein the at least partially cylindrical part (64) of the first body (60) is thermally coupled with the at least partially cylindrical part (74) of the second body (70), wherein the at least partially cylindrical part (64) of the first body (60) extends towards the bottom part (72) of the second body (70), and wherein the electronic circuit (40) is arranged inside the housing (50). A lithographic apparatus including the detector module (20) is also described.
Abstract:
A detector module (20) is described that includes at least one detector (30) for sensing photon radiation, an electronic circuit (40) coupled to the at least one detector (30), and a housing (50) having a first and a second body (60, 70), each having a bottom part (62, 72) and an at least partially cylindrical part (64, 74) extending from the bottom part (62, 72), wherein the at least partially cylindrical part (64) of the first body (60) is thermally coupled with the at least partially cylindrical part (74) of the second body (70), wherein the at least partially cylindrical part (64) of the first body (60) extends towards the bottom part (72) of the second body (70), and wherein the electronic circuit (40) is arranged inside the housing (50). A lithographic apparatus including the detector module (20) is also described.
Abstract:
A cooling arrangement is described and includes a heat sink having a first thermal contact surface, an object having a second thermal contact surface and a resilient wall. The first thermal contact surface and the second thermal contact surface face each other and define a gap. The resilient wall is part of an enclosure that surrounds a space at least comprising the gap, and the cooling arrangement includes a facility to maintain a pressure difference between the space and an environment of the cooling arrangement. Additionally, a lithographic apparatus comprising such a cooling arrangement is described.
Abstract:
A cooling arrangement is described and includes a heat sink having a first thermal contact surface, an object having a second thermal contact surface and a resilient wall. The first thermal contact surface and the second thermal contact surface face each other and define a gap. The resilient wall is part of an enclosure that surrounds a space at least comprising the gap, and the cooling arrangement includes a facility to maintain a pressure difference between the space and an environment of the cooling arrangement. Additionally, a lithographic apparatus comprising such a cooling arrangement is described.
Abstract:
A device for processing a thin metal foil and provided with a frame plate (7) for a die (16), a guide plate (10) for a punch (11), and a guide arranging for the die (16) and the punch to cooperate in the desired manner for the purpose of processing a thin metal foil by the die and the punch. The guide consists of at least two hinge elements (8, 9), each connected by means of an elastic line hinge (4, 5) with both the frame plate and the guide plate, the line hinges allowing only a pivotal motion in substantially the rectilinear displacement. The frame plate, the guide plate and the guide are manufactured from a single block (1) of material, in which the frame plate, guide and guide plate connected by the elastic line hinges are formed by the provision of bores (3), slits (6) and/or recesses (2).
Abstract:
A device for processing a thin metal foil and provided with a frame plate (7) for a die (16), a guide plate (10) for a punch (11), and a guide arranging for the die (16) and the punch to cooperate in the desired manner for the purpose of processing a thin metal foil by the die and the punch. The guide consists of at least two hinge elements (8, 9), each connected by means of an elastic line hinge (4, 5) with both the frame plate and the guide plate, the line hinges allowing only a pivotal motion in substantially the rectilinear displacement. The frame plate, the guide plate and the guide are manufactured from a single block (1) of material, in which the frame plate, guide and guide plate connected by the elastic line hinges are formed by the provision of throughgoing bores (3), slits (6) and/or recesses (2).
Abstract:
The invention provides a method for preparing a conductive strain sensor on the surface of a device to measure strain at the surface of the device, which method comprises the steps of (a) providing a device; (b) optionally applying an isolating layer on a surface of the device; (c) establishing a distribution of particles of a first metal on the isolating layer obtained in step (b); and (d) depositing a layer of a second metal on at least part of the distribution of the particles of the first metal as obtained in step (c) by means of an electroless plating process or electro-deposition process.
Abstract:
Device for determining displacement, the device comprising at least two substantially parallel plates located at a distance from each other. The device is arranged to determine a displacement of at least two predetermined parts of each of the plates with respect to each other and the displacement are directed substantially perpendicular to a main surface of the plates, wherein the displacement is a result of bending of the plates. The device comprises at least one sensor for measuring the displacement.
Abstract:
Device for determining displacement, the device comprising at least two substantially parallel plates located at a distance from each other. The device is arranged to determine a displacement of at least two predetermined parts of each of the plates with respect to each other and the displacement are directed substantially perpendicular to a main surface of the plates, wherein the displacement is a result of bending of the plates. The device comprises at least one sensor for measuring the displacement.