公开(公告)号：US20110293134A1

公开(公告)日：2011-12-01

申请号：US12978589

申请日：2010-12-26

Applicant: Jin-Quan HUANG

Inventor： Jin-Quan HUANG

IPC: H04R1/00

CPC classification number: H04R9/063

Abstract: A speaker having a voice coil is disclosed. The voice coil includes two parallel main members and two linking members connecting the two main members for forming a closed loop, one of the linking member having at least a first part from a first circle having a first diameter, and at least a second part from a second circle having a second diameter greater than the first diameter.

Abstract translation: 公开了一种具有音圈的扬声器。 音圈包括两个平行的主构件和两个连接构件，两个连接构件连接两个主构件以形成闭合环，其中一个连接构件具有至少一个第一部分，该第一部分具有第一直径的第一个圆形， 具有大于第一直径的第二直径的第二圆。

公开(公告)号：US20080246143A1

公开(公告)日：2008-10-09

申请号：US12136519

申请日：2008-06-10

Applicant: Yan-Kuin Su ,  Kuan-Chun Chen ,  Chun-Liang Lin ,  Jin-Quan Huang ,  Shu-Kai Hu

Inventor： Yan-Kuin Su ,  Kuan-Chun Chen ,  Chun-Liang Lin ,  Jin-Quan Huang ,  Shu-Kai Hu

IPC: H01L23/36

CPC classification number: H01L33/641 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01S5/0226 ,  H01S5/02276 ,  H01S5/02469 ,  H01L2924/00014

Abstract: An embedded metal heat sink for a semiconductor device is described. The embedded metal heat sink for a semiconductor device comprises a metal thin layer, a metal heat sink and two bonding pads. The metal thin layer including a first surface and a second surface on opposite sides, wherein at least one semiconductor device is embedded in the first surface of the metal thin layer, and the semiconductor device has two electrodes with different conductivity types. The metal heat sink is deposited on the second surface of the metal thin layer. The bonding pads are deposed on the first surface of the metal thin layer around the semiconductor device and are respectively corresponding to the electrodes, wherein the electrodes are electrically and respectively connected to the corresponding bonding pads by at least two wires, and the bonding pads are electrically connected to an outer circuit.

Abstract translation: 描述了一种用于半导体器件的嵌入式金属散热器。 用于半导体器件的嵌入式金属散热器包括金属薄层，金属散热器和两个接合焊盘。 所述金属薄层包括相对侧的第一表面和第二表面，其中至少一个半导体器件嵌入在所述金属薄层的第一表面中，并且所述半导体器件具有两个具有不同导电类型的电极。 金属散热器沉积在金属薄层的第二表面上。 接合焊盘被放置在半导体器件周围的金属薄层的第一表面上，并且分别对应于电极，其中电极通过至少两根电线电连接并分别连接到相应的焊盘，并且焊盘是 电连接到外部电路。

公开(公告)号：US20070121327A1

公开(公告)日：2007-05-31

申请号：US11429609

申请日：2006-05-05

Applicant: Guan-Qun Chen ,  Chun-Liang Lin ,  Shu-Kai Hu ,  Jin-Quan Huang

Inventor： Guan-Qun Chen ,  Chun-Liang Lin ,  Shu-Kai Hu ,  Jin-Quan Huang

IPC: F21V29/00

CPC classification number: H01L33/641 ,  H01L2933/0075

Abstract: A light-emitting device and a process for manufacturing the same are described. The light-emitting device comprises: a thin metal layer including a first surface and a second surface on opposite sides; a metal heat sink directly formed and closely connected to the second surface of the thin metal layer; and a light-emitting chip deposed on a portion of the first surface of the thin metal layer, wherein the thin metal layer directly contacts and is closely connected with the light-emitting chip.

Abstract translation: 对发光装置及其制造方法进行说明。 发光装置包括：薄金属层，包括在相对侧上的第一表面和第二表面; 金属散热片直接形成并紧密连接到薄金属层的第二表面; 以及设置在所述薄金属层的所述第一表面的一部分上的发光芯片，其中所述薄金属层直接接触并与所述发光芯片紧密连接。

公开(公告)号：US20050175830A1

公开(公告)日：2005-08-11

申请号：US10513402

申请日：2003-04-30

Applicant: Frank Wiese ,  Hartmut Stenzel ,  Quan Huang ,  Bernd Seibig ,  Dieter Paul

Inventor： Frank Wiese ,  Hartmut Stenzel ,  Quan Huang ,  Bernd Seibig ,  Dieter Paul

IPC: C08J9/12 ,  B29C44/34 ,  B29C47/64 ,  B29C47/92 ,  B29K101/12 ,  B29K105/04 ,  D01F1/08 ,  D01F6/46 ,  B32B3/26

CPC classification number: B29C44/3446 ,  B29C44/348 ,  B29C47/0011 ,  B29C47/364 ,  B29C47/40 ,  B29C47/889 ,  B29C47/92 ,  B29C2947/92514 ,  B29C2947/92704 ,  B29C2947/92895 ,  B29C2947/92904 ,  Y10T428/249953 ,  Y10T428/249958 ,  Y10T428/249978 ,  Y10T428/249979 ,  Y10T428/2982

Abstract: Method for producing foamed microporous polymer molded bodies by melting a thermoplastic polymer in a first zone of an extrusion device, mixing in a highly volatile blowing agent, conveying the polymer melt containing the blowing agent into a second zone in which dissolution of the blowing agent occurs to saturation of the polymer melt at the foaming temperature, and molding and foaming of the loaded polymer melt to a foamed structure, whereby, in the second zone, a pressure above 90 bar, a blowing agent concentration above the critical minimum concentration for complete foaming, and the foaming temperature, lying above the solidification temperature of the polymer melt saturated with blowing agent, are set such that the polymer molded body obtained has a porosity in the range between 40 and 90 vol. % and an open-cell pore structure with uniform cross-sectional distribution. Foamed microporous polymer molded bodies in the form of particles comprising a thermoplastic polymer with uniform open-cell pore structure, a porosity of 40 to 90 vol. %, an accessible proportion of pore volume of at least 0.75 and an average cell size between 1 and 100 μm.

Abstract translation: 通过在挤出装置的第一区域中熔化热塑性聚合物来制造发泡微孔聚合物成型体的方法，在高挥发性发泡剂中混合，将含有发泡剂的聚合物熔体输送到发生发泡剂溶解的第二区域 在发泡温度下使聚合物熔体饱和，并将负载的聚合物熔体成型和发泡成泡沫结构，由此在第二区域中压力高于90巴，发泡剂浓度高于完全发泡的临界最小浓度 并且在发泡剂饱和的聚合物熔体的凝固温度以上的发泡温度被设定为使得得到的聚合物成型体的孔隙率在40〜90体积％的范围内。 ％和具有均匀横截面分布的开孔细孔结构。 发泡微孔聚合物成型体，其为包含具有均匀开孔形式的热塑性聚合物的颗粒形式，孔隙率为40至90体积％。 ％，孔体积的可接近比例为至少0.75，平均泡孔尺寸为1至100μm。

公开(公告)号：US08483089B2

公开(公告)日：2013-07-09

申请号：US13000981

申请日：2010-06-21

Applicant: Yan Hu ,  Yong Xia ,  Yongqiang Liu ,  Quan Huang

Inventor： Yan Hu ,  Yong Xia ,  Yongqiang Liu ,  Quan Huang

IPC: H04W16/02

CPC classification number: H04L12/56 ,  H04L45/121 ,  H04L49/15 ,  H04L67/104

Abstract: The invention provides a server, a method and a system for providing node information for P2P network. A server in a peer-to-peer (P2P) network comprises: a location information storage unit which stores coordinate information indicating a coordinate of each data node in the P2P network in a coordinate system that is created based on communication delays among data nodes in the P2P network; and a node information providing unit which, upon receipt of a request for information on data nodes having a first data item, selects one or more data nodes from data nodes having the first data item based on the coordinate information, and provides information indicating the selected one or more data nodes.

Abstract translation: 本发明提供了一种用于为P2P网络提供节点信息的服务器，方法和系统。 点对点（P2P）网络中的服务器包括：位置信息存储单元，其存储在基于数据节点之间的通信延迟创建的坐标系中的指示P2P网络中每个数据节点的坐标的坐标信息 P2P网络; 以及节点信息提供单元，其在接收到关于具有第一数据项的数据节点的信息的请求时，基于所述坐标信息从具有所述第一数据项的数据节点中选择一个或多个数据节点，并且提供指示所选择的 一个或多个数据节点。

公开(公告)号：US20120243403A1

公开(公告)日：2012-09-27

申请号：US13294636

申请日：2011-11-11

Applicant: Yan HU ,  Yong XIA ,  Yongqiang LIU ,  Quan HUANG

Inventor： Yan HU ,  Yong XIA ,  Yongqiang LIU ,  Quan HUANG

IPC: H04L12/28 ,  H04L12/56

CPC classification number: H04L61/103 ,  H04L45/48 ,  H04L61/2038

Abstract: The present disclosure provides an addressing method, an addressing apparatus, a fabric manager, a switch, and a data routing method for data center networks. The addressing apparatus includes a tree creating unit for, sequentially with each of switches as a root, creating a tree containing all hosts by means of network topology discovery function, to obtain a plurality of trees; a tree selecting unit for selecting a tree having a minimum height among the created plurality of trees; and an address assigning unit for assigning addresses to each of switches and each of hosts in a network with respect to each selected tree having a minimum height. The present disclosure is adaptable to various topologies employed by the data center. The present disclosure can achieve aggregation of locator addresses so that a forwarding table can be shortened, and can achieve load balance of the network.

Abstract translation: 本公开提供了一种用于数据中心网络的寻址方法，寻址装置，结构管理器，交换机和数据路由方法。 寻址装置包括：树生成单元，用于依次以每个交换机为根，通过网络拓扑发现功能创建包含所有主机的树，以获得多个树; 树选择单元，用于选择所生成的多个树中具有最小高度的树; 以及地址分配单元，用于相对于具有最小高度的每个所选树分配地址到每个交换机和网络中的每个主机。 本公开适用于数据中心采用的各种拓扑。 本公开可以实现定位器地址的聚合，从而可以缩短转发表，并且可以实现网络的负载平衡。

公开(公告)号：US20080203598A1

公开(公告)日：2008-08-28

申请号：US12042972

申请日：2008-03-05

Applicant: Frank Wiese ,  Hartmut Stenzel ,  Quan Huang ,  Bernd Seibig ,  Dieter Paul

Inventor： Frank Wiese ,  Hartmut Stenzel ,  Quan Huang ,  Bernd Seibig ,  Dieter Paul

IPC: C08J9/06

CPC classification number: B29C44/3446 ,  B29B9/065 ,  B29B9/12 ,  B29C44/348 ,  B29C48/04 ,  B29C48/37 ,  B29C48/40 ,  B29C48/9185 ,  B29C48/92 ,  B29C2948/92514 ,  B29C2948/92704 ,  B29C2948/92895 ,  B29C2948/92904 ,  Y10T428/249953 ,  Y10T428/249958 ,  Y10T428/249978 ,  Y10T428/249979 ,  Y10T428/2982

Abstract: Method for producing foamed microporous polymer molded bodies by melting a thermoplastic polymer in a first zone of an extrusion device, mixing in a highly volatile blowing agent, conveying the polymer melt containing the blowing agent into a second zone in which dissolution of the blowing agent occurs to saturation of the polymer melt at the foaming temperature, and molding and foaming of the loaded polymer melt to a foamed structure, whereby, in the second zone, a pressure above 90 bar, a blowing agent concentration above the critical minimum concentration for complete foaming, and the foaming temperature, lying above the solidification temperature of the polymer melt saturated with blowing agent, are set such that the polymer molded body obtained has a porosity in the range between 40 and 90 vol. % and an open-cell pore structure with uniform cross-sectional distribution. Foamed microporous polymer molded bodies in the form of particles comprising a thermoplastic polymer with uniform open-cell pore structure, a porosity of 40 to 90 vol. %, an accessible proportion of pore volume of at least 0.75 and an average cell size between 1 and 100 μm.

Abstract translation: 通过在挤出装置的第一区域中熔化热塑性聚合物来制造发泡微孔聚合物成型体的方法，在高挥发性发泡剂中混合，将含有发泡剂的聚合物熔体输送到发生发泡剂溶解的第二区域 在发泡温度下使聚合物熔体饱和，并将负载的聚合物熔体成型和发泡成泡沫结构，由此在第二区域中压力高于90巴，发泡剂浓度高于完全发泡的临界最小浓度 并且在发泡剂饱和的聚合物熔体的凝固温度以上的发泡温度被设定为使得得到的聚合物成型体的孔隙率在40〜90体积％的范围内。 ％和具有均匀横截面分布的开孔细孔结构。 发泡微孔聚合物成型体，其为包含具有均匀开孔形式的热塑性聚合物的颗粒形式，孔隙率为40至90体积％。 ％，孔体积的可接近比例为至少0.75，平均泡孔尺寸为1至100μm。

公开(公告)号：US20070298543A1

公开(公告)日：2007-12-27

申请号：US11470273

申请日：2006-09-06

Applicant: Yan-Kuin SU ,  Kuan-Chun CHEN ,  Chun-Liang LIN ,  Jin-Quan HUANG ,  Shu-Kai HU

Inventor： Yan-Kuin SU ,  Kuan-Chun CHEN ,  Chun-Liang LIN ,  Jin-Quan HUANG ,  Shu-Kai HU

IPC: H01L21/00

CPC classification number: H01L33/0079 ,  H01L33/641 ,  H01S5/02256 ,  H01S5/02272 ,  H01S5/024 ,  H01S5/02476 ,  H01S5/4093

Abstract: A method for manufacturing a heat sink of a semiconductor device is described. In the method, an adhesive tape is provided, wherein the adhesive tape includes a first surface and a second surface on opposite sides, and the first surface of the adhesive tape adheres to a surface of a temporary substrate. At least one semiconductor device is provided, wherein the semiconductor device includes a first side and a second side opposite to the first side, and the first side of the one semiconductor device is pressed and set into a portion of the second surface of the adhesive tape, and the second side of the one semiconductor device is exposed. A thin metal layer is formed on the second side of the semiconductor device and the exposed portion of the second surface of the adhesive tape. A metal heat sink is formed on the thin metal layer. Then, the adhesive tape and the temporary substrate are removed.

Abstract translation: 描述了制造半导体器件的散热器的方法。 在该方法中，提供了一种粘合带，其中胶带包括第一表面和相对侧上的第二表面，并且粘合带的第一表面粘附到临时基底的表面。 提供至少一个半导体器件，其中半导体器件包括与第一侧相对的第一侧和第二侧，并且一个半导体器件的第一侧被压入并设置在粘合带的第二表面的一部分中 并且暴露一个半导体器件的第二面。 在半导体器件的第二侧和胶带的第二表面的暴露部分上形成薄金属层。 在薄金属层上形成金属散热器。 然后，去除胶带和临时基板。

公开(公告)号：US20070296508A1

公开(公告)日：2007-12-27

申请号：US11896180

申请日：2007-08-30

Applicant: Chih Yang ,  Chien Lee ,  Hsiang Liu ,  Quan Huang

Inventor： Chih Yang ,  Chien Lee ,  Hsiang Liu ,  Quan Huang

IPC: H03L7/085

CPC classification number: H03L7/0991 ,  H03L7/093 ,  H04L7/08

Abstract: An auto-adjusting high accuracy oscillator is disclosed, which comprises: a frequency comparator, for comparing a synchronization signal obtained from a USB host with an oscillation signal obtain from a device; a control tuning circuit, further comprising a counter and an adder/sub circuit; and an oscillating element; wherein a variation is obtained by the counting of the counter while transmitting the variation to the adder/sub circuit to be encoded thereby into a digital code so as to enable the oscillating element to perform a frequency up/down operation accordingly for approaching the synchronization signal successively.

Abstract translation: 公开了一种自动调节高精度振荡器，它包括：频率比较器，用于将从USB主机获得的同步信号与从设备获得的振荡信号进行比较; 控制调谐电路，还包括计数器和加法器/子电路; 和振荡元件; 其中通过对所述计数器进行计数而获得变化，同时将所述变化发送到要编码的加法器/子电路，从而形成数字代码，以使所述振荡元件能够相应地进行上变频/下变频操作以接近所述同步信号 依次。

公开(公告)号：US08649549B2

公开(公告)日：2014-02-11

申请号：US12978589

申请日：2010-12-26

Applicant: Jin-Quan Huang

Inventor： Jin-Quan Huang

IPC: H04R1/00

CPC classification number: H04R9/063

Abstract: A speaker having a voice coil is disclosed. The voice coil includes two parallel main members and two linking members connecting the two main members for forming a closed loop, one of the linking member having at least a first part from a first circle having a first diameter, and at least a second part from a second circle having a second diameter greater than the first diameter.

Abstract translation: 公开了一种具有音圈的扬声器。 音圈包括两个平行的主构件和两个连接构件，两个连接构件连接两个主构件以形成闭合环，其中一个连接构件具有至少一个第一部分，该第一部分具有第一直径的第一个圆形， 具有大于第一直径的第二直径的第二圆。