Abstract:
A closed loop steam engine that transfers its motive power to a flow of water using a steam injector. The resulting water jet then drives a turbine, is cooled in a heat exchanger to extract useful heat and then return to the steam injector water inlet. Part of the flow of water is reused as feed water to the boiler.
Abstract:
An electrochemical noise method, apparatus and system calculates parameters of interest related to corrosion rates of an electrically conductive article. The method involves placing a test electrode, a reference electrode, and an auxiliary electrode in an environment of interest; placing the test electrode under potentiostatic control regime for a potential scan; measuring the relationship of current v. potential (polarization resistance, Rp) of the test electrode relative to the reference electrode during a first period; switching from potentiostatic control to the open circuit potential (OCP) of the test electrode; monitoring the OCP of the test electrode during a second period; determining ΔI from the relationship Rp=ΔV/ΔI, where ΔV is measured over a second period of time; and calculating the localized corrosion from the measured potential and current data.
Abstract:
A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.
Abstract:
A closed loop steam engine that transfers its motive power to a flow of water using a steam injector. The resulting water jet then drives a turbine, is cooled in a heat exchanger to extract useful heat and then return to the steam injector water inlet. Part of the flow of water is reused as feed water to the boiler.
Abstract:
A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.
Abstract:
An assembly for controlling delivery of material from a bin opening includes a movable bin gate for closing the bin opening and providing a high flow rate of material when the movable gate is open, wherein a low flow aperture is formed in the bin gate to provide a low flow rate of material when the bin gate is positioned such that only the low flow aperture is open. A two-stage flow enhancer within the bin includes a first stage for impelling material in the direction of the low flow aperture and a second stage for impelling material to exit through the low flow aperture. A controller controls operation of the bin gate to adjust a flow rate of material from the bin opening. The controller may include a sensor for providing an actual weight value of material present in a receiving bin and a memory for storing a target weight value for the amount of material in the receiving bin, wherein the controller adjusts the position of the bin gate and the low flow aperture in response to the actual weight value and the target weight value. The bin gate may also be adjusted in response to one or more tolerance values defining proximity to the target weight value and/or in response to one or more threshold weight values, wherein the threshold weight values are less than the target weight value. A method for controlling delivery of material from a bin opening includes the steps of providing at the bin opening a movable bin gate with a low flow aperture and selectively positioning the bin gate using a single actuator to expose only the low flow aperture to the bin opening for material flow or to expose substantially all of the bin opening for material flow.
Abstract:
A container sealing apparatus 10 comprises an electrically conductive linearly displaceable cutting member 14 operable to cut a portion 18 of sealing material from a web 16 and an independently linearly displaceable transfer member 42 comprising an electrically insulating material and extendible relative to the cutting member 14 to transfer the cut portion 18 of sealing material to an open top of a container 12 to be sealed. An induction coil 52 produces an induction field 54 for heating the cut portion 18 of sealing material, either directly or indirectly, by induction heating to seal the cut portion 18 of sealing material to the open top of the container 12. The linearly displaceable transfer member 42 holds the cut portion 18 of sealing material against the open top of the container 12 during induction heating. A field concentrator 56 is provided to concentrate the induction field 54 in a desired region away from the linearly displaceable electrically conductive cutting member 14 and other electrically conductive component parts of the apparatus 10 to optimize the induction heating of the cut portion 18 of sealing material.
Abstract:
A container sealing apparatus 10 comprises an electrically conductive linearly displaceable cutting member 14 operable to cut a portion 18 of sealing material from a web 16 and an independently linearly displaceable transfer member 42 comprising an electrically insulating material and extendible relative to the cutting member 14 to transfer the cut portion 18 of sealing material to an open top of a container 12 to be sealed. An induction coil 52 produces an induction field 54 for heating the cut portion 18 of sealing material, either directly or indirectly, by induction heating to seal the cut portion 18 of sealing material to the open top of the container 12. The linearly displaceable transfer member 42 holds the cut portion 18 of sealing material against the open top of the container 12 during induction heating. A field concentrator 56 is provided to concentrate the induction field 54 in a desired region away from the linearly displaceable electrically conductive cutting member 14 and other electrically conductive component parts of the apparatus 10 to optimize the induction heating of the cut portion 18 of sealing material.
Abstract:
Simultaneous determination of general corrosion and localized corrosion rate measurements is achieved with polarization applied by the electrodes themselves rather than externally applied polarization. Two or more working electrodes may be galvanically coupled. A localized pitting corrosion event on one of the electrodes will lead to a potential transient. The area within the potential transient is measured with the baseline being the initial starting potential. This gives localized corrosion as a function of time. The relationship Rp=ΔV/ΔI is calculated, where Rp is the polarization resistance of the working electrodes and is a measure of generalized corrosion rate.
Abstract:
A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.