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公开(公告)号：US07070909B2
公开(公告)日：2006-07-04
申请号：US10928178
申请日：2004-08-30
CPC分类号： D03D1/0082 , B32B5/26 , B32B17/04 , C03C25/42 , D03D15/0011 , H05K1/0366 , H05K3/0082 , H05K2201/0112 , H05K2201/029 , Y10S428/901 , Y10T156/10 , Y10T428/31525 , Y10T442/2008 , Y10T442/2926 , Y10T442/2951 , Y10T442/2992 , Y10T442/3976
摘要： The glass transmittance of UV light having a wavelength of 365 nanometers is reduced by compounding an oxide or salt of at least one of Fe, Cu, Cr, Ce, Mn and mixtures thereof. The fiberglass cloth can be used for providing reinforced prepregs used in producing printed circuit boards or laminated chip carrier substrates.
摘要翻译： 通过配合Fe，Cu，Cr，Ce，Mn及其混合物中的至少一种的氧化物或盐来减少波长为365纳米的UV光的玻璃透射率。 玻璃纤维布可用于制造用于制造印刷电路板或层压芯片载体基板的增强预浸料。
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公开(公告)号：US06838400B1
公开(公告)日：2005-01-04
申请号：US09046105
申请日：1998-03-23
CPC分类号： D03D1/0082 , B32B5/26 , B32B17/04 , C03C25/42 , D03D15/0011 , H05K1/0366 , H05K3/0082 , H05K2201/0112 , H05K2201/029 , Y10S428/901 , Y10T156/10 , Y10T428/31525 , Y10T442/2008 , Y10T442/2926 , Y10T442/2951 , Y10T442/2992 , Y10T442/3976
摘要： The glass transmittance of UV light having a wavelength of 365 nanometers is reduced by compounding an oxide or salt of at least one of Fe, Cu, Cr, Ce, Mn and mixtures thereof. The fiberglass cloth can be used for providing reinforced prepregs used in producing printed circuit boards or laminated chip carrier substrates.
摘要翻译： 通过配合Fe，Cu，Cr，Ce，Mn及其混合物中的至少一种的氧化物或盐来减少波长为365纳米的UV光的玻璃透射率。 玻璃纤维布可用于制造用于制造印刷电路板或层压芯片载体基板的增强预浸料。
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公开(公告)号：US20050026051A1
公开(公告)日：2005-02-03
申请号：US10928178
申请日：2004-08-30
申请人： Robert Japp , Pamela Lulkoski , Jeffrey McKeveny , Jan Obrzut , Kenneth Potter
发明人： Robert Japp , Pamela Lulkoski , Jeffrey McKeveny , Jan Obrzut , Kenneth Potter
CPC分类号： D03D1/0082 , B32B5/26 , B32B17/04 , C03C25/42 , D03D15/0011 , H05K1/0366 , H05K3/0082 , H05K2201/0112 , H05K2201/029 , Y10S428/901 , Y10T156/10 , Y10T428/31525 , Y10T442/2008 , Y10T442/2926 , Y10T442/2951 , Y10T442/2992 , Y10T442/3976
摘要： The glass transmittance of UV light having a wavelength of 365 nanometers is reduced by compounding an oxide or salt of at least one of Fe, Cu, Cr, Ce, Mn and mixtures thereof. The fiberglass cloth can be used for providing reinforced prepregs used in producing printed circuit boards or laminated chip carrier substrates.
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公开(公告)号：US6030154A
公开(公告)日：2000-02-29
申请号：US100618
申请日：1998-06-19
CPC分类号： H05K3/4638 , G05B19/19 , G05B2219/36404 , G05B2219/37506 , G05B2219/37569 , G05B2219/45035 , G05B2219/50071 , H05K2203/163 , H05K3/0008 , H05K3/0047 , Y10T408/03 , Y10T408/05 , Y10T408/08
摘要： A method and apparatus for optimizing the drilling position of a multi-layer printed circuit board prior to drilling. Each board is x-rayed to determine location coordinates information of the inner layers of multi layer circuit board panels. An optimization process determines optimal locations for drilling. The board is then drilled according to the optimized coordinates. By minimizing misregistration between the drilled holes and inner layers of the multi layer semiconductor circuit board, the present invention reduces a significant cause of scrap to the circuit board industry as well as removing a major impediment to further increasing circuit density and wireability.
摘要翻译： 一种用于在钻孔之前优化多层印刷电路板的钻孔位置的方法和装置。 每个板被x射线以确定多层电路板面板内层的位置坐标信息。 优化过程确定钻井的最佳位置。 然后根据优化的坐标钻出板。 通过最小化多层半导体电路板的钻孔和内层之间的配准不足，本发明减少了对电路板工业的废料的重大原因，并且消除了进一步增加电路密度和可线性的主要障碍。
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