SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD

    公开(公告)号:US20220330436A1

    公开(公告)日:2022-10-13

    申请号:US17852332

    申请日:2022-06-28

    申请人: PROTEC CO., LTD.

    IPC分类号: H05K3/12

    摘要: The present disclosure relates to a substrate processing apparatus and a substrate processing method, for manufacturing a flexible circuit board, and more specifically, to a substrate processing apparatus and a substrate processing method, for manufacturing a flexible circuit board, capable of manufacturing a flexible circuit board with a fine line width without undergoing a photolithographic process using a mask.
    The substrate processing apparatus and the substrate processing method, for manufacturing a flexible circuit board, according to the present disclosure, can efficiently manufacture a flexible circuit board having a fine line width at low costs.

    Mask changing unit for laser bonding apparatus

    公开(公告)号:US11358236B2

    公开(公告)日:2022-06-14

    申请号:US16436943

    申请日:2019-06-11

    申请人: PROTEC CO., LTD.

    发明人: Geunsik Ahn

    摘要: Provided is a mask changing unit for a laser bonding apparatus, and more particularly, a mask changing unit for a laser bonding apparatus, wherein the mask changing unit supplies or changes a mask to or in the laser bonding apparatus for bonding a semiconductor chip to a substrate by using a laser beam.
    The mask changing unit for a laser bonding apparatus, a plurality of masks that are used in performing laser bonding of a semiconductor chip to a substrate while the semiconductor chip is being pressed may be easily supplied to the laser bonding apparatus or changed in the laser bonding apparatus.

    Method of mounting conductive ball

    公开(公告)号:US10804240B2

    公开(公告)日:2020-10-13

    申请号:US16365693

    申请日:2019-03-27

    申请人: PROTEC CO., LTD.

    摘要: Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls.

    Pump position feedback type dispenser and dispensing method

    公开(公告)号:US10304701B2

    公开(公告)日:2019-05-28

    申请号:US15336816

    申请日:2016-10-28

    申请人: PROTEC CO., LTD.

    发明人: Jong Myoung Choi

    摘要: Provided are a pump position feedback type dispenser and dispensing method, in which an image of a work, to which a viscous liquid is to be dispensed, is captured to determine an accurate position and direction of the work, and then a position of a pump is received in real time so as to dispense the viscous liquid to the work while ensuring that the pump reaches the accurate position of the work.

    SLURRY DISPENSING APPARATUS FOR EMI SHIELDING

    公开(公告)号:US20180035575A1

    公开(公告)日:2018-02-01

    申请号:US15663823

    申请日:2017-07-31

    申请人: PROTEC CO., LTD.

    发明人: SEUNG MIN HONG

    IPC分类号: H05K9/00 B05C11/10 B05C5/02

    摘要: Provided is a slurry dispensing apparatus for electromagnetic interference (EMI) shielding, and more particularly, a slurry dispensing apparatus for EMI shielding, wherein the slurry dispensing apparatus dispenses a slurry, in which a conductive metal powder and an adhesive are mixed, to an electronic component to form an electromagnetic wave shielding layer on the electronic component.By using the slurry dispensing apparatus for EMI shielding, the slurry may be dispensed while preventing separation of the metal powder included in the slurry from the adhesive by precipitation, and maintaining a uniform mixture ratio in the slurry.

    Valve impact type dispensing pump
    8.
    发明授权
    Valve impact type dispensing pump 有权
    阀门冲击式分配泵

    公开(公告)号:US09517486B2

    公开(公告)日:2016-12-13

    申请号:US14599795

    申请日:2015-01-19

    申请人: PROTEC CO., LTD.

    摘要: A dispensing pump, and more particularly, a valve impact type dispensing pump that may be used in a process of manufacturing an electronic product and may dispense an accurate amount of a liquid, such as a liquid synthetic resin, at high speed. The valve impact type dispensing pump can descend a valve rod at high speed and thus can dispense a liquid with high viscosity at high speed. The valve impact type dispensing pump can dispense an accurate amount of a liquid at high speed. Also, the valve impact type dispensing pump can dispense a liquid having high viscosity at high speed due to a fast descending speed of a valve rod.

    摘要翻译: 一种分配泵,更具体地说,一种可用于电子产品制造过程中的阀冲击式分配泵,并且可以高速地分配精确量的液体,例如液体合成树脂。 阀冲击型分配泵可以高速下降阀杆,因此可以高速分配高粘度的液体。 阀冲击式分配泵可以高速分配精确量的液体。 此外,阀冲击型分配泵可以由于阀杆的快速下降速度而高速分配高粘度的液体。

    Temperature-sensing piezoelectric dispenser
    9.
    发明授权
    Temperature-sensing piezoelectric dispenser 有权
    温度感应压电分配器

    公开(公告)号:US09429368B2

    公开(公告)日:2016-08-30

    申请号:US14754722

    申请日:2015-06-30

    申请人: PROTEC CO., LTD.

    摘要: Provided is a temperature-sensing piezoelectric dispenser, and more particularly, to a dispenser including a piezoelectric pump dispensing a liquid by using a piezoelectric element as an actuator. According to the temperature-sensing piezoelectric dispenser, a temperature of a piezoelectric actuator is measured and the piezoelectric actuator is cooled based on the measured temperature, thereby accurately controlling a liquid discharged according to an operation of the piezoelectric actuator.

    摘要翻译: 提供一种温度感测型压电分配器,更具体地,涉及包括通过使用压电元件作为致动器分配液体的压电泵的分配器。 根据感温压电分配器,测量压电致动器的温度,并且基于测量的温度冷却压电致动器,从而根据压电致动器的操作精确地控制排出的液体。

    APPARATUS AND METHOD FOR DETACHING CHIP
    10.
    发明申请
    APPARATUS AND METHOD FOR DETACHING CHIP 审中-公开
    用于分离芯片的装置和方法

    公开(公告)号:US20150279716A1

    公开(公告)日:2015-10-01

    申请号:US14670415

    申请日:2015-03-27

    申请人: PROTEC CO., LTD.

    发明人: YOUN SUNG KO

    IPC分类号: H01L21/683

    摘要: Provided are an apparatus and method for detaching a chip, in which a semiconductor chip attached to a tape is detached so as to supply and mount the semiconductor chip on a package or a circuit board. Accordingly, a semiconductor chip may be effectively detached from a tape while minimizing an impact transferred to the semiconductor chip.

    摘要翻译: 提供了一种用于分离芯片的装置和方法,其中附接到磁带的半导体芯片被分离以便将半导体芯片提供并安装在封装或电路板上。 因此,半导体芯片可以有效地从带上分离,同时最小化传递到半导体芯片的冲击。