公开(公告)号：US10384286B2

公开(公告)日：2019-08-20

申请号：US15896025

申请日：2018-02-13

申请人： PROTEC CO., LTD.

发明人： Moo Sup Shim ,  Seong Yong Ji ,  Hyoung Yeon Ju ,  Chiho Cho

IPC分类号： B23K3/06 ,  B23K3/08 ,  B23K1/00 ,  H01L23/00 ,  H05K3/34 ,  B23K101/36

摘要： A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.

公开(公告)号：US10475728B2

公开(公告)日：2019-11-12

申请号：US15896029

申请日：2018-02-13

申请人： PROTEC CO., LTD.

发明人： Moo Sup Shim ,  Seong Yong Ji ,  Hyoung Yeon Ju ,  Chiho Cho

IPC分类号： H01L23/495 ,  B23K3/08 ,  H01L23/00 ,  H05K13/00 ,  H05K3/34 ,  H01L23/498

摘要： An apparatus for bonding a flexible part including inclined leads is provided, more particularly, an apparatus for bonding a flexible part including inclined leads, which aligns parts to bond the parts is provided. According to the apparatus for bonding a flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.