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公开(公告)号：US06385043B1
公开(公告)日：2002-05-07
申请号：US09688857
申请日：2000-10-17
IPC分类号： H05K720
CPC分类号： G06F1/203 , G02F1/133382 , G06F1/20
摘要： The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
摘要翻译： 本发明涉及一种笔记本式计算机的散热结构，能够有效地散发由高温元件（CPU）产生的热量。 散热结构包括主体，显示装置和用于将主体与显示装置连接的铰链轴，其中铰链轴设置在与主体相距一定距离的上方，并且散热装置设置在 主体。
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公开(公告)号：US06219236B1
公开(公告)日：2001-04-17
申请号：US09448496
申请日：1999-11-24
申请人： Minoru Hirano , Masumi Suzuki
发明人： Minoru Hirano , Masumi Suzuki
IPC分类号： H05K720
CPC分类号： H01L23/467 , H01L23/40 , H01L23/4006 , H01L2924/0002 , H05K7/20436 , H05K7/20472 , H05K7/20509 , H01L2924/00
摘要： It is an object of the present invention to provide a cooling system capable of simultaneously cooling the electronic parts on a multichip module that is arranged so as to provide a predetermined function, wherein the cooling system can be easily and quickly attached to and detached from the module when necessary. The present invention is to provide a cooling system for cooling a multichip module MCM having a predetermined function, on the substrate B of which a plurality of electronic parts including heat generating parts P are mounted, the cooling system for cooling a multichip module comprising: a radiating body 1 capable of covering upper portions of the plurality of electronic parts P while a predetermined clearance is formed between the radiating body 1 and the electronic parts P; a sheet S made of silicon rubber arranged in the clearance, for thermally connecting the upper surfaces of the electronic parts and the radiating member; and a screw N for detachably connecting the radiating body with the substrate B of the multichip module MCM.
摘要翻译： 本发明的目的是提供一种冷却系统，其能够同时冷却多芯片模块上的电子部件，该多芯片模块被布置成提供预定功能，其中冷却系统可以容易且快速地附接到 模块必要时。 本发明提供一种用于冷却具有预定功能的多芯片模块MCM的冷却系统，该冷却系统在其上安装有包括发热部件P的多个电子部件的基板B上，用于冷却多芯片模块的冷却系统包括： 在辐射体1和电子部件P之间形成有规定的间隙的情况下，能够覆盖多个电子部件P的上部的散热体1; 布置在所述间隙中的由硅橡胶制成的片材S，用于热连接所述电子部件和所述散热构件的上表面; 以及用于将散热体与多芯片模块MCM的基板B可拆卸地连接的螺钉N.
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3.发明授权Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together 失效具有多层电路板的多芯片模块，绝缘层和布线导体堆叠在一起
公开(公告)号：US5586006A
公开(公告)日：1996-12-17
申请号：US573577
申请日：1995-12-15
申请人： Kiyotaka Seyama , Shunichi Kikuchi , Makoto Sumiyoshi , Naoki Yasuda , Minoru Hirano , Hitoshi Nori
发明人： Kiyotaka Seyama , Shunichi Kikuchi , Makoto Sumiyoshi , Naoki Yasuda , Minoru Hirano , Hitoshi Nori
IPC分类号： H01L25/18 , H01L21/60 , H01L23/12 , H01L23/498 , H01L25/04 , H01L25/065 , H05K1/14 , H05K3/34 , H05K3/36 , H05K3/46 , H05K7/20
CPC分类号： H01L25/0657 , H01L23/49811 , H05K1/141 , H01L2224/16 , H01L2224/48225 , H01L2224/48227 , H01L2225/0651 , H01L2225/06555 , H01L2225/06572 , H01L2225/06579 , H01L2225/06589 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/10253 , H01L2924/15312 , H01L2924/1532 , H01L2924/19041 , H05K2201/0317 , H05K2201/1031 , H05K2201/10318 , H05K2201/10477 , H05K3/3421 , H05K3/3426 , H05K3/3436 , H05K3/368 , H05K3/467 , Y02P70/611
摘要： A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.
摘要翻译： 多芯片模块包括基板，薄膜多层电路板，其设置在基板的第一表面上，并且具有层叠绝缘层和布线导体的多层结构，安装有电路元件 在薄膜多层电路板的主表面上，以及端子，其安装在薄膜多层电路板的主表面上，并将布线导体电连接到形成在其上的电路板上的电路 安装了多芯片模块。
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公开(公告)号：US20080236797A1
公开(公告)日：2008-10-02
申请号：US12003542
申请日：2007-12-28
申请人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
发明人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
CPC分类号： H01L23/427 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
摘要翻译： 冷却单元具有从体内散发热量的热量接收单元， 散热器，其设置在与所述受热单元一定距离处，并且散热回收的热量; 将在所述热接收单元处产生的热量的热量输送到所述散热器; 以及中空管，其设置成使得所述液体冷却剂在所述受热单元和所述散热器之间循环，所述液体冷却剂的循环流由通过在所述受热单元处接收的热产生的气泡的升高力而形成，所述散热器具有 空气袋与中空管一起形成液体冷却剂的循环路径的一部分并且能够收集气泡。
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公开(公告)号：US06935786B2
公开(公告)日：2005-08-30
申请号：US10254761
申请日：2002-09-26
申请人： Minoru Hirano , Toshihiko Shima
发明人： Minoru Hirano , Toshihiko Shima
CPC分类号： F16C32/0651 , F16C32/0659 , F16C32/0685 , F16C33/1075
摘要： A hydraulic bearing that supports a rotating shaft comprises a bearing metal. On a surface of the bearing metal, a hydrostatic pocket and a land portion are formed. The land portion is defined by the hydrostatic pocket and generates hydrodynamic pressure in response to a rotation of the rotating shaft. The hydraulic bearing further comprises a pressure fluid supplying source and an oil-supplying hole. The oil-supplying hole is opened in the hydrostatic pocket and provides pressure fluid from the pressure fluid supplying source to the hydrostatic pocket. On the land portion, a drain hole that drains the fluid is formed. On the way of a drain passage, a check valve is disposed. Since the drain hole does not separate the land portion, deterioration of bearing rigidity is restrained. Further, since the fluid is drained through the drain hole, thermal expansion of the bearing metal due to heat generation of the fluid is restrained. Moreover, according to the check valve, it is possible to prevent suctioning air into the hydraulic bearing when negative pressure generates at the land portion.
摘要翻译： 支撑旋转轴的液压轴承包括轴承金属。 在轴承金属的表面上形成静压袋和台阶部。 地面部分由流体静力袋定义，并响应于旋转轴的旋转产生流体动力学压力。 液压轴承还包括压力流体供应源和供油孔。 供油孔在静液压袋中打开，并将压力流体从压力流体供应源提供给静液压袋。 在陆部上形成排出流体的排水孔。 在排水通道的路上，设置止回阀。 由于排水孔不分离陆部，因此抑制了轴承刚性的劣化。 此外，由于流体通过排水孔排出，所以抑制了由于流体的发热引起的轴承金属的热膨胀。 此外，根据止回阀，当在陆部产生负压时，可以防止在空气中吸入空气。
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公开(公告)号：US06564861B1
公开(公告)日：2003-05-20
申请号：US09548426
申请日：2000-04-12
申请人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
发明人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
IPC分类号： F28D1500
CPC分类号： H01L23/427 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
摘要翻译： 冷却单元具有从体内散发热量的热量接收单元， 散热器，其设置在与所述受热单元一定距离处，并且散热回收的热量; 将在所述热接收单元处产生的热量的热量输送到所述散热器; 以及中空管，其设置成使得所述液体冷却剂在所述受热单元和所述散热器之间循环，所述液体冷却剂的循环流由通过在所述受热单元处接收的热产生的气泡的升高力而形成，所述散热器具有 空气袋与中空管一起形成液体冷却剂的循环路径的一部分并且能够收集气泡。
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公开(公告)号：US06469892B2
公开(公告)日：2002-10-22
申请号：US09791873
申请日：2001-02-26
申请人： Akira Ueda , Masumi Suzuki , Minoru Hirano
发明人： Akira Ueda , Masumi Suzuki , Minoru Hirano
IPC分类号： H05K720
CPC分类号： G06F1/203 , G02F1/133382 , G06F1/20
摘要： The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
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公开(公告)号：US06281342B1
公开(公告)日：2001-08-28
申请号：US08241837
申请日：1994-05-12
申请人： Hajime Kamachi , Minoru Hirano , Shinji Masuyoshi
发明人： Hajime Kamachi , Minoru Hirano , Shinji Masuyoshi
IPC分类号： C07H100
CPC分类号： C07H15/244
摘要： Disclosed are novel pradimicin compounds which possess antifungal activity and, preferably, improved water solubility. The compounds of the invention are prepared by modifying the 4′-amino or 4′-alkylamino moieties of known pradimicin compounds.
摘要翻译： 公开了具有抗真菌活性，优选改善的水溶性的新型普拉明霉素化合物。 本发明的化合物通过改性已知的普拉定霉素化合物的4'-氨基或4'-烷基氨基部分制备。
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公开(公告)号：US06226180B1
公开(公告)日：2001-05-01
申请号：US08848728
申请日：1997-05-22
IPC分类号： H05K720
CPC分类号： G06F1/203 , G02F1/133382 , G06F1/20
摘要： The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
摘要翻译： 本发明涉及一种笔记本式计算机的散热结构，能够有效地散发由高温元件（CPU）产生的热量。 散热结构包括主体，显示装置和用于将主体与显示装置连接的铰链轴，其中铰链轴设置在与主体相距一定距离的上方，并且散热装置设置在 主体。
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公开(公告)号：US6031718A
公开(公告)日：2000-02-29
申请号：US681452
申请日：1996-07-23
申请人： Masumi Suzuki , Minoru Hirano
发明人： Masumi Suzuki , Minoru Hirano
IPC分类号： G06K19/077 , G06F1/20 , G06K19/00 , H05K5/02 , H05K7/20
CPC分类号： H05K5/0269 , G06F1/203 , G06F2200/201
摘要： An IC card adapted to be removably inserted into a slot of an IC card mountable device, including a card housing formed like a substantially rectangular card with an inside space defined therein, the card housing having a plurality of openings through a wall of the card housing; a printed wiring board accommodated in the card housing; and a plurality of electronic components mounted on the printed wiring board.
摘要翻译： 一种适于可拆卸地插入到IC卡可安装装置的槽中的IC卡，包括形成为具有限定在其中的内部空间的大致矩形卡的卡壳体，卡壳体具有穿过卡壳体的壁的多个开口 ; 容纳在所述卡壳体中的印刷线路板; 以及安装在印刷电路板上的多个电子部件。
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