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公开(公告)号:US07718457B2
公开(公告)日:2010-05-18
申请号:US11099118
申请日:2005-04-05
申请人: Thomas Chen , Michael Judy
发明人: Thomas Chen , Michael Judy
IPC分类号: H01L21/00
CPC分类号: B81C1/00698 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2207/07 , B81C2201/0173 , B81C2201/053
摘要: A method of producing a MEMS device provides an apparatus having structure on a first layer that is proximate to a substrate. The apparatus has a space proximate to the structure. The method adds doped material to the space. The doped material dopes at least a portion of the first layer.
摘要翻译: MEMS器件的制造方法提供了一种在靠近衬底的第一层上具有结构的设备。 该装置具有靠近结构的空间。 该方法向该空间添加掺杂材料。 掺杂材料涂覆第一层的至少一部分。
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公开(公告)号:US20080087086A1
公开(公告)日:2008-04-17
申请号:US11952404
申请日:2007-12-07
申请人: John Martin , Timothy Brosnihan , Michael Judy , Xin Zhang
发明人: John Martin , Timothy Brosnihan , Michael Judy , Xin Zhang
IPC分类号: G01P15/125
CPC分类号: B60C23/0408 , B81B3/0018 , H01G5/18 , H01G5/40 , H01L2224/16145 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要: Rather than increasing the mass of the structure, the structure in a sensor system suspends its substrate from some mechanical ground. Motion of the substrate relative to the mechanical ground thus provides the movement information. To those ends, the sensor system includes a base, a substrate, and a flexible member suspended from at least a portion of the substrate. At least a portion of the flexible member is capable of moving relative to at least a portion of the substrate. In addition, the flexible member is secured to the base, thus causing the substrate to be movable relative to the base. Moreover, the mass of the substrate is greater than the mass of the flexible member. The substrate and flexible member are configured to interact to produce a motion signal identifying movement of the base.
摘要翻译: 传感器系统中的结构不是增加结构的质量,而是将其基板从某些机械接地处悬挂下来。 因此,基板相对于机械地面的运动提供运动信息。 为此,传感器系统包括基底,基底和从基底的至少一部分悬挂的柔性构件。 柔性构件的至少一部分能够相对于衬底的至少一部分移动。 此外,柔性构件被固定到基部,从而使得基板相对于基座移动。 此外,衬底的质量大于柔性构件的质量。 衬底和柔性构件被配置为相互作用以产生识别基部的移动的运动信号。
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公开(公告)号:US20070180912A1
公开(公告)日:2007-08-09
申请号:US11598540
申请日:2006-11-13
申请人: Michael Judy , Howard Samuels
发明人: Michael Judy , Howard Samuels
CPC分类号: G01P15/18 , B81B3/0072 , B81B2201/0235 , B81B2203/051 , B81B2203/055 , G01P15/0802 , G01P15/125 , G01P2015/0814 , G01P2015/082 , Y10T29/49007 , Y10T74/1293
摘要: In an inertial sensor, a mass is supported by a number of mass support structures positioned within an inner periphery of the mass. The mass support structures are affixed to a substrate by at least one anchor positioned proximate to the mass' center of mass. A number of sensing fingers are affixed to the mass support structures.
摘要翻译: 在惯性传感器中,质量由位于质量块的内周内的多个质量支撑结构支撑。 质量支撑结构通过靠近质量“质心”定位的至少一个锚固定到基底上。 多个传感指固定到质量支撑结构上。
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公开(公告)号:US20060223291A1
公开(公告)日:2006-10-05
申请号:US11099118
申请日:2005-04-05
申请人: Thomas Chen , Michael Judy
发明人: Thomas Chen , Michael Judy
IPC分类号: H01L21/425
CPC分类号: B81C1/00698 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2207/07 , B81C2201/0173 , B81C2201/053
摘要: A method of producing a MEMS device provides an apparatus having structure on a first layer that is proximate to a substrate. The apparatus has a space proximate to the structure. The method adds doped material to the space. The doped material dopes at least a portion of the first layer.
摘要翻译: MEMS器件的制造方法提供了一种在靠近衬底的第一层上具有结构的设备。 该装置具有靠近结构的空间。 该方法向该空间添加掺杂材料。 掺杂材料涂覆第一层的至少一部分。
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公开(公告)号:US20060204232A1
公开(公告)日:2006-09-14
申请号:US11335156
申请日:2006-01-19
IPC分类号: G03B17/00
CPC分类号: H04N5/23293 , G03B17/02 , G03B17/20 , H04N5/232 , H04N5/2327
摘要: A method and system for determining camera positioning information from an accelerometer mounted on a camera. The accelerometer measures the orientation of the camera with respect to gravity. Orientation measurement allows user interface information to be displayed in a “right side up” orientation on a viewfinder for any camera orientation. Alternatively, an artificial horizon indicator may be displayed in the viewfinder. The accelerometer may also measure camera movement. Camera movement information together with camera orientation can be used to determine camera usage. Additionally, camera movement information can be used to determine a minimum shutter speed for a sharp picture.
摘要翻译: 一种用于从安装在相机上的加速度计确定相机定位信息的方法和系统。 加速度计测量相机相对于重力的方向。 方向测量可使用户界面信息在取景器上以“右侧向上”方向显示,可用于任何摄像机方向。 或者,可以在取景器中显示人造水平仪指示器。 加速度计也可以测量相机运动。 摄像机运动信息以及相机方向可用于确定摄像机的使用情况。 此外,相机移动信息可用于确定锐利图像的最小快门速度。
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公开(公告)号:US20060180896A1
公开(公告)日:2006-08-17
申请号:US11058483
申请日:2005-02-15
申请人: John Martin , Timothy Brosnihan , Michael Judy , Xin Zhang
发明人: John Martin , Timothy Brosnihan , Michael Judy , Xin Zhang
CPC分类号: B60C23/0408 , B81B3/0018 , H01G5/18 , H01G5/40 , H01L2224/16145 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要: Rather than increasing the mass of the structure, the structure in a sensor system suspends its substrate from some mechanical ground. Motion of the substrate relative to the mechanical ground thus provides the movement information. To those ends, the sensor system includes a base, a substrate, and a flexible member suspended from at least a portion of the substrate. At least a portion of the flexible member is capable of moving relative to at least a portion of the substrate. In addition, the flexible member is secured to the base, thus causing the substrate to be movable relative to the base. Moreover, the mass of the substrate is greater than the mass of the flexible member. The substrate and flexible member are configured to interact to produce a motion signal identifying movement of the base.
摘要翻译: 传感器系统中的结构不是增加结构的质量,而是将其基板从某些机械接地处悬挂下来。 因此,基板相对于机械地面的运动提供运动信息。 为此,传感器系统包括基底,基底和从基底的至少一部分悬挂的柔性构件。 柔性构件的至少一部分能够相对于衬底的至少一部分移动。 此外,柔性构件被固定到基部,从而使得基板相对于基座移动。 此外,衬底的质量大于柔性构件的质量。 衬底和柔性构件被配置为相互作用以产生识别基部的移动的运动信号。
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公开(公告)号:US20050035446A1
公开(公告)日:2005-02-17
申请号:US10952424
申请日:2004-09-28
申请人: Maurice Karpman , Nicole Hablutzel , Peter Farrell , Michael Judy , Lawrence Felton , Lewis Long
发明人: Maurice Karpman , Nicole Hablutzel , Peter Farrell , Michael Judy , Lawrence Felton , Lewis Long
CPC分类号: B81B7/0048 , H01L2224/32014 , H01L2924/1461 , H01L2924/16195 , H01L2924/00
摘要: A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator. Moreover, due to the low moisture permeability of the package, further production steps can be avoided while ensuring that moisture does not adversely affect the MEMS inertial sensor within the cavity.
摘要翻译: MEMS惯性传感器固定在至少部分由低透湿成型材料形成的预成型包装中。 因此,这种运动检测器应该能够比使用陶瓷封装的那些更经济地生产。 为了达到这些目的,包装件具有从引线框架延伸以形成空腔的至少一个壁(具有低的透湿性),并且在该空腔内具有隔离器(具有顶部表面)。 MEMS惯性传感器具有悬挂在具有底表面的基底上方的可移动结构。 衬底底表面在接触区域处固定到隔离器顶表面。 在说明性实施例中,接触面积小于衬底的底表面的表面积。 因此,隔离器在底部基板表面的至少一部分和封装之间形成空间。 因此,这个空间没有隔离器。 此外,由于封装的透湿性低,可以避免进一步的生产步骤,同时确保水分不会对空腔内的MEMS惯性传感器产生不利影响。
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公开(公告)号:US08344487B2
公开(公告)日:2013-01-01
申请号:US11770369
申请日:2007-06-28
申请人: Xin Zhang , Michael Judy , Kevin H. L. Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
发明人: Xin Zhang , Michael Judy , Kevin H. L. Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
IPC分类号: H01L23/495
CPC分类号: H01L23/3107 , H01L23/3142 , H01L23/49503 , H01L23/4951 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/49171 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.
摘要翻译: 封装的微芯片具有引线框架,其中芯片直接接触引线框架的至少一个连续部分。 引线框架的一部分具有形成凹部并与模具接触的顶表面。 封装的微芯片还具有基本上封装引线框架部分顶表面的一部分的模制材料。
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公开(公告)号:US08208671B2
公开(公告)日:2012-06-26
申请号:US12355432
申请日:2009-01-16
申请人: Thomas Chen , Michael Judy
发明人: Thomas Chen , Michael Judy
CPC分类号: B81C1/00539 , B81B3/0078 , B81B2201/0257
摘要: A MEMS microphone has a backplate, a diaphragm movable relative to the backplate, and a backside cavity adjacent to the backplate or the diaphragm. The backside cavity has sidewalls with at least one rib protruding inward toward a center of the backside cavity.
摘要翻译: MEMS麦克风具有背板,相对于背板可移动的隔膜以及与背板或隔膜相邻的背侧空腔。 背侧空腔具有侧壁,至少一个肋朝着背侧空腔的中心向内突出。
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公开(公告)号:US20090230521A2
公开(公告)日:2009-09-17
申请号:US11770369
申请日:2007-06-28
申请人: Xin Zhang , Michael Judy , Kevin Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
发明人: Xin Zhang , Michael Judy , Kevin Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
IPC分类号: H01L23/495
CPC分类号: H01L23/3107 , H01L23/3142 , H01L23/49503 , H01L23/4951 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/49171 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.
摘要翻译: 封装的微芯片具有引线框架,其中芯片直接接触引线框架的至少一个连续部分。 引线框架的一部分具有形成凹部并与模具接触的顶表面。 封装的微芯片还具有基本上封装引线框架部分顶表面的一部分的模制材料。
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