公开(公告)号：US07374393B2

公开(公告)日：2008-05-20

申请号：US11398218

申请日：2006-04-05

Applicant: Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

Inventor： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

IPC: B65G61/00

CPC classification number: H01L21/67178 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68707

Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

Abstract translation: 一种使用多室处理系统或集群工具处理衬底的方法和设备，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

公开(公告)号：US20090092466A1

公开(公告)日：2009-04-09

申请号：US12257262

申请日：2008-10-23

Applicant: Robert B. Moore ,  Eric Ruhland ,  Satish Sundar ,  Mario David Silvetti

Inventor： Robert B. Moore ,  Eric Ruhland ,  Satish Sundar ,  Mario David Silvetti

IPC: H01L21/677

CPC classification number: H01L21/67742 ,  H01L21/67201 ,  Y10S414/135 ,  Y10T29/49826

Abstract: A new apparatus for processing substrates is disclosed. A multi-level load lock chamber having four environmentally isolated chambers interfaces with a transfer chamber that has a robotic assembly. The robotic assembly has two arms that each can move horizontally as the robotic assembly rotates about its axis. The arms can reach into the isolated chambers of the load lock to receive substrates from the bottom isolated chambers, transport the substrates to process chambers, and then place the substrates in the upper chambers. The isolated chambers in the load lock chamber may have a pivotably attached lid that may be opened to access the inside of the isolated chambers.

Abstract translation: 公开了一种用于处理衬底的新设备。 具有四个环境隔离室的多级装载锁定室与具有机器人组件的传送室接口。 机器人组件具有两个臂，每个臂可随着机器人组件围绕其轴旋转而水平移动。 臂可以到达负载锁的隔离室，以从底部隔离室接收衬底，将衬底输送到处理室，然后将衬底放置在上腔室中。 负载锁定室中的隔离室可以具有可枢转地连接的盖，其可以打开以进入隔离室的内部。

公开(公告)号：US07094313B2

公开(公告)日：2006-08-22

申请号：US10829520

申请日：2004-04-21

Applicant: Eller Y. Juco ,  Visweswaren Sivaramakrishnan ,  Mario David Silvetti ,  Talex Sajoto

Inventor： Eller Y. Juco ,  Visweswaren Sivaramakrishnan ,  Mario David Silvetti ,  Talex Sajoto

IPC: C23F1/02 ,  C23C14/00 ,  C23C16/00

CPC classification number: H01J37/32082 ,  C23C16/5096 ,  H01J37/32183

Abstract: A substrate processing system is provided with a processing chamber, an alternating voltage supply, and an impedance matching network. The processing chamber holds a substrate during processing and the alternating voltage supply is connected with the processing chamber to capacitively couple energy to a plasma formed within the processing chamber. The impedance matching network is coupled with the alternating voltage supply and has a variable resistive element and a variable reactive element, whose states respectively define distinct real and imaginary parts of an impedance.

Abstract translation: 衬底处理系统设置有处理室，交流电压源和阻抗匹配网络。 处理室在处理期间保持基板，并且交流电压供应与处理室连接以将能量电容耦合到处理室内形成的等离子体。 阻抗匹配网络与交流电源耦合，并具有可变电阻元件和可变无功元件，其状态分别定义阻抗的不同实部和虚部。

公开(公告)号：US20120034848A1

公开(公告)日：2012-02-09

申请号：US13204541

申请日：2011-08-05

Applicant: Hung Chih Chen ,  Mario David Silvetti ,  Yin Yuan

Inventor： Hung Chih Chen ,  Mario David Silvetti ,  Yin Yuan

IPC: B24B1/00 ,  B24B41/06

CPC classification number: B24B41/06 ,  B24B37/32 ,  B24B41/067

Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.

Abstract translation: 用于化学机械抛光机的载体头包括基底，基底安装表面，环形内环和外环。 所述内环具有被配置为接触位于所述基板安装表面上的基板的上表面的下表面，外表面和从所述下表面向下延伸的面向内的表面，并且构造成周向地围绕所述基板的边缘， 所述内环可相对于所述基板安装表面垂直移动。 外环具有周向包围内环的内表面，外表面和与抛光垫接触的下表面，并且外环可相对于基板安装表面和内环而垂直地可移动。

公开(公告)号：US20090068356A1

公开(公告)日：2009-03-12

申请号：US12255884

申请日：2008-10-22

Applicant: MARIO David SILVETTI ,  David H. Quach ,  Bok Hoen Kim ,  Thomas Nowak ,  Thomas K. Cho ,  Fred H. Hariz ,  Robert B. Moore

Inventor： MARIO David SILVETTI ,  David H. Quach ,  Bok Hoen Kim ,  Thomas Nowak ,  Thomas K. Cho ,  Fred H. Hariz ,  Robert B. Moore

IPC: C23C16/00 ,  H01L21/3065

CPC classification number: C23C16/4404 ,  C23C16/4586 ,  H01J37/32522 ,  H01J2237/022

Abstract: Embodiments of the present invention are generally directed to apparatus and methods for a plasma-processing chamber requiring less maintenance and downtime and possessing improved reliability over the prior art. In one embodiment, the apparatus includes a substrate support resting on a ceramic shaft, an inner shaft allowing for electrical connections to the substrate support at atmospheric pressure, an aluminum substrate support resting on but not fixed to a ceramic support structure, sapphire rest points swaged into the substrate support, and a heating element inside the substrate support arranged in an Archimedes spiral to reduce warping of the substrate support and to increase its lifetime. Methods include increasing time between in-situ cleans of the chamber by reducing particle generation from chamber surfaces. Reduced particle generation occurs via temperature control of chamber components and pressurization of non-processing regions of the chamber relative to the processing region with a purge gas.

Abstract translation: 本发明的实施例一般涉及等离子体处理室的装置和方法，其需要较少的维护和停机时间，并且比现有技术具有更高的可靠性。 在一个实施例中，该设备包括搁置在陶瓷轴上的基板支撑件，允许在大气压下与基板支撑件电连接的内轴，支撑在陶瓷支撑结构上但不固定到陶瓷支撑结构的铝基板支撑件，模锻的蓝宝石支架 衬底支撑件内部的加热元件和布置在阿基米德螺旋中的衬底支撑件内的加热元件，以减少衬底支撑件的翘曲并增加其寿命。 方法包括通过减少从室表面产生颗粒来增加室内原位清洗之间的时间。 通过腔室部件的温度控制和腔室相对于处理区域的吹扫气体的非处理区域的加压而发生减少的颗粒产生。

公开(公告)号：US07374391B2

公开(公告)日：2008-05-20

申请号：US11315873

申请日：2005-12-22

Applicant: Michael Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

Inventor： Michael Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

IPC: B25J15/00

CPC classification number: H01L21/67178 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68707

Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

Abstract translation: 一种使用多室处理系统或集群工具处理衬底的方法和装置，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

公开(公告)号：US07997851B2

公开(公告)日：2011-08-16

申请号：US12257262

申请日：2008-10-23

Applicant: Robert B. Moore ,  Eric Ruhland ,  Satish Sundar ,  Mario David Silvetti

Inventor： Robert B. Moore ,  Eric Ruhland ,  Satish Sundar ,  Mario David Silvetti

IPC: B21D39/03

CPC classification number: H01L21/67742 ,  H01L21/67201 ,  Y10S414/135 ,  Y10T29/49826

Abstract: A new apparatus for processing substrates is disclosed. A multi-level load lock chamber having four environmentally isolated chambers interfaces with a transfer chamber that has a robotic assembly. The robotic assembly has two arms that each can move horizontally as the robotic assembly rotates about its axis. The arms can reach into the isolated chambers of the load lock to receive substrates from the bottom isolated chambers, transport the substrates to process chambers, and then place the substrates in the upper chambers. The isolated chambers in the load lock chamber may have a pivotably attached lid that may be opened to access the inside of the isolated chambers.

Abstract translation: 公开了一种用于处理衬底的新设备。 具有四个环境隔离室的多级装载锁定室与具有机器人组件的传送室接口。 机器人组件具有两个臂，每个臂可随着机器人组件围绕其轴旋转而水平移动。 臂可以到达负载锁的隔离室，以从底部隔离室接收衬底，将衬底输送到处理室，然后将衬底放置在上腔室中。 负载锁定室中的隔离室可以具有可枢转地连接的盖，其可以打开以进入隔离室的内部。

公开(公告)号：US20100145513A1

公开(公告)日：2010-06-10

申请号：US12712091

申请日：2010-02-24

Applicant: Pyongwon Yim ,  Satish Sundar ,  Vinay Shah ,  Mario David Silvetti ,  Douglas Kitajima ,  Venkatesh Babu ,  Visweswaren Sivaramakrishnan ,  Indrajit Lahiri ,  Surinder Bedi

Inventor： Pyongwon Yim ,  Satish Sundar ,  Vinay Shah ,  Mario David Silvetti ,  Douglas Kitajima ,  Venkatesh Babu ,  Visweswaren Sivaramakrishnan ,  Indrajit Lahiri ,  Surinder Bedi

IPC: G05B15/00 ,  G06F19/00 ,  H01L21/67

CPC classification number: H01L21/67259 ,  H01L21/67766 ,  H01L21/681

Abstract: A robotic positioning system that cooperates with a sensing system to correct robot motion is provided. The sensing system is decoupled from the sensors used conventionally to control the robot's motion, thereby providing repeatable detection of the robot's true position. In one embodiment, the positioning system includes a robot, a controller, a motor sensor and a decoupled sensor. The robot has at least one motor for manipulating a linkage controlling the displacement of a substrate support coupled thereto. The motor sensor is provides the controller with motor actuation information utilized to move the substrate support. The decoupled sensor provides information indicative of the true position the substrate support that may be utilized to correct the robot's motion.

Abstract translation: 提供了与传感系统配合以校正机器人运动的机器人定位系统。 感测系统与常规用于控制机器人运动的传感器分离，从而提供机器人真实位置的可重复检测。 在一个实施例中，定位系统包括机器人，控制器，马达传感器和去耦传感器。 机器人具有至少一个用于操纵联动装置的电动机，控制联接到其上的衬底支架的位移。 马达传感器为控制器提供用于移动基板支架的马达驱动信息。 解耦传感器提供指示可用于校正机器人运动的基板支撑件的真实位置的信息。

公开(公告)号：US07695232B2

公开(公告)日：2010-04-13

申请号：US11424461

申请日：2006-06-15

Applicant: Robert B. Moore ,  Eric Ruhland ,  Satish Sundar ,  Mario David Silvetti

Inventor： Robert B. Moore ,  Eric Ruhland ,  Satish Sundar ,  Mario David Silvetti

IPC: H01L21/677

CPC classification number: H01L21/67742 ,  H01L21/67201 ,  Y10S414/135 ,  Y10T29/49826

Abstract: A new apparatus for processing substrates is disclosed. A multi-level load lock chamber having four environmentally isolated chambers interfaces with a transfer chamber that has a robotic assembly. The robotic assembly has two arms that each can move horizontally as the robotic assembly rotates about its axis. The arms can reach into the isolated chambers of the load lock to receive substrates from the bottom isolated chambers, transport the substrates to process chambers, and then place the substrates in the upper chambers. The isolated chambers in the load lock chamber may have a pivotably attached lid that may be opened to access the inside of the isolated chambers.

Abstract translation: 公开了一种用于处理衬底的新设备。 具有四个环境隔离室的多级装载锁定室与具有机器人组件的传送室接口。 机器人组件具有两个臂，每个臂可随着机器人组件围绕其轴旋转而水平移动。 臂可以到达负载锁的隔离室，以从底部隔离室接收衬底，将衬底输送到处理室，然后将衬底放置在上腔室中。 负载锁定室中的隔离室可以具有可枢转地连接的盖，其可以打开以进入隔离室的内部。

公开(公告)号：US20070292244A1

公开(公告)日：2007-12-20

申请号：US11424461

申请日：2006-06-15

Applicant: ROBERT B. MOORE ,  Eric Ruhland ,  Satish Sundar ,  Mario David Silvetti

Inventor： ROBERT B. MOORE ,  Eric Ruhland ,  Satish Sundar ,  Mario David Silvetti

IPC: H01L21/677

CPC classification number: H01L21/67742 ,  H01L21/67201 ,  Y10S414/135 ,  Y10T29/49826

Abstract: A new apparatus for processing substrates is disclosed. A multi-level load lock chamber having four environmentally isolated chambers interfaces with a transfer chamber that has a robotic assembly. The robotic assembly has two arms that each can move horizontally as the robotic assembly rotates about its axis. The arms can reach into the isolated chambers of the load lock to receive substrates from the bottom isolated chambers, transport the substrates to process chambers, and then place the substrates in the upper chambers. The isolated chambers in the load lock chamber may have a pivotably attached lid that may be opened to access the inside of the isolated chambers.

Abstract translation: 公开了一种用于处理衬底的新设备。 具有四个环境隔离室的多级装载锁定室与具有机器人组件的传送室接口。 机器人组件具有两个臂，每个臂可随着机器人组件围绕其轴旋转而水平移动。 臂可以到达负载锁的隔离室，以从底部隔离室接收衬底，将衬底输送到处理室，然后将衬底放置在上腔室中。 负载锁定室中的隔离室可以具有可枢转地连接的盖，其可以打开以进入隔离室的内部。