公开(公告)号：US4711822A

公开(公告)日：1987-12-08

申请号：US818949

申请日：1986-01-15

Applicant: Wolfgang J. Choyke ,  Susan Wood ,  Luciano C. Scala ,  Melvin P. Zussman ,  Leslie A. Doggrell ,  Janet S. Lauer

Inventor： Wolfgang J. Choyke ,  Susan Wood ,  Luciano C. Scala ,  Melvin P. Zussman ,  Leslie A. Doggrell ,  Janet S. Lauer

IPC: C23C18/22 ,  H05K1/05 ,  H05K3/18 ,  B32B15/08 ,  B05D1/18 ,  B05D5/12 ,  B32B27/00

CPC classification number: H05K3/182 ,  H05K1/056 ,  H05K2203/135 ,  Y10S428/901 ,  Y10S430/143 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: Disclosed is a method of making a printed circuit board by exposing in a circuit pattern the polymeric surface of a conductive substrate coated with a polymer selected from the group consisting of polyimides, polyamide-imides, polyester-amide-imides, polysulfones, polyphenylene sulfides, and polyphenylene oxides, to an ion beam at an energy of about 50 KeV to about 2 MeV and a fluence of about 10.sup.15 to 10.sup.18 ions/cm.sup.2. The surface is then wet blasted and the portions of the polymeric surface that have been exposed to the ion beam are electrolessly plated with a metal such as nickel or copper. Also disclosed is a coated substrate comprising a metal or conductive surface and an imide polymeric coating on the surface which can be electrophoretically deposited, a portion of which has been exposed to an ion beam.

Abstract translation: 公开了一种制造印刷电路板的方法，其以电路图案曝光涂覆有选自聚酰亚胺，聚酰胺 - 酰亚胺，聚酯 - 酰胺 - 酰亚胺，聚砜，聚苯硫醚等的聚合物的导电性基材的聚合物表面， 以及聚苯醚，以约50KeV至约2MeV的能量和约1015至1018离子/ cm 2的能量密度的离子束。 然后将表面进行湿式喷砂处理，并且已经暴露于离子束的聚合物表面的部分用诸如镍或铜的金属无电镀。 还公开了包括金属或导电表面和表面上的可以电泳沉积的一部分酰亚胺聚合物涂层的涂覆基底，其一部分暴露于离子束。

公开(公告)号：US4019877A

公开(公告)日：1977-04-26

申请号：US624352

申请日：1975-10-21

Applicant: William R. Gass ,  Luciano C. Scala ,  David C. Phillips

Inventor： William R. Gass ,  Luciano C. Scala ,  David C. Phillips

IPC: C09D5/44 ,  C25D13/20 ,  H05K3/02 ,  C25D13/06 ,  B23P3/00

CPC classification number: C25D13/20 ,  C09D5/4461 ,  H05K3/022 ,  Y10T428/12569 ,  Y10T428/1291

Abstract: A method of coating a copper substrate comprises the steps of: anodically microsmoothing the copper substrate in an acid bath to provide a substantially smooth surface; electrocoating the microsmoothed substrate with a pin hole free nickel film having a thickness of between about 2.5 microns to about 12.5 microns; single step, non-aqueous electrocoating the microsmoothed, nickel coated substrate with a pin hole free polyamic acid polymer, and curing the polyamic acid coating to form a polyimide film free of copper ion contamination.

Abstract translation: 一种涂覆铜基底的方法包括以下步骤：在酸浴中阳极微调铜基底以提供基本平滑的表面; 用具有介于约2.5微米至约12.5微米之间的厚度的无针孔镍薄膜电涂覆微孔板基底; 单步，非水电涂层微孔，镀镍基板，无针孔聚酰胺酸聚合物，并固化聚酰胺酸涂层，形成无铜离子污染的聚酰亚胺膜。

公开(公告)号：US4999136A

公开(公告)日：1991-03-12

申请号：US235089

申请日：1988-08-23

Applicant: Wei-Fang A. Su ,  Anthony P. Barrett ,  Luciano C. Scala ,  Karl F. Schoch, Jr.

Inventor： Wei-Fang A. Su ,  Anthony P. Barrett ,  Luciano C. Scala ,  Karl F. Schoch, Jr.

IPC: C08F299/02 ,  H01B1/22 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32

CPC classification number: H01B1/22 ,  C08F299/028 ,  H05K3/305 ,  H05K3/321 ,  H05K1/181 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  Y10S428/901

Abstract: A UV curable electrically conductive adhesive has been developed with low resistivity, adequate lap shear strength, good thermal stability, and very stable conductivity at high temperatures of about 100.degree. C. and high humidity. The adhesive may be applied by silk screen printing and cured by UV in about 8 seconds. The adhesive may also be used as a replacement of solder in automated surface mount technology for electronic circuit fabrication. The adhesive is a mixture of (A) a blend of an acrylate epoxy and a urethane, a copolymer of an acrylate epoxy and a urethane, or mixtures thereof; (B) a polyfunctional acrylate monomer; (C) a photoinitiator, and (D) a conductive filler. Optionally, adhesion promoters and flow control agents may be used.

Abstract translation: 紫外线固化导电粘合剂已经开发出具有低电阻率，足够的搭接剪切强度，良好的热稳定性和在约100℃和高湿度的高温下非常稳定的导电性。 粘合剂可以通过丝网印刷施加，并通过UV固化约8秒。 粘合剂也可用作替代用于电子电路制造的自动表面贴装技术中的焊料。 粘合剂是（A）丙烯酸酯环氧树脂和氨基甲酸酯的共混物，丙烯酸酯环氧树脂和氨基甲酸酯的共聚物或其混合物的混合物; （B）多官能丙烯酸酯单体; （C）光引发剂，（D）导电填料。 任选地，可以使用粘合促进剂和流动控制剂。

公开(公告)号：US4664768A

公开(公告)日：1987-05-12

申请号：US717046

申请日：1985-03-28

Applicant: Luciano C. Scala ,  Timothy J. Fuller ,  William M. Alvino

Inventor： Luciano C. Scala ,  Timothy J. Fuller ,  William M. Alvino

IPC: B32B5/28 ,  C09D5/44 ,  C25D13/12 ,  C25D13/06

CPC classification number: C09D5/44 ,  B32B5/28 ,  C25D13/12 ,  Y10T428/30 ,  Y10T442/2951 ,  Y10T442/2984 ,  Y10T442/3512

Abstract: Disclosed is a method of making a laminate by electrophoretically coating a flat mat made from a material selected from graphite, carbon, and mixtures thereof with an electrophoretable polymer in a non-aqueous system. The polymer is cured and the mat is impregnated with a thermosetable impregnating resin. The impregnating resin is B-staged to form a prepreg and several prepregs are stacked and cured under heat and pressure to form the laminate. Also disclosed is a laminate made by this method.

Abstract translation: 公开了一种通过在非水系统中电泳涂覆由选自石墨，碳及其与电泳聚合物的混合物的材料制成的平垫而制备层压体的方法。 聚合物固化，并且用可热固性浸渍树脂浸渍垫。 浸渍树脂B阶分级以形成预浸料坯，并且在加热和加压下堆叠并固化数个预浸料以形成层压体。 还公开了通过该方法制成的层压体。

公开(公告)号：US4046592A

公开(公告)日：1977-09-06

申请号：US648431

申请日：1976-01-12

Applicant: Dean C. Westervelt ,  Luciano C. Scala ,  Howard E. Saunders ,  David F. Ciliberti

Inventor： Dean C. Westervelt ,  Luciano C. Scala ,  Howard E. Saunders ,  David F. Ciliberti

IPC: C25F1/04 ,  C25F7/00 ,  H01B13/00 ,  B08B3/10 ,  B08B3/12 ,  C25F1/00

CPC classification number: H01B13/00 ,  C25F1/04

Abstract: Wire is cleaned by passing it through an electrolytic cleaner then through an ultrasonic rinse. The electrolytic cleaner comprises a graphite tube through which the wire passes, an alkaline aqueous solution between the wire and the graphite tube, and an electric current, at least half D.C., between the wire and the graphite tube.

公开(公告)号：US3953241A

公开(公告)日：1976-04-27

申请号：US345157

申请日：1973-03-26

Applicant: Alois Langer ,  Luciano C. Scala ,  Charles R. Ruffing

Inventor： Alois Langer ,  Luciano C. Scala ,  Charles R. Ruffing

IPC: H01M2/16 ,  H01M2/14

CPC classification number: H01M2/1653

Abstract: A flexible substrate having a caustic resistant support and at least one membrane comprising a solid polymeric matrix containing a network of interconnected pores and interdispersed inorganic filler particles with a ratio of filler: polymer in the polymeric matrix of between about 1:1 to 5:1, is made by coating at least one side of the support with a filler:coating formulation mixture of inorganic filler particles and a caustic resistant, water insoluble polymer dissolved in an organic solvent, and removing the solvent from the mixture to provide a porous network within the polymeric matrix.

Abstract translation: 一种具有耐腐蚀载体的柔性基底和至少一个包含固体聚合物基质的膜，该固体聚合物基质含有相互连通的孔网络和分散在一起的无机填料颗粒，聚合物基质中填料：聚合物的比例为约1:1至5:1 通过用填料：无机填料颗粒的涂料配方混合物和溶解在有机溶剂中的耐苛性，水不溶性聚合物的混合物涂覆载体的至少一面，并从混合物中除去溶剂以提供多孔网络 聚合物基质。

公开(公告)号：US4844947A

公开(公告)日：1989-07-04

申请号：US193137

申请日：1988-05-05

Applicant: William H. Kasner ,  Roger L. Swensrud ,  Daniel P. Soroka ,  Wei-Fang A. Su ,  Steve A. Wutzke ,  Vincent A. Toth ,  Luciano C. Scala

Inventor： William H. Kasner ,  Roger L. Swensrud ,  Daniel P. Soroka ,  Wei-Fang A. Su ,  Steve A. Wutzke ,  Vincent A. Toth ,  Luciano C. Scala

IPC: B05D7/14 ,  B05C9/12 ,  B05D1/32 ,  B05D3/06 ,  B05D3/10 ,  B05D5/06 ,  G03F7/00 ,  G03F7/20

CPC classification number: G03F7/2045 ,  B05D5/06 ,  G03F7/00 ,  B05D1/32 ,  B05D3/067

Abstract: A system which utilizes a source of ultraviolet radiation to mark a surface or to cure selectively a photosensitive paint applied to a surface. The source of UV light is either a laser or a broadband source and the light is controlled by an aperture and/or a stencil apparatus. The photosensitive paint is applied by a controlled technique as a protective or a decorative coating.

Abstract translation: 使用紫外线辐射源来标记表面或选择性地固化施加到表面的感光漆的系统。 紫外线的来源是激光或宽带光源，光由孔和/或模版装置控制。 感光漆通过受控技术作为保护性或装饰性涂层施加。

公开(公告)号：US4642170A

公开(公告)日：1987-02-10

申请号：US765464

申请日：1985-08-14

Applicant: William M. Alvino ,  Timothy J. Fuller ,  Louis A. Cargnel ,  Luciano C. Scala

Inventor： William M. Alvino ,  Timothy J. Fuller ,  Louis A. Cargnel ,  Luciano C. Scala

IPC: C09D5/44 ,  C25D13/06

CPC classification number: C09D5/4419

Abstract: Disclosed is a method of electrophoretically depositing a coating of polysulfones or polyethersulfones on a conductive substrate. An amine-free solution is formed in an organic solvent of the polysulfones or polyethersulfones. An emulsion is formed by combining the solution with an organic non-solvent for the polymer which contains up to about 0.6 parts by weight of an organic nitrogen containing base per parts by weight of the polymer. A direct current is applied between a conductive substrate and the emulsion which results in the deposition of the polymer on the substrate.

Abstract translation: 公开了一种在导电基底上电泳沉积聚砜或聚醚砜的涂层的方法。 在聚砜或聚醚砜的有机溶剂中形成无胺溶液。 通过将该溶液与聚合物的有机非溶剂组合形成乳液，该聚合物含有至多约0.6重量份的基于每重量份聚合物的有机氮的碱。 在导电基底和乳液之间施加直流电导致聚合物沉积在基底上。

公开(公告)号：US4533448A

公开(公告)日：1985-08-06

申请号：US350499

申请日：1982-02-19

Applicant: Luciano C. Scala ,  William M. Alvino ,  Timothy J. Fuller

Inventor： Luciano C. Scala ,  William M. Alvino ,  Timothy J. Fuller

IPC: C08J3/09 ,  C08L79/08 ,  C09D5/44 ,  C08K5/07

CPC classification number: C08J3/091 ,  C08L79/08 ,  C09D5/4419 ,  C08J2377/00 ,  Y10S524/901

Abstract: Disclosed is an electrodepositable emulsion which comprises a soluble un-ionized polymer containing an amic acid or amide linking group, a non-electrolyzable organic solvent for the polymer and a non-electrolyzable organic non-solvent for the polymer. The weight ratio of the solvent to the non-solvent is about 0.1 to about 0.5 and the polymer is about 0.4 to about 5% by weight of the weight of the solvent. No amine or surface active agent is used. A workpiece is coated with the polymer by placing it into the emulsion about one-half to about two inches away from the cathode. Constant dc voltage is applied between the cathode and the workpiece until a coating of a desired thickness has been deposited on the workpiece. The workpiece is then removed, dried, and cured.

Abstract translation: 公开了一种电沉积乳液，其包含含有酰胺酸或酰胺连接基团的可溶性非离子化聚合物，用于聚合物的不可电解的有机溶剂和用于聚合物的不可电解的有机非溶剂。 溶剂与非溶剂的重量比为约0.1至约0.5，聚合物为溶剂重量的约0.4至约5重量％。 不使用胺或表面活性剂。 将工件通过将聚合物放置在离阴极约一至二英寸的乳液中来涂覆聚合物。 在阴极和工件之间施加恒定的直流电压，直到所需厚度的涂层沉积在工件上。 然后将工件取出，干燥并固化。

公开(公告)号：US4391933A

公开(公告)日：1983-07-05

申请号：US219101

申请日：1980-12-22

Applicant: Luciano C. Scala ,  Louis A. Cargnel

Inventor： Luciano C. Scala ,  Louis A. Cargnel

IPC: C08J3/07 ,  C09D5/44 ,  C08K5/07

CPC classification number: C08J3/07 ,  C09D5/443 ,  C08J2363/00 ,  Y10S524/901

Abstract: An emulsion is prepared which comprises about 8 to about 20 percent of a solvent, about 0.5 to 5 percent of an epoxy resin dissolved in the solvent to form a discontinuous phase, about 75 to about 90 percent of a precipitant as the continuous phase, and an emulsifier in an amount sufficient to react stoichiometrically with the epoxy and hydroxyl groups on the epoxy resin up to about 900% in excess of stoichiometric. A conductive workpiece is placed in the emulsion about 1/2 to about 2 inches from an electrode which is also immersed in the emulsion. A direct electric current potential is applied between the workpiece and the electrode with the workpiece as the anode. About 50 to about 400 volts and about 2 to about 50 milliamperes are used until a coating of the desired thickness has been deposited on the workpiece. The solvent and precipitant are preferably ketones such as cyclohexanone, and methylethylketone or isobutylketone, respectively. The epoxy resin is preferably a bisphenol A epoxy resin having an average molecular weight of about 2000 to about 15,000. The emulsifier is preferably an amine.

Abstract translation: 制备了一种乳液，其包含约8至约20％的溶剂，约0.5至5％的环氧树脂溶解在溶剂中以形成不连续相，约75％至约90％的沉淀剂作为连续相，以及 一种乳化剂，其量足以与环氧树脂上的环氧树脂和羟基反应而化学计量比高达约900％超过化学计量。 将导电工件放置在离浸入乳液中的电极约1/2至约2英寸的乳液中。 以工件为阳极，在工件和电极之间施加直流电势。 使用约50至约400伏和约2至约50毫安，直到所需厚度的涂层沉积在工件上。 溶剂和沉淀剂分别优选为酮，如环己酮，甲基乙基酮或异丁基酮。 环氧树脂优选为平均分子量为约2000〜约15,000的双酚A型环氧树脂。 乳化剂优选为胺。