公开(公告)号：US20070069161A1

公开(公告)日：2007-03-29

申请号：US11521074

申请日：2006-09-14

申请人： David Camm ,  Sergiy Dets ,  Kevin McDonnell ,  Greg Stuart ,  Tilman Thrum ,  Igor Rudic ,  Ljubomir Kaludjercic

发明人： David Camm ,  Sergiy Dets ,  Kevin McDonnell ,  Greg Stuart ,  Tilman Thrum ,  Igor Rudic ,  Ljubomir Kaludjercic

IPC分类号： G01J3/10

CPC分类号： F27B17/0025 ,  H01L21/67115 ,  H01L21/67248 ,  H01L22/20

摘要： A first heat-treating method involves monitoring at least one thermal efficiency parameter associated with an irradiance system configured to produce an irradiance flash incident on a surface of a workpiece, and automatically updating control information used by the irradiance system to produce the irradiance flash, in response to the monitoring of the thermal efficiency parameter. A second method involves predicting a heating effect of an irradiance flash to be incident upon a surface of a workpiece, in response to a measurement of a heating parameter of the surface, and pre-adjusting the irradiance flash, in response to the predicted heating effect. A third method involves measuring a temperature of a surface of a workpiece during an initial portion of an irradiance flash incident on the surface, and controlling a power of a remaining portion of the irradiance flash, in response to the temperature.

摘要翻译： 第一热处理方法包括监测与被配置为产生入射在工件表面上的辐照闪光相关联的辐射系统的至少一个热效率参数，并且自动更新由辐照系统使用的控制信息以产生辐照闪光， 响应于热效率参数的监测。 第二种方法包括响应于表面的加热参数的测量以及响应于预测的加热效应来预先调节辐照度闪光来预测辐射闪光的加热效应入射到工件的表面上 。 第三种方法包括测量在入射到表面上的辐照闪光的初始部分期间工件表面的温度，以及响应于温度来控制辐照闪光的剩余部分的功率。

公开(公告)号：US09482468B2

公开(公告)日：2016-11-01

申请号：US11521074

申请日：2006-09-14

申请人： David Malcolm Camm ,  Sergiy Dets ,  Kevin McDonnell ,  Greg Stuart ,  Tilman Thrum ,  Igor Rudic ,  Ljubomir Kaludjercic

发明人： David Malcolm Camm ,  Sergiy Dets ,  Kevin McDonnell ,  Greg Stuart ,  Tilman Thrum ,  Igor Rudic ,  Ljubomir Kaludjercic

IPC分类号： G01J5/00 ,  G01J5/58 ,  F27B17/00 ,  H01L21/67 ,  H01L21/66

CPC分类号： F27B17/0025 ,  H01L21/67115 ,  H01L21/67248 ,  H01L22/20

摘要： A first heat-treating method involves monitoring at least one thermal efficiency parameter associated with an irradiance system configured to produce an irradiance flash incident on a surface of a workpiece, and automatically updating control information used by the irradiance system to produce the irradiance flash, in response to the monitoring of the thermal efficiency parameter. A second method involves predicting a heating effect of an irradiance flash to be incident upon a surface of a workpiece, in response to a measurement of a heating parameter of the surface, and pre-adjusting the irradiance flash, in response to the predicted heating effect. A third method involves measuring a temperature of a surface of a workpiece during an initial portion of an irradiance flash incident on the surface, and controlling a power of a remaining portion of the irradiance flash, in response to the temperature.

摘要翻译： 第一热处理方法包括监测与被配置为产生入射在工件表面上的辐照闪光相关联的辐射系统的至少一个热效率参数，并且自动更新由辐照系统使用的控制信息以产生辐照闪光， 响应于热效率参数的监测。 第二种方法包括响应于表面的加热参数的测量以及响应于预测的加热效应来预先调节辐照度闪光来预测辐射闪光的加热效应入射到工件的表面上 。 第三种方法包括测量在入射到表面上的辐照闪光的初始部分期间工件表面的温度，以及响应于温度来控制辐照闪光的剩余部分的功率。

公开(公告)号：US09627244B2

公开(公告)日：2017-04-18

申请号：US10742575

申请日：2003-12-19

申请人： David Malcolm Camm ,  Guillaume Sempere ,  Ljubomir Kaludjercic ,  Gregory Stuart ,  Mladen Bumbulovic ,  Tim Tran ,  Sergiy Dets ,  Tony Komasa ,  Marc Rudolph ,  Joseph Cibere

发明人： David Malcolm Camm ,  Guillaume Sempere ,  Ljubomir Kaludjercic ,  Gregory Stuart ,  Mladen Bumbulovic ,  Tim Tran ,  Sergiy Dets ,  Tony Komasa ,  Marc Rudolph ,  Joseph Cibere

IPC分类号： H01L21/687

CPC分类号： H01L21/68728 ,  H01L21/68721 ,  H01L21/68757

摘要： Apparatuses and methods for supporting a workpiece such as a semiconductor wafer. A support system is configured to support the workpiece while allowing thermally-induced motion of the workpiece, which may include thermal bowing or thermal bending. The system may include a support member having a moveable engagement portion engageable with the workpiece, the engagement portion being moveable to allow the thermally-induced motion of the workpiece while supporting the workpiece. The moveable engagement portion may include a plurality of moveable engagement portions of a plurality of respective support members, which may be resiliently engageable with the workpiece. The support members may include flexible support members each having an unconstrained portion and a constrained portion, and the moveable engagement portions may include the unconstrained portions. Alternatively, the support members may be rigid and the system may include a plurality of force applicators such as springs in communication with the support members.

公开(公告)号：US08434341B2

公开(公告)日：2013-05-07

申请号：US13359857

申请日：2012-01-27

申请人： David Malcolm Camm ,  Guillaume Sempere ,  Ljubomir Kaludjercic ,  Gregory Stuart ,  Mladen Bumbulovic ,  Tim Tran ,  Sergiy Dets ,  Tony Komasa ,  Marc Rudolph ,  Joseph Cibere

发明人： David Malcolm Camm ,  Guillaume Sempere ,  Ljubomir Kaludjercic ,  Gregory Stuart ,  Mladen Bumbulovic ,  Tim Tran ,  Sergiy Dets ,  Tony Komasa ,  Marc Rudolph ,  Joseph Cibere

IPC分类号： B21D37/16 ,  B23H11/00

CPC分类号： H01L21/68728 ,  H01L21/68721 ,  H01L21/68757

摘要： An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.

摘要翻译： 用于支撑半导体工件的装置包括加热系统，该加热系统构造成通过相对于工件的大部分加热工件的表面来引起半导体工件的热感应运动。 热诱导运动包括工件的外边缘区域和工件相对于彼此的中心的垂直运动。 该装置还包括支撑系统，该支撑系统构造成允许包括工件的外边缘区域的垂直运动和工件中心相对于彼此同时支撑工件的热感应运动。

公开(公告)号：US20120118867A1

公开(公告)日：2012-05-17

申请号：US13359857

申请日：2012-01-27

申请人： David Malcolm Camm ,  Guillaume Sempere ,  Ljubomir Kaludjercic ,  Gregory Stuart ,  Mladen Bumbulovic ,  Tim Tran ,  Sergiy Dets ,  Tony Komasa ,  Marc Rudolph ,  Joseph Cibere

发明人： David Malcolm Camm ,  Guillaume Sempere ,  Ljubomir Kaludjercic ,  Gregory Stuart ,  Mladen Bumbulovic ,  Tim Tran ,  Sergiy Dets ,  Tony Komasa ,  Marc Rudolph ,  Joseph Cibere

IPC分类号： H05B3/00

CPC分类号： H01L21/68728 ,  H01L21/68721 ,  H01L21/68757

摘要： An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.

摘要翻译： 用于支撑半导体工件的装置包括加热系统，该加热系统构造成通过相对于工件的大部分加热工件的表面来引起半导体工件的热感应运动。 热诱导运动包括工件的外边缘区域和工件相对于彼此的中心的垂直运动。 该装置还包括支撑系统，该支撑系统构造成允许包括工件的外边缘区域的垂直运动和工件中心相对于彼此同时支撑工件的热感应运动。