公开(公告)号：US20130241041A1

公开(公告)日：2013-09-19

申请号：US13421570

申请日：2012-03-15

申请人： Lin-Wang Yu ,  Ping-Cheng Hu ,  Che-Chin Chang ,  Yu-Fang Tsai

发明人： Lin-Wang Yu ,  Ping-Cheng Hu ,  Che-Chin Chang ,  Yu-Fang Tsai

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L24/97 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49579 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/78251 ,  H01L2224/83447 ,  H01L2224/8346 ,  H01L2224/8385 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/85805 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/45099

摘要： A semiconductor package with a die pad, a die disposed on the die pad, and a first lead disposed about the die pad. The first lead includes a contact element, an extension element extending substantially in the direction of the die pad, and a concave surface disposed between the contact element and the extension element. A second lead having a concave surface is also disposed about the die pad. The first lead concave surface is opposite in direction to the second lead concave surface.

摘要翻译： 具有管芯焊盘的半导体封装，设置在管芯焊盘上的管芯和围绕管芯焊盘设置的第一引线。 第一引线包括接触元件，基本上沿芯片焊盘的方向延伸的延伸元件，以及设置在接触元件和延伸元件之间的凹表面。 具有凹面的第二引线也围绕芯片焊盘设置。 第一引线凹面与第二引线凹面的方向相反。

公开(公告)号：US20100133675A1

公开(公告)日：2010-06-03

申请号：US12565501

申请日：2009-09-23

申请人： Lin Wang Yu ,  Cheng Yi Weng

发明人： Lin Wang Yu ,  Cheng Yi Weng

IPC分类号： H01L23/52 ,  H01L21/50 ,  H01L23/48

CPC分类号： H01L23/49833 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a substrate, a chip, an interposer and a molding compound. The chip is electrically connected to the upper surface of the substrate. The interposer is disposed on the chip, and electrically connected to the upper surface of the substrate. The interposer includes an embedded component and a plurality of electric contacts, wherein the embedded component is located between the upper and lower surfaces of the interposer, and the electric contacts are located on the upper surface of the interposer. The molding compound seals the chip and covers the upper surface of the substrate and the lower surface of the interposer.

摘要翻译： 半导体封装包括基板，芯片，插入件和模塑料。 芯片电连接到基板的上表面。 插入器设置在芯片上，并且电连接到基板的上表面。 插入器包括嵌入式部件和多个电触点，其中嵌入部件位于插入件的上表面和下表面之间，并且电触点位于插入器的上表面上。 模塑料密封芯片并覆盖基板的上表面和插入件的下表面。

公开(公告)号：US08674487B2

公开(公告)日：2014-03-18

申请号：US13421570

申请日：2012-03-15

申请人： Lin-Wang Yu ,  Ping-Cheng Hu ,  Che-Chin Chang ,  Yu-Fang Tsai

发明人： Lin-Wang Yu ,  Ping-Cheng Hu ,  Che-Chin Chang ,  Yu-Fang Tsai

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49579 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/78251 ,  H01L2224/83447 ,  H01L2224/8346 ,  H01L2224/8385 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/85805 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/45099

摘要： A semiconductor package with a die pad, a die disposed on the die pad, and a first lead disposed about the die pad. The first lead includes a contact element, an extension element extending substantially in the direction of the die pad, and a concave surface disposed between the contact element and the extension element. A second lead having a concave surface is also disposed about the die pad. The first lead concave surface is opposite in direction to the second lead concave surface.

摘要翻译： 具有管芯焊盘的半导体封装，设置在管芯焊盘上的管芯和围绕管芯焊盘设置的第一引线。 第一引线包括接触元件，基本上沿芯片焊盘的方向延伸的延伸元件，以及设置在接触元件和延伸元件之间的凹表面。 具有凹面的第二引线也围绕芯片焊盘设置。 第一引线凹面与第二引线凹面的方向相反。

公开(公告)号：US20100237490A1

公开(公告)日：2010-09-23

申请号：US12561627

申请日：2009-09-17

申请人： Chi-Chih CHU ,  Lin-Wang YU

发明人： Chi-Chih CHU ,  Lin-Wang YU

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/49833 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/4985 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package structure and a manufacturing method thereof are provided. The package structure includes a packaging substrate, a chip, an interposer substrate, a wire and an adhesive layer. The packaging substrate has an upper packaging surface. The chip is disposed on the upper packaging surface. The wire connects the packaging substrate and the interposer substrate. The adhesive layer is disposed between the packaging substrate and the interposer substrate, and covers the entire chip and part of the upper packaging surface. The adhesive layer includes a first adhesive part and a second adhesive part. The first adhesive part adheres the interposer substrate and the chip. The second adhesive part surrounds the first adhesive part, adheres the interposer substrate and the packaging substrate, and supports a periphery of the interposer substrate.

摘要翻译： 提供一种封装结构及其制造方法。 封装结构包括封装衬底，芯片，插入器衬底，线和粘合剂层。 包装基材具有上包装表面。 芯片设置在上部包装表面上。 导线连接包装基板和插入器基板。 粘合剂层设置在包装基板和插入件基板之间，并且覆盖整个芯片和上部封装表面的一部分。 粘合层包括第一粘合部分和第二粘合部分。 第一粘合部分粘附插入物基片和芯片。 第二粘合剂部分围绕第一粘合剂部分，粘合内插基片和封装基片，并且支撑插入物基片的周边。

公开(公告)号：US07838334B2

公开(公告)日：2010-11-23

申请号：US12565501

申请日：2009-09-23

申请人： Lin Wang Yu ,  Cheng Yi Weng

发明人： Lin Wang Yu ,  Cheng Yi Weng

IPC分类号： H01L21/00

CPC分类号： H01L23/49833 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a substrate, a chip, an interposer and a molding compound. The chip is electrically connected to the upper surface of the substrate. The interposer is disposed on the chip, and electrically connected to the upper surface of the substrate. The interposer includes an embedded component and a plurality of electric contacts, wherein the embedded component is located between the upper and lower surfaces of the interposer, and the electric contacts are located on the upper surface of the interposer. The molding compound seals the chip and covers the upper surface of the substrate and the lower surface of the interposer.

摘要翻译： 半导体封装包括基板，芯片，插入件和模塑料。 芯片电连接到基板的上表面。 插入器设置在芯片上，并且电连接到基板的上表面。 插入器包括嵌入式部件和多个电触点，其中嵌入部件位于插入件的上表面和下表面之间，并且电触点位于插入器的上表面上。 模塑料密封芯片并覆盖基板的上表面和插入件的下表面。