公开(公告)号：US10258164B2

公开(公告)日：2019-04-16

申请号：US14939429

申请日：2015-11-12

Applicant: Lei Shi

Inventor： Lei Shi

IPC: A47C27/00 ,  A47C27/15 ,  A47C27/06 ,  A47C27/14 ,  A47C27/22

Abstract: A mattress core with replaceable inner blocks includes a base, an open slot A located in the upper portion of the base, an open slot B located in the lower portion of the base, an inner block located within slot B and shaped to partially fill up slot B with the remaining space forming a groove in slot B, a strip-shaped inner block made of soft material and fit into the groove, and a cover plate configured to fit in said slot A.

公开(公告)号：US09595490B2

公开(公告)日：2017-03-14

申请号：US13984876

申请日：2012-03-22

Applicant: Yujuan Tao ,  Lei Shi

Inventor： Yujuan Tao ,  Lei Shi

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L21/50

CPC classification number: H01L23/49816 ,  H01L21/50 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: A 3D system-level packaging method includes providing a packaging substrate having a first functional surface and a second surface with wiring arrangement within the packaging substrate and between the first functional surface and the second surface. The method also includes forming at least one flip package layer on the first functional surface of the packaging substrate and forming at least one wiring and package layer on the flip package layer. The flip package layer is formed by subsequently forming a flip mounting layer, an underfill, a sealant layer, and a wiring layer; and the wiring and package layer is formed by subsequently forming a straight mounting layer, a sealant layer, and a wiring layer. Further, the method includes planting connection balls on the second functional surface of the packaging substrate.

Abstract translation: 3D系统级封装方法包括提供具有第一功能表面和第二表面的封装衬底，布线布置在封装衬底内以及第一功能表面和第二表面之间。 该方法还包括在封装衬底的第一功能表面上形成至少一个翻转封装层，并在翻转封装层上形成至少一个布线和封装层。 通过随后形成翻转安装层，底部填充剂，密封剂层和布线层来形成翻转封装层; 并且通过随后形成直的安装层，密封剂层和布线层来形成布线和封装层。 此外，该方法包括在包装衬底的第二功能表面上种植连接球。

公开(公告)号：US20170007047A1

公开(公告)日：2017-01-12

申请号：US14939528

申请日：2015-11-12

Applicant: Lei Shi

Inventor： Lei Shi

IPC: A47G9/02

CPC classification number: A47G9/0238 ,  A47C31/105 ,  A47G9/0246

Abstract: A mattress cover with storage pocket includes a mattress cover, which includes a top cover and a surrounding side cover. The top side of the surrounding side cover is connected with the top cover. A storage pocket is located on the side of the surrounding side cover. There could be more than one storage pockets with different sizes in this design. The storage pocket further includes an opening. The opening could be on either side of said surrounding side cover. By adding storage pockets with different sizes at the side of mattress cover, it provides more options and more spaces for storage before bed time. The storage pockets located at the outside of the surrounding side cover could to store items such as books or cell phones. The storage pockets located at the inside of the surrounding side cover could be used to conceal valuable personal belongings.

Abstract translation: 具有存储口袋的床垫盖包括一个床垫盖，其包括顶盖和周围的侧盖。 周围侧盖的顶部与顶盖连接。 储物袋位于周围侧盖的一侧。 在这个设计中，可以有多个不同尺寸的储物袋。 存储口袋还包括开口。 开口可以在所述周围侧盖的两侧。 通过在床垫侧面添加不同尺寸的储物袋，它可以提供更多的选择和更多的空间，以便在睡觉前储存。 位于周围侧盖外侧的储物袋可以储存诸如书籍或手机的物品。 位于周围侧盖内侧的储物袋可用于隐藏有价值的个人物品。

公开(公告)号：US20170007035A1

公开(公告)日：2017-01-12

申请号：US14939429

申请日：2015-11-12

Applicant: Lei Shi

Inventor： Lei Shi

IPC: A47C27/00 ,  A47C27/14 ,  A47C27/06

CPC classification number: A47C27/001 ,  A47C27/06 ,  A47C27/22

Abstract: A mattress core with replaceable inner blocks includes a base, an open slot A located in the upper portion of the base, an open slot B located in the lower portion of the base, an inner block located within slot B and shaped to partially fill up slot B with the remaining space forming a groove in slot B, a strip-shaped inner block made of soft material and fit into the groove, and a cover plate configured to fit in said slot A.

Abstract translation: 具有可更换的内部块的床垫芯包括基座，位于基座上部的开口槽A，位于基座下部的开口槽B，位于槽B内并成形为部分填充的内部块 槽B具有在槽B中形成凹槽的剩余空间，由软质材料制成并装配到槽中的条形内部块，以及构造成装配在所述槽A中的盖板。

公开(公告)号：US09391005B2

公开(公告)日：2016-07-12

申请号：US14033140

申请日：2013-09-20

Applicant: Yan Xun Xue ,  Yueh-Se Ho ,  Hamza Yilmaz ,  Jun Lu ,  Lei Shi ,  Liang Zhao ,  Ping Huang

Inventor： Yan Xun Xue ,  Yueh-Se Ho ,  Hamza Yilmaz ,  Jun Lu ,  Lei Shi ,  Liang Zhao ,  Ping Huang

IPC: H01L23/495

CPC classification number: H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/16245 ,  H01L2924/13091 ,  H01L2924/00

Abstract: A power semiconductor package has an ultra thin chip with front side molding to reduce substrate resistance; a lead frame unit with grooves located on both side leads provides precise positioning for connecting numerous bridge-shaped metal clips to the front side of the side leads. The bridge-shaped metal clips are provided with bridge structure and half or fully etched through holes for relieving superfluous solder during manufacturing process.

Abstract translation: 功率半导体封装具有超薄芯片，具有正面成型以降低基板电阻; 具有位于两侧引线上的凹槽的引线框单元提供精确的定位，用于将多个桥形金属夹连接到侧引线的前侧。 桥形金属夹具有桥结构和半或完全蚀刻的通孔，用于在制造过程中缓解多余的焊料。

公开(公告)号：US09324583B2

公开(公告)日：2016-04-26

申请号：US13981116

申请日：2012-01-20

Applicant: Lei Shi ,  Yujuan Tao ,  Guohua Gao ,  Jaingen Shi ,  Haiqing Zhu

Inventor： Lei Shi ,  Yujuan Tao ,  Guohua Gao ,  Jaingen Shi ,  Haiqing Zhu

IPC: H01L21/52 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L21/52 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention relates to a packaging method including the steps: a cementing layer is formed on a carrier board; the functional sides of chips and passive devices are attached to the cementing layer; a sealing material layer is formed on the side of the carrier board to which the chips and the passive devices are attached, and packaging and curing are performed; and the carrier board and the cementing layer are removed. Compared to the prior art, the system-level fan-out wafer packaging method claimed by the present invention first integrates chips and passive devices and then packages the chips and the passive devices together, thereby forming a final packaged product having not single-chip functionality but integrated-system functionality. Compared to current system-level packaging, highly integrated wafer-level packaging reduces such interfering factors as system-internal electric resistance and inductance, and accommodates the growing demand for lighter, thinner, shorter, and smaller semiconductor packaging.

Abstract translation: 本发明涉及一种包装方法，包括以下步骤：在承载板上形成固着层; 芯片和无源器件的功能侧连接到固井层; 密封材料层形成在载体板的与芯片和无源器件相连接的一侧上，进行包装和固化; 移除载体板和固井层。 与现有技术相比，本发明要求保护的系统级扇出晶片封装方法首先集成芯片和无源器件，然后将芯片和无源器件封装在一起，从而形成最终的封装产品，而不具有单芯片功能 但集成系统功能。 与目前的系统级封装相比，高度集成的晶圆级封装减少了系统内部电阻和电感等干扰因素，满足了对更轻，更薄，更短，更短和更小的半导体封装的不断增长的需求。

公开(公告)号：US09280020B2

公开(公告)日：2016-03-08

申请号：US12802943

申请日：2010-06-17

Applicant: Philip Bos ,  Douglas Bryant ,  Lei Shi ,  Bentley Wall

Inventor： Philip Bos ,  Douglas Bryant ,  Lei Shi ,  Bentley Wall

IPC: G02F1/1343 ,  G02F1/1345 ,  G02F1/29 ,  G02B3/14

CPC classification number: G02F1/134309 ,  G02B3/14 ,  G02F1/1345 ,  G02F1/29 ,  G02F2001/294

Abstract: Electro-optic lenses, including liquid crystals, wherein the power of the lenses can be modified by application of an electric field. In one embodiment, the liquid crystal-based lenses include ring electrodes having a resistive bridge located between adjacent electrodes, and in a preferred embodiment, input connections for several electrode rings are spaced on the lens. In a further embodiment, liquid crystal-based lenses are provided that can increase optical power through the use of phase resets, wherein in one embodiment, a lens includes ring electrodes on surfaces of the substrates on opposite sides of the liquid crystal cell such that a fixed phase term can be added to each set of electrodes that allows for phase change across each group of electrodes to be the same and also be matched with respect to a previous group.

Abstract translation: 包括液晶的电光透镜，其中可以通过施加电场来改变透镜的功率。 在一个实施例中，基于液晶的透镜包括具有位于相邻电极之间的电阻桥的环形电极，并且在优选实施例中，多个电极环的输入连接在透镜上间隔开。 在另一个实施例中，提供了通过使用相位复位来增加光功率的液晶型透镜，其中在一个实施例中，透镜在液晶单元的相对侧上包括在基板的表面上的环形电极，使得 可以将固定相位项添加到允许每组电极之间的相位变化相同并且也相对于先前组匹配的每组电极。

公开(公告)号：US09196969B2

公开(公告)日：2015-11-24

申请号：US13419140

申请日：2012-03-13

Applicant: Zhonglin Wu ,  Lei Shi ,  Gang Cheng ,  Mulin Liu ,  Zhuofeng Gao

Inventor： Zhonglin Wu ,  Lei Shi ,  Gang Cheng ,  Mulin Liu ,  Zhuofeng Gao

IPC: H01Q21/26 ,  H01Q19/10 ,  H01Q1/24 ,  H01Q9/28

CPC classification number: H01Q21/26 ,  H01Q1/246 ,  H01Q9/285 ,  H01Q19/10

Abstract: A radiating element includes a supporting element and a plurality of radiating units formed at one end of the supporting element. Each of the radiating units has a lower surface facing towards the supporting element and an upper surface facing away from the supporting element. The radiating element further includes a first and second dividing pieces symmetrically disposed on each of the radiating units. The radiating element also includes a loading element formed on the lower surface of each of the plurality of radiating units, wherein the loading element extends outward from the supporting element and along an edge of the radiating unit. Moreover, the radiating element includes an electrical connecting element for connecting the radiating units to a feeding cable, the electrical connecting element being lower than the upper surfaces of the radiating units.

Abstract translation: 辐射元件包括支撑元件和形成在支撑元件的一端的多个辐射单元。 每个辐射单元具有面向支撑元件的下表面和背离支撑元件的上表面。 辐射元件还包括对称地设置在每个辐射单元上的第一和第二分割片。 辐射元件还包括形成在多个辐射单元中的每一个的下表面上的加载元件，其中加载元件从支撑元件向外延伸并沿着辐射单元的边缘延伸。 此外，辐射元件包括用于将辐射单元连接到馈电电缆的电连接元件，电连接元件低于辐射单元的上表面。

公开(公告)号：US09087117B2

公开(公告)日：2015-07-21

申请号：US12917469

申请日：2010-11-01

Applicant: Nan Cao ,  Lei Shi ,  Jimeng Sun ,  Wei Hong Qian ,  Shixia Liu

Inventor： Nan Cao ,  Lei Shi ,  Jimeng Sun ,  Wei Hong Qian ,  Shixia Liu

IPC: G06F17/30

CPC classification number: G06F17/30601 ,  G06F17/30572

Abstract: The invention provides a method and system for visualization of a data set, the method comprises: dividing the data set into a plurality of information layers based on different information dimensions; and visually processing the plurality of information layers based on different information dimensions, respectively, in order to present respective views of the plurality of information layers. In the present invention, by visualizing the data set through presenting different overviews of the data set from different information dimensions, respectively, the presentation of comprehensive information of the data set to a data set analyst is ensured while distortion of presented contents as well as visual clutter are prevented.

Abstract translation: 本发明提供了一种用于可视化数据集的方法和系统，该方法包括：基于不同的信息维度将数据集划分成多个信息层; 并且分别基于不同的信息维度可视地处理多个信息层，以便呈现多个信息层的各个视图。 在本发明中，通过分别通过从不同的信息维度呈现数据集的不同概况来可视化数据集，确保了数据集分析器的综合信息的呈现，同时呈现内容以及视觉 杂乱无章。

公开(公告)号：US09063126B2

公开(公告)日：2015-06-23

申请号：US12568085

申请日：2009-09-28

Applicant: Michael R. Schrimpf ,  Chih-Hung Lee ,  Tao Li ,  Gregory A. Gfesser ,  Kathleen H. Mortell ,  Ramin Faghih ,  Diana L. Nersesian ,  Kevin B. Sippy ,  William H. Bunnelle ,  Marc Scanio ,  Lei Shi ,  Murali Gopalakrishnan ,  Diana L. Donnelly-Roberts ,  Min Hu

Inventor： Michael R. Schrimpf ,  Chih-Hung Lee ,  Tao Li ,  Gregory A. Gfesser ,  Kathleen H. Mortell ,  Ramin Faghih ,  Diana L. Nersesian ,  Kevin B. Sippy ,  William H. Bunnelle ,  Marc Scanio ,  Lei Shi ,  Murali Gopalakrishnan ,  Diana L. Donnelly-Roberts ,  Min Hu

IPC: A61K31/439 ,  C07D471/08 ,  G01N33/50 ,  C07D471/18 ,  C07D487/10 ,  C07D487/18 ,  G01N33/68

CPC classification number: G01N33/5058 ,  C07D471/18 ,  C07D487/10 ,  C07D487/18 ,  G01N33/6896 ,  G01N2800/28 ,  G01N2800/30

Abstract: The present application relates to indole and indoline derivatives of formula (I), (II), (III), (IV), (V), or (VI) wherein a, R1, R2, R3, R4, R5, U, V, W, X, Y, and Z are as defined in the specification. The present application also relates to compositions comprising such compounds, and methods of treating disease conditions using such compounds and compositions, and methods for identifying such compounds.

Abstract translation: 本申请涉及式（I），（II），（III），（IV），（V）或（VI）的吲哚和二氢吲哚衍生物，其中a，R1，R2，R3，R4，R5， V，W，X，Y和Z如说明书中所定义。 本申请还涉及包含这些化合物的组合物，以及使用这些化合物和组合物治疗疾病状况的方法，以及鉴定这些化合物的方法。