公开(公告)号：US08974214B2

公开(公告)日：2015-03-10

申请号：US13817879

申请日：2011-08-22

申请人： Kenichi Kazama

发明人： Kenichi Kazama

IPC分类号： B29C43/24 ,  B29D7/01 ,  B29C43/46 ,  B29C43/52 ,  B29C43/22 ,  B29C47/00 ,  B29C47/14 ,  B29C47/32 ,  B29C47/88

CPC分类号： B29D7/01 ,  B29C43/22 ,  B29C43/24 ,  B29C43/46 ,  B29C43/52 ,  B29C47/0021 ,  B29C47/004 ,  B29C47/0057 ,  B29C47/14 ,  B29C47/32 ,  B29C47/8805 ,  B29C47/8845 ,  B29C47/8865 ,  B29C47/908 ,  B29C2947/92628 ,  B29C2947/92647 ,  B29C2947/92933

摘要： Provided is a device for manufacturing an optical film having satisfactorily reduced thickness unevenness, by using a melt-casting film forming method, which device includes a casting die for discharging a molten film-forming material including a thermoplastic resin into a film-like shape; a pair of a first rotation roll and a second rotation roll between which the discharged film-shaped molten article is pinched to be cooled and solidified to make the film-shaped molten article; and two pairs of wind shield plates each of which pairs are arranged between the shaft-direction ends of the first and second rotation rolls and an end part in the width-direction of the film-shaped molten article, wherein the wind shield plates are placed approximately perpendicular to the surface of the film-shaped molten article, and wherein each pair of the wind shield plates are placed approximately in parallel.

摘要翻译： 提供一种通过使用熔融流延膜形成方法制造具有令人满意的减小厚度不均匀性的光学膜的装置，该装置包括：用于将包含热塑性树脂的熔融成膜材料排出成膜状的铸模; 一对第一旋转辊和第二旋转辊，排出的膜状熔融制品被夹在其之间以被冷却和固化，以制成膜状熔融制品; 以及两对挡风板，每对挡风板配置在第一旋转辊和第二旋转辊的轴向端部与膜状熔融物品的宽度方向上的端部之间，其中，设置挡风板 大致垂直于膜状熔融制品的表面，并且其中每对挡风板大致平行放置。

公开(公告)号：US08338954B2

公开(公告)日：2012-12-25

申请号：US12858929

申请日：2010-08-18

申请人： Hitoshi Fujiwara ,  Takayasu Horasawa ,  Kenichi Kazama

发明人： Hitoshi Fujiwara ,  Takayasu Horasawa ,  Kenichi Kazama

IPC分类号： H01L29/40

CPC分类号： H01L29/456 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/48744 ,  H01L2924/00 ,  H01L2224/48

摘要： A semiconductor apparatus includes an aluminum electrode film formed on a semiconductor chip; and a nickel plated layer formed on the aluminum electrode film, wherein a concentration of sodium and potassium present in the nickel plated layer and at an interface between the nickel plated layer and the aluminum electrode film is 3.20×1014 atoms/cm2 or less.

摘要翻译： 半导体装置包括形成在半导体芯片上的铝电极膜; 以及在所述铝电极膜上形成的镀镍层，其中存在于所述镀镍层和所述镀镍层与所述铝电极膜之间的界面处的钠和钾的浓度为3.20×1014原子/ cm 2以下。

公开(公告)号：US08324044B2

公开(公告)日：2012-12-04

申请号：US12971173

申请日：2010-12-17

申请人： Kenichi Kazama ,  Tsunehiro Nakajima ,  Koji Sasaki ,  Akio Shimizu ,  Takashi Hayashi ,  Hiroki Wakimoto

发明人： Kenichi Kazama ,  Tsunehiro Nakajima ,  Koji Sasaki ,  Akio Shimizu ,  Takashi Hayashi ,  Hiroki Wakimoto

IPC分类号： H01L21/8249

CPC分类号： H01L29/7393 ,  H01L29/0834 ,  H01L29/41725 ,  H01L29/456 ,  H01L29/66333 ,  H01L29/7395

摘要： A method of producing a semiconductor device that has a silicon substrate including a first major surface and a second major surface thereof, a front surface device structure being formed in a region of the first major surface, the method has a step of forming a rear electrode in a region of the second major surface, which includes evaporating or sputtering aluminum-silicon onto the second major surface to form an aluminum silicon film as a first layer of the rear electrode, the aluminum silicon film having a silicon concentration of at least 2 percent by weight when the thickness thereof is less than 0.3 μm.

摘要翻译： 一种制造半导体器件的方法，所述半导体器件具有包括第一主表面和第二主表面的硅衬底，所述前表面器件结构形成在所述第一主表面的区域中，所述方法具有形成后电极 在第二主表面的区域中，其包括将铝硅蒸发或溅射到第二主表面上以形成作为后电极的第一层的铝硅膜，所述铝硅膜的硅浓度为至少2％ 当其厚度小于0.3μm时。

公开(公告)号：US20100190418A1

公开(公告)日：2010-07-29

申请号：US12693756

申请日：2010-01-26

申请人： Kai YASUOKA ,  Tsuyoshi Shimizu ,  Kenichi Kazama

发明人： Kai YASUOKA ,  Tsuyoshi Shimizu ,  Kenichi Kazama

IPC分类号： B24B37/04 ,  B24B7/04 ,  B24B41/06 ,  B24B53/00 ,  B24B53/12

CPC分类号： B24D7/06 ,  B24B53/013 ,  B24B53/02 ,  B24B53/12

摘要： In a lapping machine comprising a lapping plate and a conditioning carrier disposed thereon, the carrier being provided with bores for receiving conditioning grindstone segments, the lapping plate is polished and conditioned by cooperatively rotating the lapping plate and the carrier and feeding loose abrasive grains to the lapping plate. The conditioning grindstone segment of a shape of arcuated trapezoid having an included angle of 180°-90° is fitted in the carrier bore.

摘要翻译： 在包括研磨板和设置在其上的调理载体的研磨机中，载体设置有用于接收调节磨石段的孔，研磨板通过协同旋转研磨板和载体并将松散的磨粒供给到 研磨盘 具有角度为180°-90°的弧形梯形形状的调节磨石段安装在承载孔中。

公开(公告)号：USD504693S1

公开(公告)日：2005-05-03

申请号：US29171336

申请日：2002-11-21

申请人： Kenichi Kazama

设计人： Kenichi Kazama

公开(公告)号：US08709912B2

公开(公告)日：2014-04-29

申请号：US12937434

申请日：2009-04-15

申请人： Yuichi Urano ,  Kenichi Kazama

发明人： Yuichi Urano ,  Kenichi Kazama

IPC分类号： H01L21/30

CPC分类号： H01L21/6715 ,  H01L21/304 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834

摘要： Even when a substrate for treatment is joined with a supporting substrate having an outer shape larger than that of the substrate for treatment, with a photothermal conversion layer and an adhesive layer interposed, and the surface of the substrate for treatment on the side opposite this joined surface is treated, the occurrence of a defective external appearance on the treatment surface of the substrate for treatment is prevented.An adhesive layer 4 is formed on one surface of a substrate for treatment 3, a photothermal conversion layer 2 is formed on one surface of a supporting substrate 1 having a surface with an outer shape larger than that of the surface of the substrate for treatment, and the substrate for treatment 3 is bonded onto the surface of the photothermal conversion layer 2 with the adhesive layer 4 interposed, to obtain a layered member. This layered member is placed on a spin chuck 9 in a chamber 8 of a spin coater device, an alkaline aqueous solution 11 is dropped onto a portion 2a of the photothermal conversion layer 2 which protrudes from the substrate for treatment, and thereafter cleaning is performed on this portion using a high-pressure cleaning nozzle 12. Then, grinding, wet treatment, or similar treatment is performed on the surface of the substrate for treatment 3, to manufacture a semiconductor device.

摘要翻译： 即使将处理用基板与外部形状大于用于处理的基板的支撑基板接合，也可以将光热转换层和粘合剂层插入，并且与该基板相反的一侧进行处理的基板的表面 表面被处理，防止在用于处理的基板的处理表面上出现有缺陷的外观。 在用于处理的基板3的一个表面上形成粘合剂层4，在具有大于基板表面的表面的表面的支撑基板1的一个表面上形成光热转换层2用于处理， 并且将处理用基板3粘合到光热转换层2的表面上，并粘合层4插入，得到层叠体。 将该分层部件放置在旋涂机装置的室8内的旋转卡盘9上，将碱性水溶液11滴落到从基板突出的光热转换层2的部分2a上进行处理，然后进行清洗 在该部分上使用高压清洁喷嘴12.然后，在用于处理的基板3的表面上进行研磨，湿处理或类似的处理，以制造半导体器件。

公开(公告)号：US20110121360A1

公开(公告)日：2011-05-26

申请号：US12971185

申请日：2010-12-17

申请人： Kenichi KAZAMA ,  Tsunehiro NAKAJIMA ,  Koji SASAKI ,  Akio SHIMIZU ,  Takashi HAYASHI ,  Hiroki WAKIMOTO

发明人： Kenichi KAZAMA ,  Tsunehiro NAKAJIMA ,  Koji SASAKI ,  Akio SHIMIZU ,  Takashi HAYASHI ,  Hiroki WAKIMOTO

IPC分类号： H01L29/739

CPC分类号： H01L29/7393 ,  H01L29/0834 ,  H01L29/41725 ,  H01L29/456 ,  H01L29/66333 ,  H01L29/7395

摘要： A semiconductor device includes a silicon substrate having a first major surface and a second major surface opposite to the first major surface, a drift layer and a collector layer formed in sequence in the silicon substrate from the first major surface, and an aluminum silicon film formed on the second major surface. The drift layer is of a first conductivity type, and is surrounded by a semiconductor layer of a second conductivity type including the collector layer.

摘要翻译： 半导体器件包括具有第一主表面和与第一主表面相对的第二主表面的硅衬底，从第一主表面依次形成在硅衬底中的漂移层和集电极层，以及形成铝硅膜 在第二个主要表面。 漂移层是第一导电类型，并被包括集电极层的第二导电类型的半导体层围绕。

公开(公告)号：US20070004098A1

公开(公告)日：2007-01-04

申请号：US11454121

申请日：2006-06-16

申请人： Kenichi Kazama ,  Tsunehiro Nakajima ,  Koji Sasaki ,  Akio Shimizu ,  Takashi Hayashi ,  Hiroki Wakimoto

发明人： Kenichi Kazama ,  Tsunehiro Nakajima ,  Koji Sasaki ,  Akio Shimizu ,  Takashi Hayashi ,  Hiroki Wakimoto

IPC分类号： H01L21/20

CPC分类号： H01L29/7393 ,  H01L29/0834 ,  H01L29/41725 ,  H01L29/456 ,  H01L29/66333 ,  H01L29/7395

摘要： A method of producing a semiconductor device having a thickness of 90 μm to 200 μm and with an electrode on the rear surface, which achieves a high proportion of non-defective devices by optimizing the silicon concentration and thickness of the aluminum-silicon electrode. A surface device structure is formed on a first major surface of a silicon substrate. A buffer layer and a collector layer are formed on the second major surface after grinding to reduce the thickness of the substrate. On the collector layer, a collector electrode is formed including a first layer of an aluminum-silicon film having a thickness of 0.3 μm to 1.0 μm and a silicon concentration of 0.5 percent to 2 percent by weight, preferably not more than 1 percent by weight.

摘要翻译： 一种制造厚度为90μm至200μm的半导体器件的方法，并且在后表面上具有电极，其通过优化铝硅电极的硅浓度和厚度来实现高比例的无缺陷器件。 在硅衬底的第一主表面上形成表面器件结构。 在研磨后的第二主表面上形成缓冲层和集电体层，以减小基板的厚度。 在集电体层上形成集电极，其包括厚度为0.3〜1.0μm的硅铝膜的第1层，硅浓度为0.5〜2重量％，优选为1重量％以下 。

公开(公告)号：USD487279S1

公开(公告)日：2004-03-02

申请号：US29171335

申请日：2002-11-21

申请人： Kenichi Kazama

设计人： Kenichi Kazama

公开(公告)号：US06468138B1

公开(公告)日：2002-10-22

申请号：US09345897

申请日：1999-07-01

申请人： Noukou Toyama ,  Kenichi Kazama

发明人： Noukou Toyama ,  Kenichi Kazama

IPC分类号： B24B100

CPC分类号： B41N3/003 ,  B24B29/04 ,  B24D3/28 ,  B24D13/14 ,  B41N3/04

摘要： A porous, roll-grinding tool has an abrasive surface which is adapted to contact and grind the surface of a roll and configured to a planar polygonal shape having 4 to 20 sides. Using the grinding tool, a roll can be ground within a satisfactory dimensional tolerance, with feed marks crossing the circumferential direction of the roll at a small feed mark pitch inclination angle, so that no streaky printing defects will be produced when the ground roll is used in printing.

摘要翻译： 多孔的滚动研磨工具具有研磨表面，其适于接触和研磨辊的表面并且被配置成具有4至20个侧面的平面多边形形状。 使用研磨工具，辊可以在令人满意的尺寸公差内被研磨，其中进给标记以小的进给标记间距倾斜角与辊的圆周方向交叉，使得当使用地面辊时不会产生条纹印刷缺陷 在打印。