Abstract:
A heat sink is configured to support an edge of a circuit card. The heat sink comprises a thermally conductive base, a plurality of thermally conductive heat dissipating fins extending from the base, and one or more recesses at least partially defined by at least one of the fins or by the base. The recesses are configured to support the edge of the circuit card.
Abstract:
A computer subassembly is configured to be mounted within a rack along an insertion axis. The computer subassembly includes a chassis configured for insertion into and removal from the rack along the insertion axis, wherein the chassis at least partially defines an interior. An interconnect assembly is mounted within or adjacent the interior of the chassis, and the interconnect assembly is oriented along a plane that is substantially parallel to the insertion axis. At lease one circuit assembly is positioned at least partially within the interior of the chassis and is connected to the interconnect assembly. The circuit assembly is oriented in a plane substantially parallel to the insertion axis. A source of cooling air is positioned to direct cooling air through the interior of the chassis along the insertion axis.
Abstract:
A computer system is provided with a rack defining an interior. A computer chassis is mounted at least partially within the interior of the rack, wherein the computer chassis defines an interior. An interconnect assembly is mounted at least partially within the interior of the rack, wherein the interconnect assembly has an interconnect connector. A processor assembly is mounted at least partially within the interior of the computer chassis, and the processor assembly has a processor board and a processor connector mounted to the processor board and connected to the interconnect connector of the interconnect assembly. The processor assembly also has at least eight addressable processor segments mounted to the processor board.
Abstract:
An apparatus and method are provided for dissipating heat from an electronic component mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. A heat sink is configured to be mounted in thermal contact with the electronic component. An electrical conductor is operatively connected to the heat sink and configured to provide electrical contact between the heat sink and a surface of the conductive enclosure, thereby at least partially shielding the electromagnetic radiation generated by the electronic component.
Abstract:
A computer system is provided. The computer system includes a computer chassis at least partially defining an interior. The computer system also includes a module configured for movement with respect to the computer chassis along an insertion axis between a retracted position substantially within the interior of the computer chassis and an extended position at least partially withdrawn from the interior of the chassis. The module includes a housing configured to extend within the interior of the chassis. The housing includes a body portion configured to move with respect to the computer chassis along the insertion axis, and a pivoting portion coupled to the body portion to pivot between a retracted position substantially aligned along the insertion axis and an extended position oriented at an angle with respect to the insertion axis.
Abstract:
An electrical connector is provided which can releasably engage a circuit card within a slot defined by the electrical connector. A camming mechanism is provided which includes a cover having a series of follower surfaces for cooperating with a corresponding series of camming surfaces and recesses associated with a pin holder. Longitudinal movement of the cover causes the cooperating surfaces to spread open card edge receiving portions of the slot, or to close down over the portions of the circuit card to be engaged. The electrical connector preferably has an opening in one end to allow a circuit card to enter the slot from the side, allowing circuit cards to be removed from or installed in a rack, frame or other chassis from the side.
Abstract:
A computer system is provided having a chassis at least partially defining an interior and an access opening. The interior of the chassis accommodates a connector that is oriented for connection along an insertion axis. The computer system also includes a subassembly configured for insertion into and removal from the interior of the chassis through the access opening along the insertion axis. The subassembly has a subassembly connector oriented for connection with the connector in the chassis along the insertion axis. The computer system also includes a mounting assembly configured for engaging the subassembly at least partially within the interior of the chassis and for connecting the connector in the chassis to the subassembly connector.
Abstract:
A connection assembly for providing interconnection between a computer processor assembly and a module is provided. The connection assembly includes a flex circuit having signal paths for communication between the computer processor assembly and the module. The connection assembly also includes a connector coupled to an end portion of the flex circuit and configured to connect to the computer processor assembly. The connection assembly also includes another connector coupled to an opposite end portion of the flex circuit and is configured to connect to the module. The flex circuit is configured to facilitate movement of the module with respect to the computer processor assembly, the flex circuit having a retracted position with the module proximate to the computer processor assembly and an extended position with the module spaced from the computer processor assembly.
Abstract:
A modular chassis assembly is provided, including a chassis defining an access opening, an arm having a distal end portion coupled to the chassis and a proximal end portion spaced from the distal end portion, and a modular component coupled to the proximal end portion of the arm and configured for insertion into the chassis along an insertion axis. The arm is configured to facilitate displacement of the modular component along the insertion axis and movement of the modular component at an angle to the insertion axis, thereby at least partially facilitating access to the chassis through the access opening.
Abstract:
Memory module adapters and methods for connecting memory modules to computing systems are disclosed. The memory module adapter includes memory connectors, a multi-memory connector, and a support that supports the memory connectors and multi-memory connector. The memory connectors are electrically connected to the multi-memory connector. Memory modules are connected to a computing system by inserting the memory modules along a first insertion axis into a memory connector of a memory module adapter and inserting the memory module adapter along a second insertion axis to a platform connector of a computing platform within the computing system.