公开(公告)号：US06826055B2

公开(公告)日：2004-11-30

申请号：US10390876

申请日：2003-03-17

Applicant: Keith D. Mease ,  Sean M. McClain ,  Norman K. Newman

Inventor： Keith D. Mease ,  Sean M. McClain ,  Norman K. Newman

IPC: H05K716

CPC classification number: G06F1/185 ,  G06F1/184 ,  G06F1/186

Abstract: A computer system is provided. The computer system includes a computer chassis at least partially defining an interior. The computer system also includes a module configured for movement with respect to the computer chassis along an insertion axis between a retracted position substantially within the interior of the computer chassis and an extended position at least partially withdrawn from the interior of the chassis. The module includes a housing configured to extend within the interior of the chassis. The housing includes a body portion configured to move with respect to the computer chassis along the insertion axis, and a pivoting portion coupled to the body portion to pivot between a retracted position substantially aligned along the insertion axis and an extended position oriented at an angle with respect to the insertion axis.

Abstract translation: 提供计算机系统。 计算机系统包括至少部分地限定内部的计算机机箱。 计算机系统还包括一个模块，该模块被配置成沿着插入轴线在基本上位于计算机机箱内部的缩回位置和至少部分地从底盘内部撤回的延伸位置之间相对于计算机机架移动。 该模块包括被配置为在底盘的内部延伸的壳体。 壳体包括构造成沿着插入轴线相对于计算机机架移动的主体部分，以及枢转部分，其联接到主体部分，以在沿着插入轴线大致对准的缩回位置与以一定角度定向的延伸位置 相对于插入轴。

公开(公告)号：US06769920B1

公开(公告)日：2004-08-03

申请号：US10390367

申请日：2003-03-17

Applicant: Keith D. Mease ,  Sean M. McClain ,  Frank J Campisi ,  Norman K Newman

Inventor： Keith D. Mease ,  Sean M. McClain ,  Frank J Campisi ,  Norman K Newman

IPC: H01R1200

CPC classification number: H05K1/028 ,  G06F1/18 ,  G06F1/183 ,  H01R12/592 ,  H05K2201/2027

Abstract: A connection assembly for providing interconnection between a computer processor assembly and a module is provided. The connection assembly includes a flex circuit having signal paths for communication between the computer processor assembly and the module. The connection assembly also includes a connector coupled to an end portion of the flex circuit and configured to connect to the computer processor assembly. The connection assembly also includes another connector coupled to an opposite end portion of the flex circuit and is configured to connect to the module. The flex circuit is configured to facilitate movement of the module with respect to the computer processor assembly, the flex circuit having a retracted position with the module proximate to the computer processor assembly and an extended position with the module spaced from the computer processor assembly.

Abstract translation: 提供了一种用于在计算机处理器组件和模块之间提供互连的连接组件。 连接组件包括具有用于计算机处理器组件和模块之间的通信的信号路径的柔性电路。 连接组件还包括耦合到柔性电路的端部并被配置为连接到计算机处理器组件的连接器。 连接组件还包括耦合到柔性电路的相对端部的另一连接器，并被配置为连接到模块。 柔性电路被配置为有助于模块相对于计算机处理器组件的移动，柔性电路具有缩回位置，模块靠近计算机处理器组件，并且具有模块与计算机处理器组件间隔开的延伸位置。

公开(公告)号：US07342794B1

公开(公告)日：2008-03-11

申请号：US10651115

申请日：2003-08-28

Applicant: Keith D. Mease ,  Sean M. McClain

Inventor： Keith D. Mease ,  Sean M. McClain

IPC: H05K7/20 ,  H05K7/18 ,  F28F7/00 ,  H01L23/34

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K7/1418 ,  H05K7/205 ,  H05K7/20545 ,  H01L2924/00

Abstract: A heat sink is configured to support an edge of a circuit card. The heat sink comprises a thermally conductive base, a plurality of thermally conductive heat dissipating fins extending from the base, and one or more recesses at least partially defined by at least one of the fins or by the base. The recesses are configured to support the edge of the circuit card.

Abstract translation: 散热器被配置为支撑电路卡的边缘。 散热器包括导热基座，从基座延伸的多个导热散热翅片，以及至少部分地由翅片中的至少一个或底座限定的一个或多个凹部。 凹槽配置成支撑电路卡的边缘。

公开(公告)号：US07394652B1

公开(公告)日：2008-07-01

申请号：US11540462

申请日：2006-09-29

Applicant: Daniel A. Jochym ,  Sean M. McClain ,  Mark W. Wessel ,  Kenneth J. Neeld ,  Keith D. Mease

Inventor： Daniel A. Jochym ,  Sean M. McClain ,  Mark W. Wessel ,  Kenneth J. Neeld ,  Keith D. Mease

IPC: G06F1/16

CPC classification number: G06F1/185

Abstract: Card adapter modules and methods for connecting peripheral cards to computing systems are disclosed. The card adapter modules each include a card connector, a peripheral connector, and a housing that supports the card connector and peripheral connector. A peripheral card is connected to a computing system having a chassis with an input/output slot by inserting the peripheral card along a first insertion axis (y-axis) into a card connector of a card adapter module and inserting the card adapter module along a second insertion axis (x-axis) extending through the input/output slot to a platform connector of a computing platform within the computing system. The card connector is electrically connected to the peripheral connector.

Abstract translation: 公开了用于将外围卡连接到计算系统的卡适配器模块和方法。 卡适配器模块各自包括卡连接器，外围连接器和支撑卡连接器和外围连接器的外壳。 通过将外围卡沿着第一插入轴（y轴）插入到卡适配器模块的卡连接器中，将外围卡连接到具有带有输入/输出槽的机架的计算系统，并将卡适配器模块沿着 第二插入轴（x轴）延伸穿过输入/输出槽到计算系统内的计算平台的平台连接器。 卡连接器电连接到外围连接器。

公开(公告)号：US06870743B2

公开(公告)日：2005-03-22

申请号：US10390355

申请日：2003-03-17

Applicant: Keith D. Mease ,  Sean M. McClain ,  Joseph J. Scorsone ,  Daniel A. Jochym ,  David H. Chase

Inventor： Keith D. Mease ,  Sean M. McClain ,  Joseph J. Scorsone ,  Daniel A. Jochym ,  David H. Chase

IPC: G06F1/18 ,  H05K7/14 ,  H05K5/00

CPC classification number: H05K7/1488 ,  G06F1/18 ,  H05K7/1445

Abstract: A computer module for use in a scalable computer system is provided. The computer module includes a chassis at least partially defining an interior and a processor board configured for insertion into a processor region of the interior of the chassis along an insertion axis. The processor board includes at least one connector for communicating signals to and from the processor board. The connector of the processor board is oriented along a connection axis that is substantially perpendicular to the insertion axis. The computer module also includes a memory board configured for insertion into a memory region of the interior of the chassis along the insertion axis. The memory board includes at least one connector for communicating signals to and from the memory board. The connector of the memory board is oriented along the connection axis.

Abstract translation: 提供了一种用于可扩展计算机系统的计算机模块。 计算机模块包括至少部分地限定内部的底盘和被配置成沿插入轴插入到底盘的内部的处理器区域中的处理器板。 处理器板包括用于向处理器板传送信号和从处理器板传送信号的至少一个连接器。 处理器板的连接器沿着基本上垂直于插入轴线的连接轴线定向。 计算机模块还包括被配置为沿着插入轴线插入到底盘的内部的存储器区域中的存储器板。 存储器板包括至少一个用于将信号传送到存储器板和从存储器板传送信号的连接器。 存储器板的连接器沿着连接轴定向。

公开(公告)号：US07504904B1

公开(公告)日：2009-03-17

申请号：US11397156

申请日：2006-04-04

Applicant: Scott Powers ,  Sean M. McClain ,  Ernest B. Bogusch

Inventor： Scott Powers ,  Sean M. McClain ,  Ernest B. Bogusch

IPC: H01P3/08

CPC classification number: H01P3/081 ,  H05K1/0224 ,  H05K1/0253 ,  H05K2201/09236 ,  H05K2201/09681

Abstract: A printed circuit laminate is provided comprising at least one conductor trace for carrying forward electrical signals in a first direction of signal propagation. The printed circuit laminate also comprises a mesh reference plane, spaced from the at least one conductor trace, for carrying return electrical signals in a second direction. The mesh reference plane defines a plurality of cells. Each cell of the plurality of cells includes at least one axis of repetition. The plurality of cells are configured so that all of the axes of repetition of each cell are different from the first direction of signal propagation. Furthermore, the frequency of cell repetition along the first direction of signal propagation is chosen to reduce differences in transmission line impedance between any two conductors on the same laminate or any two conductors on different laminates.

Abstract translation: 提供了印刷电路层压板，其包括至少一个导体迹线，用于在信号传播的第一方向上传送电信号。 印刷电路层压板还包括与至少一个导体迹线间隔开的用于在第二方向上传送返回电信号的网格参考平面。 网格参考平面定义多个单元。 多个单元中的每个单元包括至少一个重复轴。 多个单元被配置为使得每个单元的所有重复轴不同于信号传播的第一方向。 此外，选择沿着信号传播的第一方向的单元重复的频率以减少同一层压板上的任何两个导体与不同层压板上的任何两个导体之间的传输线阻抗的差异。

公开(公告)号：US6123251A

公开(公告)日：2000-09-26

申请号：US439754

申请日：1999-11-15

Applicant: Sean M. McClain ,  Vladimir K. Tamarkin

Inventor： Sean M. McClain ,  Vladimir K. Tamarkin

IPC: B23K3/06 ,  H05K3/34 ,  B23K31/02 ,  B23K35/14 ,  B23K35/38 ,  H05B1/00

CPC classification number: H05K3/3468 ,  B23K3/0653 ,  H05K2203/0763 ,  H05K2203/304 ,  H05K3/3447

Abstract: A solder head is adapted to direct the flow of solder from a solder fountain. The solder head includes a wall forming a passage through which solder can flow upwardly and having an edge portion over which solder can flow from the passage. The solder head also includes a shield connected to the wall. The shield and the wall at least partially define an overflow passage through which solder can flow downwardly. The shield is configured to prevent contact between solder and an electronic component adjacent the solder head. Corresponding soldering systems and soldering methods are also provided.

Abstract translation: 焊头适于引导焊料从焊料喷嘴的流动。 焊头包括形成通道的壁，焊料可以通过该通道向上流动并且具有边缘部分，焊料可以从该通道流过。 焊头还包括连接到墙壁的屏蔽。 屏蔽件和壁至少部分地限定了一个溢流通道，焊料可以通过该通道向下流动。 屏蔽被配置为防止焊料和邻近焊料头的电子部件之间的接触。 还提供了相应的焊接系统和焊接方法。