公开(公告)号：US20150034369A1

公开(公告)日：2015-02-05

申请号：US14130741

申请日：2012-07-03

Applicant: Naoki Kashima ,  Keiichi Hasebe ,  Seiji Shika ,  Yoshinori Mabuchi ,  Yoshihiro Kato

Inventor： Naoki Kashima ,  Keiichi Hasebe ,  Seiji Shika ,  Yoshinori Mabuchi ,  Yoshihiro Kato

IPC: H05K1/03 ,  H05K1/02 ,  H05K3/07 ,  H05K3/02 ,  H05K3/18 ,  H05K3/10

CPC classification number: H05K1/0373 ,  C08G59/40 ,  C08G59/4014 ,  C08G73/0655 ,  C08J5/24 ,  C08J2379/04 ,  C08J2463/00 ,  C08K3/013 ,  C08K3/22 ,  C08K3/36 ,  C08K5/29 ,  C08K5/3415 ,  C08L63/00 ,  C08L79/04 ,  C08L79/085 ,  H05K1/0296 ,  H05K1/0366 ,  H05K3/0055 ,  H05K3/022 ,  H05K3/07 ,  H05K3/108 ,  H05K3/182 ,  H05K3/188 ,  H05K3/381 ,  H05K3/4676 ,  H05K2203/0773 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K2203/1152 ,  Y10T428/24355 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/31529

Abstract: Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin.

Abstract translation: 提供一种树脂组合物，其可以在绝缘层上使用时在印刷线路板材料的绝缘层的表面上形成具有低粗糙度的粗糙化表面，而不管所用的粗糙度条件如何，并且还可以形成 导电层具有优异的粘附性，耐热性，吸湿下的耐热性，在粗糙化表面上的热膨胀特性和耐化学性。 一种树脂组合物，其包含（A）可溶于酸的无机填料，（B）氰酸酯化合物和（C）环氧树脂。

公开(公告)号：US20130040517A1

公开(公告)日：2013-02-14

申请号：US13643355

申请日：2012-03-02

Applicant: Takabumi Oomori ,  Keiichi Hasebe

Inventor： Takabumi Oomori ,  Keiichi Hasebe

IPC: C08L79/08 ,  B32B15/08 ,  H05K1/03 ,  B32B5/02

CPC classification number: H01B3/306 ,  B32B5/022 ,  B32B5/024 ,  B32B15/08 ,  B32B15/088 ,  B32B2305/076 ,  B32B2457/08 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1071 ,  C08J5/24 ,  C08J2300/24 ,  C08J2379/08 ,  C08J2400/24 ,  C08J2479/08 ,  C08K3/012 ,  C08L79/08 ,  C08L101/00 ,  H01B3/307 ,  H01B3/40 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/0209 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T442/20 ,  H01L2924/00

Abstract: A resin composition is provided which comprises a polyimide resin, a thermosetting resin, and a filler, the polyimide resin containing a first repeat unit represented by formula (I) and a second repeat unit represented by formula (II) or (III), wherein when the second repeat unit is represented by formula (II), the ratio of the second repeat unit to the polyimide resin is between 5 and 35 mol %, and when the second repeat unit is represented by formula (III), the ratio of the second repeat unit to the polyimide resin is between 5 and 80 mol %.

Abstract translation: 提供一种树脂组合物，其包含聚酰亚胺树脂，热固性树脂和填料，所述聚酰亚胺树脂含有由式（I）表示的第一重复单元和由式（II）或（III）表示的第二重复单元，其中 当第二重复单元由式（II）表示时，第二重复单元与聚酰亚胺树脂的比率为5-35mol％，当第二重复单元由式（III）表示时， 聚酰亚胺树脂的第二重复单元为5-80摩尔％。