Method for analyzing electrolytic copper plating solution
    1.
    发明授权
    Method for analyzing electrolytic copper plating solution 有权
    电解镀铜液分析方法

    公开(公告)号:US08440555B2

    公开(公告)日:2013-05-14

    申请号:US12903090

    申请日:2010-10-12

    IPC分类号: H01L21/20

    CPC分类号: C25D21/12 G01N27/42

    摘要: Effective fillability and the uniformity electrodeposition of a copper electroplating solution is judged by determining the time-dependent potential change thereof at a cathode current density of 0.1-20 A/dm2. The potential change is determined at a working electrode rotation of 100-7500 rpm, and the fillability with the solution is judged from the curve profile. In an embodiment of the present invention, the fillability is judged by obtaining the potential change speed in the initial stage of electrolysis and the potential convergent point from the time-dependent potential change curve for a predetermined period of time after the start of the electrolysis.

    摘要翻译: 通过在0.1-20A / dm 2的阴极电流密度下确定其时间依赖的电位变化来判断铜电镀溶液的有效填充性和均匀性电沉积。 在100-7500rpm的工作电极旋转下确定电位变化,并根据曲线轮廓判断溶液的填充性。 在本发明的一个实施例中,通过在电解开始之后的预定时间段内从时间依赖电位变化曲线获得电解初始阶段的电位变化速度和电位收敛点来判断可填充性。

    Method for analyzing copper electroplating solution, apparatus for the analysis, and method for fabricating semiconductor product
    2.
    发明授权
    Method for analyzing copper electroplating solution, apparatus for the analysis, and method for fabricating semiconductor product 有权
    铜电镀液分析方法,分析装置及制造半导体产品的方法

    公开(公告)号:US07820535B2

    公开(公告)日:2010-10-26

    申请号:US10550153

    申请日:2004-03-23

    IPC分类号: H01L21/20

    CPC分类号: C25D21/12 G01N27/42

    摘要: Effective fillability and the uniformity electrodeposition of a copper electroplating solution is judged by determining the time-dependent potential change thereof at a cathode current density of 0.1-20 A/dm2. The potential change is determined at a working electrode rotation of 100-7500 rpm, and the fillability with the solution is judged from the curve profile. The time-dependent potential change curve within a predetermined period of time after the start of electrolysis is approximated according to the Boltzmann's function, and the potential change speed dx and the potential convergent point A2 are obtained to judge the fillability with a plating solution.

    摘要翻译: 通过在0.1-20A / dm 2的阴极电流密度下确定其时间依赖性电位变化来判断铜电镀溶液的有效填充性和均匀性电沉积。 在100-7500rpm的工作电极旋转下确定电位变化,并根据曲线轮廓判断溶液的填充性。 在电解开始之后的预定时间段内的时间依赖电位变化曲线根据波尔兹曼函数近似,并且获得电位变化速度dx和电位收敛点A2,以判断电镀溶液的填充性。

    METHOD FOR ANALYZING ELECTROLYTIC COPPER PLATING SOLUTION
    3.
    发明申请
    METHOD FOR ANALYZING ELECTROLYTIC COPPER PLATING SOLUTION 有权
    分析电解铜溶液的方法

    公开(公告)号:US20110025294A1

    公开(公告)日:2011-02-03

    申请号:US12903090

    申请日:2010-10-12

    IPC分类号: G01N27/00

    CPC分类号: C25D21/12 G01N27/42

    摘要: Effective fillability and the uniformity electrodeposition of a copper electroplating solution is judged by determining the time-dependent potential change thereof at a cathode current density of 0.1-20 A/dm2. The potential change is determined at a working electrode rotation of 100-7500 rpm, and the fillability with the solution is judged from the curve profile. In an embodiment of the present invention, the fillability is judged by obtaining the potential change speed in the initial stage of electrolysis and the potential convergent point from the time-dependent potential change curve for a predetermined period of time after the start of the electrolysis.

    摘要翻译: 通过在0.1-20A / dm 2的阴极电流密度下确定其时间依赖性电位变化来判断铜电镀溶液的有效填充性和均匀性电沉积。 在100-7500rpm的工作电极旋转下确定电位变化,并根据曲线轮廓判断溶液的填充性。 在本发明的一个实施例中,通过在电解开始之后的预定时间段内从时间依赖电位变化曲线获得电解初始阶段的电位变化速度和电位收敛点来判断可填充性。

    Method for analyzing electrolytic copper plating solution, and analyzing device therefor and production method for semi-conductor product
    4.
    发明申请
    Method for analyzing electrolytic copper plating solution, and analyzing device therefor and production method for semi-conductor product 有权
    电解铜电镀液分析方法及其分析装置及半导体制品的制造方法

    公开(公告)号:US20060183257A1

    公开(公告)日:2006-08-17

    申请号:US10550153

    申请日:2004-03-23

    IPC分类号: H01L21/66 H01L21/44

    CPC分类号: C25D21/12 G01N27/42

    摘要: Effective fillability and the uniformity electrodeposition of a copper electroplating solution is judged by determining the time-dependent potential change thereof at a cathode current density of 0.1-20 A/dm2. The potential change is determined at a working electrode rotation of 100-7500 rpm, and the fillability with the solution is judged from the curve profile. The time-dependent potential change curve within a predetermined period of time after the start of electrolysis is approximated according to the Boltzmann's function, and the potential change speed dx and the potential convergent point A2 are obtained to judge the fillability with a plating solution.

    摘要翻译: 通过在0.1-20A / dm 2的阴极电流密度下确定其依赖于电位的变化来判断铜电镀溶液的有效填充性和均匀性电沉积。 在100-7500rpm的工作电极旋转下确定电位变化,并根据曲线轮廓判断溶液的填充性。 在电解开始之后的预定时间段内的时间依赖电位变化曲线根据玻尔兹曼函数近似,并且获得电位变化速度dx和电位收敛点A <2>,以判断 电镀溶液的填充性。